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Microsystem Technologies

Ausgabe 6/2022 Special Issue on DTIP 2017 & DTIP 2018

Inhalt (24 Artikel)

Soft mold NanoImprint Lithography: a versatile tool for sub-wavelength grating applications

  • Technical Paper

S. Pelloquin, S. Augé, K. Sharshavina, J.-B. Doucet, A. Héliot, H. Camon, A. Monmayrant, O. Gauthier-Lafaye

Relative humidity influence on adhesion effect in MEMS flexible structures

  • Technical Paper

Corina Birleanu, Marius Pustan, Florina Rusu, Cristian Dudescu, Raluca Muller, Angela Baracu

Self-identification algorithm for zeolite-based thermal capacity gas sensor

  • Technical Paper

M. Pouliquen, M. Denoual, C. Jorel, C. Radu, D. Robbes, J. Grand, H. Awala, S. Mintova, M. Harnois, O. de Sagazan, S. Inoue, E. Lebrasseur, K. Yamada, Y. Okamoto, A. Mita-Tixier, Y. Mita

Characteristics of Li-ion micro batteries fully batch fabricated by micro-fluidic MEMS packaging

  • Technical Paper

Robert Hahn, Marc Ferch, Neil Amponsah Kyeremateng, Katrin Hoeppner, Krystan Marquardt, Giuseppe Antonio Elia

A microfluidic sensor in coplanar waveguide configuration for localized micrometric liquid spectroscopy in microwaves regime

  • Technical Paper

Giovanni Maria Sardi, Andrea Lucibello, Francesco Cursi, Emanuela Proietti, Romolo Marcelli

Design optimization of a dynamically flat resonating micro-mirror for pico-projection applications

  • Technical Paper

Russell Farrugia, Ivan Grech, Duncan Camilleri, Owen Casha, Joseph Micallef, Edward Gatt

Micro-fabricated thermal flow-rate sensors: the substrate material impact on the device performance and power consumption

  • Technical Paper

Ferdous Shaun, Elyes Nefzaoui, Frederic Marty, William Cesar, Tarik Bourouina

Chemical sensor based on a novel capacitive microwave flexible transducer with polymer nanocomposite-carbon nanotube sensitive film

  • Technical Paper

Prince Bahoumina, Hamida Hallil, Jean-Luc Lachaud, Dominique Rebière, Corinne Dejous, Aymen Abdelghani, Kamel Frigui, Stephane Bila, Dominique Baillargeat, Qing Zhang, Phillipe Coquet, Carlos Paragua, Emmanuelle Pichonat, Henri Happy

Modeling and physical analysis of an out-of-plane capacitive MEMS transducer with dynamically coupled electrodes

  • Technical Paper

Gabriele Bosetti, Johannes Manz, Alfons Dehé, Ulrich Krumbein, Gabriele Schrag

Development of energy harvesting MEMS vibration device sensor with wideband response function in low-frequency domain

  • Technical Paper

Lan Zhang, Ryohei Takei, Jian Lu, Natsumi Makimoto, Toshihiro Itoh, Takeshi Kobayashi

System-level simulations of multi-sensor systems and data fusion algorithms

  • Technical Paper

Josué Manuel Rivera Velázquez, Frédérick Mailly, Pascal Nouet

Automated insertion of package dies onto wire and into a textile yarn sheath

  • Open Access
  • Technical Paper

Dorothy Anne Hardy, Ioannis Anastasopoulos, Mohamad-Nour Nashed, Carlos Oliveira, Theodore Hughes-Riley, Abiodun Komolafe, John Tudor, Russel Torah, Steve Beeby, Tilak Dias

Essential design and fabrication considerations for the reliable performance of an electrothermal MEMS microgripper

  • Technical Paper

Marija Cauchi, Ivan Grech, Bertram Mallia, Pierluigi Mollicone, Barnaby Portelli, Nicholas Sammut

Air damping of high performance resonating micro-mirrors with angular vertical comb-drive actuators

  • Technical Paper

Russell Farrugia, Barnaby Portelli, Ivan Grech, Duncan Camilleri, Owen Casha, Joseph Micallef, Edward Gatt

Modified PDMS packaging of sensory e-textile circuit microsystems for improved robustness with washing

  • Open Access
  • Technical Paper

Olivia Ojuroye, Russel Torah, Steve Beeby

High Q 2D-length extension mode resonators for potential time–frequency applications

  • Technical Paper

Paul Chapellier, Pierre Lavenus, Olivier Le Traon, Bernard Dulmet

Synergistic photoluminescent interaction of Si and CdTe quantum dots

  • Technical Paper

Janeth Alexandra Garcia-Monge, Clarissa D. Vazquez-Colon, Arturo Ponce, Gregory Guisbiers, Arturo A. Ayon

Anomalous Stokes shift of colloidal quantum dots and their influence on solar cell performance

  • Technical Paper

J. E. Pelayo-Ceja, A. Zazueta-Raynaud, R. Lopez-Delgado, M. E. Alvarez-Ramos, E. Saucedo-Flores, R. Ruelas-Lepe, F. Orona-Magallanes, R. Guerrero-Gonzalez, A. Ayon

Finite element analysis (FEA) modelling and experimental verification to optimise flexible electronic packaging for e-textiles

  • Open Access
  • Technical Paper

Menglong Li, Russel Torah, Jingqi Liu, John Tudor, Steve Beeby

Detection of TNT in sulfuric acid solution by SiNWs-FET based sensor

  • Technical Paper

Hui Wang, Shixing Chen, Anran Gao, Yuelin Wang, Tie Li

Characterization of liquid crystals impregnated micrometric diffraction gratings for an active near-IR light extraction control

  • Technical Paper

A. Héliot, S. Pelloquin, O. Gauthier-Lafaye, A. Monmayrant, H. Camon, T. Gacoin, K. Lahlil, L. Martinelli, C. Biver, S. Archambeau

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen. 

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    MKVS GbR/© MKVS GbR, Nordson/© Nordson, ViscoTec/© ViscoTec, BCD Chemie GmbH, Merz+Benteli/© Merz+Benteli, Robatech/© Robatech, Ruderer Klebetechnik GmbH, Xometry Europe GmbH/© Xometry Europe GmbH, Atlas Copco/© Atlas Copco, Sika/© Sika, Medmix/© Medmix, Kisling AG/© Kisling AG, Dosmatix GmbH/© Dosmatix GmbH, Innotech GmbH/© Innotech GmbH, Hilger u. Kern GmbH, VDI Logo/© VDI Wissensforum GmbH, Dr. Fritz Faulhaber GmbH & Co. KG/© Dr. Fritz Faulhaber GmbH & Co. KG, ECHTERHAGE HOLDING GMBH&CO.KG - VSE, mta robotics AG/© mta robotics AG, Bühnen, The MathWorks Deutschland GmbH/© The MathWorks Deutschland GmbH, Spie Rodia/© Spie Rodia, Schenker Hydraulik AG/© Schenker Hydraulik AG