Zum Inhalt

Microsystem Technologies

Ausgabe 6/2021 Special Issue on ISPS 2020

Inhalt (26 Artikel)

Preface: ASME ISPS 2020

  • Editorial

Paul C.-P. Chao, Yuan Ma, Wanchin Kim

Foreword-ASME ISPS 2020

  • Editorial

Bharat Bhushan

Investigation of mechanism of smear formation from diamond-like carbon films on heating

  • Technical Paper

Hiroshi Tani, Renguo Lu, Shinji Koganezawa, Norio Tagawa

A multi-focusing curved artificial compound eye compatible with planar image sensors

  • Technical Paper

Qingqing Han, Yueqi Zhai, Jiaqi Niu, Jingquan Liu, Bin Yang

Material loss of silicon nitride thin films in a simulated ocular environment

  • Technical Paper

Christoph Schade, Alex Phan, Kevin Joslin, Frank E. Talke

Backpack energy harvester managed by a modified fly-back converter

  • Technical Paper

W.-W. Yen, Paul C.-P. Chao

Mask-substrate gap control system for exposure equipment

  • Technical Paper

Raehun Jung, Joanne Yoon, Buhyun Shin, Sang-Gil Ryu, Sung-Joon Ye, Young-bong Bang

A new blood flow volume sensor with embedded estimation of SpO2 to maximize its accuracy

  • Technical Paper

Duc Huy Nguyen, Yu-Ting Chen, Tse-Yi Tu, Paul C.-P. Chao, Yu-Wei Fang, Bing Shi Lin

Mathematical modeling of the magnetoelectric effect of the nano bi-layer L-T mode bar structure in high frequency regime

  • Open Access
  • Technical Paper

Treetep Saengow, Salinee Choowitsakunlert, Rardchawadee Silapunt

Characterization of head modulation during touchdown process using magnetic spacing sensitivity analysis

  • Technical Paper

Rahul Rai, Abhishek Srivastava, Bernhard Knigge, Aravind N. Murthy

Design and implementation of a new light to digital converter for the PPG sensor

  • Technical Paper

Eka Fitrah Pribadi, Rajeev Kumar Pandey, Paul C.-P. Chao

Investigation of long term drift of an intraocular pressure sensor

  • Technical Paper

Alex Phan, Phuong Truong, Christoph Schade, Aditya Vasan, James Friend, Frank E. Talke

Modeling and control of a finger-like mechanism using bending shape memory alloys

  • Technical Paper

Hussein F. M. Ali, Abdul Manan Khan, Hangyeol Baek, Buhyun Shin, Youngshik Kim

Head–disk interface (HDI) degradation risk reduction in hard disk drive (HDD) during thermal asperity (TA) track follow mapping and seeking

  • Technical Paper

Abhishek Srivastava, Bernd Lamberts, Karthik Venkatesh, Rahul Rai, Ning Li, Bernhard Knigge

Contact printing pressure uniformization in roll-to-roll process using individual drive cross-coupled torque control

  • Technical Paper

Jimin Park, Youngjin Kim, Hyeongrae Kim, JuYeon Kim, Dongho Oh

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen. 

    Bildnachweise
    MKVS GbR/© MKVS GbR, Nordson/© Nordson, ViscoTec/© ViscoTec, BCD Chemie GmbH, Merz+Benteli/© Merz+Benteli, Robatech/© Robatech, Ruderer Klebetechnik GmbH, Xometry Europe GmbH/© Xometry Europe GmbH, Atlas Copco/© Atlas Copco, Sika/© Sika, Medmix/© Medmix, Kisling AG/© Kisling AG, Dosmatix GmbH/© Dosmatix GmbH, Innotech GmbH/© Innotech GmbH, Hilger u. Kern GmbH, VDI Logo/© VDI Wissensforum GmbH, Dr. Fritz Faulhaber GmbH & Co. KG/© Dr. Fritz Faulhaber GmbH & Co. KG, ECHTERHAGE HOLDING GMBH&CO.KG - VSE, mta robotics AG/© mta robotics AG, Bühnen, The MathWorks Deutschland GmbH/© The MathWorks Deutschland GmbH, Spie Rodia/© Spie Rodia, Schenker Hydraulik AG/© Schenker Hydraulik AG