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Microsystem Technologies

Ausgabe 7/2009

Inhalt (20 Artikel)

Analysis of pattern height development in hot embossing process

  • Technical Paper

Yong He, Jian-Zhong Fu, Zi-Chen Chen

MEMS micro fluxgate sensors with mutual vertical excitation coils and detection coils

  • Technical Paper

Chong Lei, Ren Wang, Yong Zhou, Zhimin Zhou

Resonant frequency sensitive MEMS bandpass filter using capacitive sensing scheme

  • Technical Paper

In-Hyouk Song, Yves-Alain Peter, Michel Meunier

A study of PZT valveless micropump with asymmetric obstacles

  • Technical Paper

Ching-Jiun Lee, Horn-Jiunn Sheen, Zhi-Kai Tu, U. Lei, Cheng-Ying Yang

A miniature spindle motor with fluid dynamic bearings for portable storage device applications

  • Technical Paper

Chien-Sheng Liu, Psang-Dain Lin, Meng-Che Tsai

Design of a relaying electroosmosis pump driven by low-voltage DC

  • Technical Paper

Qiuquan Guo, Yu Liu, Xueyin Wu, Jun Yang

A novel active vibration isolator applied for micro-gyro by array of deposited electrodes

  • Technical Paper

Nan-Chyuan Tsai, Chung-Yang Sue, Bing-Hong Liou

A cross-junction channel valveless-micropump with PZT actuation

  • Technical Paper

Van Thanh Dau, Thien Xuan Dinh, Tanaka Katsuhiko, Sugiyama Susumu

Femtosecond laser-induced silicon surface morphology in water confinement

  • Technical Paper

Yukun Han, Cheng-Hsiang Lin, Hai Xiao, Hai-Lung Tsai

Localised laser joining of glass to silicon with BCB intermediate layer

  • Technical Paper

Qiang Wu, N. Lorenz, D. P. Hand

Micro-structures fabrication on glasses for micro-fluidics by imprinting technique

  • Technical Paper

Qiuping Chen, Qiuling Chen, Daniel Milanese, Monica Ferraris

Design and fabrication of MEMS-based microneedle arrays for medical applications

  • Open Access
  • Technical Paper

Peiyu Zhang, Colin Dalton, Graham A. Jullien

Plane strain sliding contact of multilayer magnetic storage thin-films using the finite element method

  • Technical Paper

Raja R. Katta, Emerson Escobar Nunez, Andreas A. Polycarpou, Sung-Chang Lee

Bonding of Cu-based high aspect ratio microscale structures with Sn intermediate layers

  • Technical Paper

Fanghua Mei, Ke Chen, B. Lu, Wen Jin Meng

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen. 

    Bildnachweise
    MKVS GbR/© MKVS GbR, Nordson/© Nordson, ViscoTec/© ViscoTec, BCD Chemie GmbH, Merz+Benteli/© Merz+Benteli, Robatech/© Robatech, Ruderer Klebetechnik GmbH, Xometry Europe GmbH/© Xometry Europe GmbH, Atlas Copco/© Atlas Copco, Sika/© Sika, Medmix/© Medmix, Kisling AG/© Kisling AG, Dosmatix GmbH/© Dosmatix GmbH, Innotech GmbH/© Innotech GmbH, Hilger u. Kern GmbH, VDI Logo/© VDI Wissensforum GmbH, Dr. Fritz Faulhaber GmbH & Co. KG/© Dr. Fritz Faulhaber GmbH & Co. KG, ECHTERHAGE HOLDING GMBH&CO.KG - VSE, mta robotics AG/© mta robotics AG, Bühnen, The MathWorks Deutschland GmbH/© The MathWorks Deutschland GmbH, Spie Rodia/© Spie Rodia, Schenker Hydraulik AG/© Schenker Hydraulik AG