Ausgabe 7/2010 Special Issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2009
Inhalt (32 Artikel)
Microsystem technologies: foreword to special issue on design, test, integration and packaging of MEMS/MOEMS, 2009
- Editorial
Bernard Courtois, Bernd Michel
Design issues of BAW employment in 3D integrated sensor nodes
- Technical Paper
Josef Prainsack, Markus Dielacher, Martin Flatscher, Thomas Herndl, Rainer Matischek, Joern Stolle, Werner Weber
Through-silicon via technologies for interconnects in RF MEMS
- Technical Paper
Jian Zhu, Yuanwei Yu, Fang Hou, Chen Chen
3D System-on-Chip technologies for More than Moore systems
- Technical Paper
Peter Ramm, Armin Klumpp, Josef Weber, Maaike M. V. Taklo
Mechanical modelling of capacitive RF MEMS shunt switches
- Technical Paper
Romolo Marcelli, Andrea Lucibello, Giorgio De Angelis, Emanuela Proietti, Daniele Comastri
Optimal design analysis of electrothermally driven microactuators
- Technical Paper
Seyed Majid Karbasi, Mahnaz Shamshirsaz, Mahyar Naraghi, Mohammad Maroufi
Modeling of an electrostatic torsional micromirror for laser projection system
- Technical Paper
Eleonora Marchetti, Emilio Volpi, Francesco Battini, Luca Bacciarelli, Luca Fanucci, Ulrich Hofmann
Effect of dimensional and material property uncertainties on thermal flexure microactuator response using probabilistic methods
- Technical Paper
Babak Khayatzadeh Safaie, Mahnaz Shamshirsaz, Mohsen Bahrami
Effects of channel surface finish on blood flow in microfluidic devices
- Technical Paper
S. Prentner, D. M. Allen, L. Larcombe, S. Marson, K. Jenkins, M. Saumer
Hydrodynamic separation of cells utilizing insulator-based dielectrophoresis
- Technical Paper
Chun-Ping Jen, Ching-Te Huang, Hsin-Yuan Shih
Fabrication of internally driven micro centrifugal force pumps based on synchronous micro motors
- Technical Paper
Andreas Waldschik, Stephanus Büttgenbach
Reliability of RF MEMS switches due to charging effects and their circuital modelling
- Technical Paper
Romolo Marcelli, Giancarlo Bartolucci, George Papaioannu, Giorgio De Angelis, Andrea Lucibello, Emanuela Proietti, Benno Margesin, Flavio Giacomozzi, François Deborgies
Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries
- Technical Paper
Krystan Marquardt, Robert Hahn, Martin Blechert, Marco Lehmann, Michael Töpper, Martin Wilke, Peter Semionyk, Maria von Suchodoletz, Herbert Reichl
Optical micro-paddle beam deflection measurement for electrostatic mechanical testing of nano-scale thin film application to MEMS
- Technical Paper
Chi-Jia Tong, Ya-Chi Cheng, Ming-Tzer Lin, Kuan-Jung Chung, Jiong-Shiun Hsu, Chung-Lin Wu
Design of CWDM multiplexers based on series coupled ring resonators: analysis, potential and prospects on MEMS fabrication technologies
- Technical Paper
Maurine Malak, Ahmed Hisham Morshed, Khaled Hassan, Tarik Bourouina, Hanan Anis, Diaa Khalil
Experimental study of heat sink performance using copper foams fabricated by electroforming
- Technical Paper
Reiyu Chein, Hsiharng Yang, Tsung-Hsun Tsai, Chijay Lu
Fabrication methods based on wet etching process for the realization of silicon MEMS structures with new shapes
- Technical Paper
Prem Pal, Kazuo Sato
A novel CMOS process compatible high performance parallel-stacked RF spiral inductor
- Technical Paper
D. K. Jair, Ming Chun Hsieh, C. S. Lin
Corona discharge assisted thermal bonding of polymer microfluidic devices
- Technical Paper
Sum Huan Ng, Yexian Wu, Zhenfeng Wang, Zhiping Wang
Novel design of a RF-MEMS tuneable capacitor based on electrostatically induced torsion
- Technical Paper
Parisa Ture Savadkoohi, Sabrina Colpo, Benno Margesin
Integration of stamper fabrication and design optimization of LCD Light guides using silicon-based microfeatures
- Technical Paper
Jyh-Cheng Yu, Pei-Kai Hsu
Hot punching on an 8 inch substrate as an alternative technology to produce holes on a large scale
- Technical Paper
Bastian E. Rapp, Marc Schneider, Matthias Worgull
Novel U-shape gold nanoparticles-modified optical fiber for localized plasmon resonance chemical sensing
- Technical Paper
Chien-Hsing Chen, Tzu-Chien Tsao, Wan-Yun Li, Wei-Chih Shen, Chung-Wei Cheng, Jaw-Luen Tang, Chun-Ping Jen, Lai-Kwan Chau, Wei-Te Wu
New fabrication method for micro-pyramidal vertical probe array for probe cards
- Technical Paper
Tsung-Hung Lin, Hsiharng Yang, Ching-Kong Chao, Mau-Shiun Yeh
Microthermoforming of nanostructured polymer films: a new bonding method for the integration of nanostructures in 3-dimensional cavities
- Technical Paper
Markus Heilig, Stefan Giselbrecht, Andreas Guber, Matthias Worgull
Properties of M-AFM probe affected by nanostructural metal coatings
- Technical Paper
A. Hosoi, M. Hamada, A. Fujimoto, Y. Ju
Use of a PDMS spring element for ink jet printing applications
- Technical Paper
S. Bargir, David M. Allen
Temperature dependent fracture toughness of glass frit bonding layers
- Technical Paper
Kerstin Nötzold, Christian Dresbach, Jürgen Graf, Bianca Böttge
Identification of mechanical defects in MEMS using dynamic measurements for application in production monitoring
- Technical Paper
Ronny Gerbach, Matthias Ebert, Geert Brokmann, Thomas Hein, Joerg Bagdahn
MEMS cantilever sensor for non-destructive metrology within high-aspect-ratio micro holes
- Technical Paper
Erwin Peiner, Lutz Doering
A microvalve for hybrid microfluidic systems
- Technical Paper
G. Simone, G. Perozziello, G. Sardella, I. Disegna, S. Tori, N. Manaresi, G. Medoro
MEMS packaging process by film transfer using an anti-adhesive layer
- Technical Paper
Sebastien Brault, O. Garel, G. Schelcher, N. Isac, F. Parrain, A. Bosseboeuf, F. Verjus, M. Desgeorges, E. Dufour-Gergam
