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Microsystem Technologies

Ausgabe 7/2008 Special issue on Design, Test, Integration and Packaging of MEMS/MOEMS, Stresa - Italy, 25 - 27 April 2007

Inhalt (30 Artikel)

From MEMS devices to smart integrated systems

  • Technical Paper

O. Soeraasen, J. E. Ramstad

Design and fabrication of the suspended high-Q spiral inductors with X-beams

  • Technical Paper

M. C. Hsieh, D. K. Jair, C. S. Lin

Experimental characterization of electrostatically actuated in-plane bending of microcantilevers

  • Technical Paper

A. Ballestra, E. Brusa, M. Gh Munteanu, A. Somà

Solving functional reliability issue for an optical electrostatic switch

  • Technical Paper

H. Camon, C. Ganibal, N. Rapahoz, M. Trzmiel, C. Pisella, C. Martinez, S. Valette

A two-step etching method to fabricate nanopores in silicon

  • Technical Paper

Gou-Jen Wang, Wei-Zheng Chen, Kang J. Chang

Lamination and laser structuring for a microwell array

  • Technical Paper

Erik Jung, Dion Manessis, Alexander Neumann, Lars Böttcher, Tanja Braun, Jörg Bauer, Herbert Reichl, Bruno Iafelice, Federica Destro, Roberto Gambari

Surface generation analysis in micro end-milling considering the influences of grain

  • Technical Paper

J. S. Wang, Y. D. Gong, G. Abba, K. Chen, J. S. Shi, G. Q. Cai

A compact package for integrated silicon thermal gas flow meters

  • Technical Paper

P. Bruschi, V. Nurra, M. Piotto

Copper planar microcoils applied to magnetic actuation

  • Technical Paper

Marion Woytasik, Johan Moulin, Emile Martincic, Anne-Lise Coutrot, Elisabeth Dufour-Gergam

Polysilicon micro beams buckling with temperature-dependent properties

  • Technical Paper

M. Shamshirsaz, M. B. Asgari

Study of a piezoelectric multimorph based micro-scanner

  • Technical Paper

A. Chaehoi, M. Begbie

Microcantilever-based weather station for temperature, humidity and flow rate measurement

  • Technical Paper

Rong-Hua Ma, Chia-Yen Lee, Yu-Hsiang Wang, Hao-Jen Chen

Biodegradable polylactic acid microstructures for scaffold applications

  • Technical Paper

Gou-Jen Wang, Kuan-Hsuan Ho, Cheng-Chih Hsueh

Enhanced sensing characteristics in MEMS-based formaldehyde gas sensors

  • Technical Paper

Yu-Hsiang Wang, Chia-Yen Lee, Che-Hsin Lin, Lung-Ming Fu

Development and application of a diaphragm micro-pump with piezoelectric device

  • Technical Paper

H. K. Ma, B. R. Hou, H. Y. Wu, C. Y. Lin, J. J. Gao, M. C. Kou

A novel x-axis tuning fork gyroscope with “8 vertical springs-proofmass” structure on (111) silicon

  • Technical Paper

Fei Duan, Jiwei Jiao, Yucai Wang, Ying Zhang, Binwei Mi, Jinpeng Li, Yuelin Wang

Silicon microneedle array with biodegradable tips for transdermal drug delivery

  • Technical Paper

Bangtao Chen, Jiashen Wei, Francis E. H. Tay, Yee Ting Wong, Ciprian Iliescu

Development of a nanostructural microwave probe based on GaAs

  • Technical Paper

Y. Ju, T. Kobayashi, H. Soyama

Silicon on nothing MEMS electromechanical resonator

  • Technical Paper

Cédric Durand, Fabrice Casset, Pascal Ancey, Fabienne Judong, Alexandre Talbot, Rémi Quenouillère, Denis Renaud, Stéphan Borel, Brigitte Florin, Lionel Buchaillot

New horizontal frustum optical waveguide fabrication using UV proximity printing

  • Technical Paper

Tsung-Hung Lin, Hsiharng Yang, Ruey Fang Shyu, Ching-Kong Chao

Monotonic and fatigue testing of freestanding submicron thin beams application for MEMS

  • Technical Paper

Ming-Tzer Lin, Chi-Jia Tong, Kai-Shiang Shiu

Focussed ion beam based fabrication of micro-electro-mechanical resonators

  • Technical Paper

Daniel Grogg, Nicoleta Diana Badila-Ciressan, Adrian Mihai Ionescu

Studies of polymer deformation and recovery in micro hot embossing

  • Technical Paper

Xuechuan Shan, Y. C. Liu, Y. C. Lam

Modeling of large area hot embossing

  • Technical Paper

M. Worgull, K. K. Kabanemi, J.-P. Marcotte, J.-F. Hétu, M. Heckele

Miniaturized variable-focus lens fabrication using liquid filling technique

  • Technical Paper

Hsiharng Yang, Chung-Yao Yang, Mau-Shiun Yeh

Usage of porous Al2O3 layers for RH sensing

  • Technical Paper

Veronika Timár-Horváth, László Juhász, András Vass-Várnai, Gergely Perlaky

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen. 

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    MKVS GbR/© MKVS GbR, Nordson/© Nordson, ViscoTec/© ViscoTec, BCD Chemie GmbH, Merz+Benteli/© Merz+Benteli, Robatech/© Robatech, Ruderer Klebetechnik GmbH, Xometry Europe GmbH/© Xometry Europe GmbH, Atlas Copco/© Atlas Copco, Sika/© Sika, Medmix/© Medmix, Kisling AG/© Kisling AG, Dosmatix GmbH/© Dosmatix GmbH, Innotech GmbH/© Innotech GmbH, Hilger u. Kern GmbH, VDI Logo/© VDI Wissensforum GmbH, Dr. Fritz Faulhaber GmbH & Co. KG/© Dr. Fritz Faulhaber GmbH & Co. KG, ECHTERHAGE HOLDING GMBH&CO.KG - VSE, mta robotics AG/© mta robotics AG, Bühnen, The MathWorks Deutschland GmbH/© The MathWorks Deutschland GmbH, Spie Rodia/© Spie Rodia, Schenker Hydraulik AG/© Schenker Hydraulik AG