Zum Inhalt

Microsystem Technologies

Ausgabe 6/2017 Part II of the Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014), held in Kenting, Taiwan Oct 31–Nov 2, 2014

Inhalt (70 Artikel)

High resolution topography utilizing a line scan stereo vision technique

  • Technical Paper

Po-Cheng Chen, Ming Chang, Jacque Lynn Gabayno, Xiangning Wang, Xiaojun Liu

Fabrication of microfluidic structures in quartz via micro machining technologies

  • Technical Paper

Ying-Chieh Lin, Chung-Ching Lee, Heng-Sheng Lin, Zheng-Han Hong, Fu-Chuan Hsu, Tsung-Pin Hung, Yu-Ting Lyu

Ultrasonic assisted thermoforming for rapid fabrication of a microspeaker diaphragm

  • Technical Paper

Ho-Jin Bae, Hyun-Joong Lee, Keun Park

Experiment study of laser thermal enhanced electrochemical deposition

  • Technical Paper

Zhaoyang Zhang, Yujia Jiang, Lei Huang, Xin Nie, Gao Liu

Fabrication of ultra-high-sensitivity flexible strain sensor based on single ZnO nanowire

  • Technical Paper

Hao Zhao, Xiaojun Liu, Liangzhou Chen, Suping Chang, Ming Chang

Characteristic studies of a novel piezoelectric impedance micropump

  • Technical Paper

Chiang-Ho Cheng, An-Shik Yang, Chih-Jer Lin, Wei-Jui Huang

A model for the metal deposition process

  • Technical Paper

Bo Wun Huang, Wen-Ye Huang, Nan-Wem Lin

A single asperity sliding contact model for molecularly thin lubricant

  • Technical Paper

Youfeng Zhang, Andreas A. Polycarpou

Generalized fractional magneto-thermo-viscoelasticity

  • Technical Paper

Magdy A. Ezzat, Alaa A. El-Bary

MEMS based vacuum packaging method of optically readable infrared focal plane array

  • Technical Paper

Fei Feng, Yunsheng Zhang, Fan Luo, Xudong Wei, Xiaohong Ge, Yuelin Wang, Xinxin Li

Silicon tip sharpening based on thermal oxidation technology

  • Technical Paper

Huan He, Jinying Zhang, Jinling Yang, Fuhua Yang

Free transverse vibration analysis of size dependent Timoshenko FG cracked nanobeams resting on elastic medium

  • Technical Paper

Mahdi Soltanpour, Majid Ghadiri, Ali Yazdi, Mohsen Safi

High precision tracking of a piezoelectric positioner using a discrete-time sliding mode control

  • Technical Paper

Geng Wang, Yanru Zhao, Yeming Zhang, Chunchao Chen

Distilling determination of water content in hydraulic oil with a ZnO/glass surface acoustic wave device

  • Technical Paper

Zebing Mao, Jiuxuan Zhao, Weipeng Xuan, Wenbo Wang, Jikui Luo, Jin Xie

A flexible three-axial capacitive tactile sensor with multilayered dielectric for artificial skin applications

  • Technical Paper

Ying Huang, Haitao Yuan, Wenqing Kan, Xiaohui Guo, Caixia Liu, Ping Liu

A small size Ka band six-bit DMTL phase shifter using new design of MEMS switch

  • Technical Paper

Saied Afrang, Keyvan Samandari, Ghader Rezazadeh

Stress reduction method in fabrication of a multi-scale inertial switch with ultra-high aspect ratio

  • Technical Paper

Liqun Du, Shengli Chen, Yousheng Tao, Lei Luo, Ming Zhao, Tong Yang, Shuangjie Liu, Yongping Hao

The fabrication and rapid replication of WR-10 filter with NOA73 materials

  • Technical Paper

Xueli Nan, Binzhen Zhang, Xin Yang, Jianli Cui, Shaolei Ge

Gas-assisted microstructure elastic multiform UV imprint replication molding technology

  • Technical Paper

Cheng-Chang Lien, Yung-Jin Weng, Chun-Yu Tsai, Shih-Hsuan Wu

Nonlinear dynamics of MEMS/NEMS resonators: analytical solution by the homotopy analysis method

  • Technical Paper

Farid Tajaddodianfar, Mohammad Reza Hairi Yazdi, Hossein Nejat Pishkenari

A thermal-calorimetric gas flow meter with improved isolating feature

  • Technical Paper

Yousef Valizadeh Yaghmourali, Nima Ahmadi, Ebrahim Abbaspour-sani

PMMA microfluidic chip fabrication using laser ablation and low temperature bonding with OCA film and LOCA

  • Technical Paper

Kan Liu, Jianzhen Xiang, Zhao Ai, Shoukun Zhang, Yi Fang, Ting Chen, Qiongwei Zhou, Songzhan Li, Shengxiang Wang, Nangang Zhang

Design of compact multiband pattern diversity antenna for WiMax, LTE and WLAN applications

  • Technical Paper

Ramkrishnan B Kasyap, Gourang Namdeo Mulay

Experimental and numerical investigation of flexibility of ITO electrode for application in flexible electronic devices

  • Technical Paper

Hoon Sun Jung, Kyoungtae Eun, Yong Taek Kim, Eun Kyung Lee, Sung-Hoon Choa

Fluid mixing in a swirl-inducing microchannel with square and T-shaped cross-sections

