Microsystem Technologies

Special issue on design, test, integration and packaging of MEMS/MOEMS, 2012

• Editorial

Flexible integration of MEMS and IC for low-cost production of wireless sensor nodes

• Technical Paper

Jian Lu, Hideki Takagi, Yuta Nakano, Ryutaro Maeda

Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

• Technical Paper

S. Costello, N. Strusevich, D. Flynn, R. W. Kay, M. K. Patel, C. Bailey, D. Price, M. Bennet, A. C. Jones, M. P. Y. Desmulliez

Fabrication of a low temperature co-fired ceramic package using powder blasting technology

• Technical Paper

Yves Lacrotte, John P. Carr, Robert W. Kay, Marc P. Y. Desmulliez

Lamination based embossing technique for LTCC

• Technical Paper

Stefan P. Wilhelm, Robert W. Kay, Mazher I. Mohammed, Yves Lacrotte, Marc P. Y. Desmulliez

The manufacturing of packaged capillary action microfluidic systems by means of CO2 laser processing

• Technical Paper

M. I. Mohammed, M. P. Y. Desmulliez

Alternative technology used to manufacture semitransparent monocrystalline silicon solar cells

• Technical Paper

Enikő Bándy, Márta Rencz

Development of local ambient gas control technologies for atmospheric MEMS process

• Technical Paper

Teruki Naito, Nobuaki Konno, Takashi Tokunaga, Toshihiro Itoh

Semitransparent monocrystalline solar cells manufactured by laser cutting and anisotropic etching

• Technical Paper

Enikő Bándy, Árpád Földváry, János Mizsei

Smoothing and surface planarization of sacrificial layers in MEMS technology

• Technical Paper

Andrea Lucibello, Emanuela Proietti, Romolo Marcelli, Giancarlo Bartolucci

A patterning technique of lead zirconate titanate thin film by ultraviolet-light

• Technical Paper

Chia-Che Wu, Chun-Hung Hsueh, Ya-Ting Chang, Chueh-Tang Chang, Kuan-Jung Chung

Asymmetric focusing microlens array fabricated using off-axis lithography

• Technical Paper

Tung-Yu Chang, Chien-Hsin Hung, Po-Sen Chang, Mao-Hsun Yeh, Hsiharng Yang

Modeling the front side plasmonics effect in nanotextured silicon surface for thin film solar cells application

• Technical Paper

Pushpa Raj Pudasaini, Arturo A. Ayon

Electromagnetic MEMS microspeaker for portable electronic devices

• Technical Paper

Iman Shahosseini, Elie Lefeuvre, Johan Moulin, Marion Woytasik, Emile Martincic, Gaël Pillonnet, Guy Lemarquand

SmCo micromolding in an aqueous electrolyte

• Technical Paper

K. Chouarbi, M. Woytasik, E. Lefeuvre, J. Moulin

Micropatterning PEDOT:PSS layers

• Technical Paper

Benoît Charlot, Gilbert Sassine, Alexandra Garraud, Brice Sorli, Alain Giani, Philippe Combette

ProTEK PSB coating as an alternative polymeric protection mask for KOH bulk etching of silicon

• Technical Paper

Rosminazuin Ab Rahim, Badariah Bais, Burhanuddin Yeop Majlis, Gandi Sugandi

Simulation and experimental analysis of thermo-mechanical behavior of microresonators under dynamic loading

• Technical Paper

Marius Pustan, Corina Birleanu, Cristian Dudescu

Passive piezoelectric single-side MEMS DC current sensor with five parallel PZT plates applicable to two-wire DC electric appliances without using cord separator

• Technical Paper

Dong F. Wang, Kohei Isagawa, Takeshi Kobayashi, Toshihiro Itoh, Ryutaro Maeda

RF MEMS switches fabrication by using SU-8 technology

• Technical Paper

Andrea Lucibello, Emanuela Proietti, Flavio Giacomozzi, Romolo Marcelli, Giancarlo Bartolucci, Giorgio De Angelis

Measurement and control of the ion diffusion coefficient in a nanochannel

• Technical Paper

Yu-Tze Tsai, Kang J. Chang, Gou-Jen Wang

Dielectrophoresis measurement of bovine endothelial cells adhesion on different materials

• Technical Paper

Yi-Wei Lin, Gou-Jen Wang