  • Technical Paper

S.-W. Huang, C.-Y. Wu, B.-H. Lai, Y.-C. Chien

Silicon-on-quartz bonding based SPR chip

  • Technical Paper

Yeonsu Lee, Sung-min Sim, Eduardo Fontana, Ignacio Llamas-Garro, Gustavo Oliveira Cavalcanti, Jung-Mu Kim

Comparison analysis of energy loss between micro clamped–clamped and clamped-free beam in vertical motion flux modulation magnetic sensor

  • Technical Paper

Wenyin Li, Mengchun Pan, Xuezhong Wu, Dingbang Xiao, Wugang Tian, Jiafei Hu, Zhanqiang Hou, Jianqiang Zhao, Jinghua Hu

Design and characteristic evaluation of a novel amphibious spherical robot

  • Technical Paper

Jian Guo, Shuxiang Guo, Liguo Li

Resonance frequency tracking and measuring system for micro-electromechanical cantilever array sensors

  • Technical Paper

Ju Liao, Jingjing Wang, Nannan Li, Yinfang Zhu, Jinying Zhang, Jinling Yang, Fuhua Yang

Electromagnetically actuated biaxial scanning micromirror fabricated with silicon on glass wafer

  • Technical Paper

Jun-Ho Kim, Haesoo Jeong, Seung-Ki Lee, Chang-Hyeon Ji, Jae-Hyoung Park

Replication of large scale micro pillar array with different diameters by micro injection molding

  • Technical Paper

Mancang Song, Hui Zhao, Junshan Liu, Chong Liu, Jingmin Li

New simulation approach for tuneable trapezoidal and rectangular piezoelectric bimorph energy harvesters

  • Technical Paper

Mohammed Salim, Hanim Salleh, Eric Wooi Kee LOH, Mhd Khir, Dhia Salim

Back-end-of-line compatible Poly-SiGe lateral nanoelectromechanical relays with multi-level interconnect

  • Technical Paper

Kimberly L. Harrison, William A. Clary, J. Provine, Roger T. Howe

A measurement free pre-etched pattern to identify the <110> directions on Si{110} wafer

  • Technical Paper

S. S. Singh, V. N. Avvaru, S. Veerla, A. K. Pandey, P. Pal

Ultrasonically manufactured microfluidic device for yeast analysis

  • Technical Paper

Tim Runge, Johannes Sackmann, Werner Karl Schomburg, Lars Mathias Blank

Effect of fused silica surface wettability on thermal reflow of polymer microlens arrays

  • Technical Paper

D. Jucius, V. Grigaliūnas, A. Lazauskas, E. Sapeliauskas, B. Abakevičienė, S. Smetona, S. Tamulevičius

Investigation of the anti-adhesion layers for nanoimprint molding

  • Technical Paper

C. T. Pan, T. L. Yang, C. Y. Su, C. H. Chao, Z. K. Wang, S. C. Shen

Modal and fatigue analysis of critical components of an amphibious spherical robot

  • Technical Paper

Shuxiang Guo, Yanlin He, Liwei Shi, Shaowu Pan, Kun Tang, Rui Xiao, Ping Guo

Plastic deformation of membrane with mesa silicon microstructure

  • Technical Paper

Wanli Jiang, Dehui Xu, Bin Xiong, Yuelin Wang

Continuous ultra-thin carbon nitride thin film for magnetic hard disk via post nitrogen plasma treatment

  • Technical Paper

Wah Lawrence Ng, Amalina Balqis binti Abu Bakar, Mohammad Azrul Firdhaus bin Azmi, Khoo Wee Shen, Yonggang Meng

Probe system design for three dimensional micro/nano scratching machine

  • Technical Paper

Zhiyong Guo, Yanling Tian, Jia Tian, Xianping Liu, Fujun Wang, Hongjie Zhang, Dawei Zhang

Feature coefficient prediction of micro-channel based on artificial neural network

  • Technical Paper

Liu Huang, Weirong Nie, Xiaofeng Wang, Teng Shen

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen. 

    Bildnachweise
    MKVS GbR/© MKVS GbR, Nordson/© Nordson, ViscoTec/© ViscoTec, BCD Chemie GmbH, Merz+Benteli/© Merz+Benteli, Robatech/© Robatech, Ruderer Klebetechnik GmbH, Xometry Europe GmbH/© Xometry Europe GmbH, Atlas Copco/© Atlas Copco, Sika/© Sika, Medmix/© Medmix, Kisling AG/© Kisling AG, Dosmatix GmbH/© Dosmatix GmbH, Innotech GmbH/© Innotech GmbH, Hilger u. Kern GmbH, VDI Logo/© VDI Wissensforum GmbH, Dr. Fritz Faulhaber GmbH & Co. KG/© Dr. Fritz Faulhaber GmbH & Co. KG, ECHTERHAGE HOLDING GMBH&CO.KG - VSE, mta robotics AG/© mta robotics AG, Bühnen, The MathWorks Deutschland GmbH/© The MathWorks Deutschland GmbH, Spie Rodia/© Spie Rodia, Schenker Hydraulik AG/© Schenker Hydraulik AG