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Microsystem Technologies

Ausgabe 7/2013

Inhalt (17 Artikel)

Integrated microfluidic drug delivery devices: a component view

  • Review Paper

Mst. Fateha Samad, Abbas Z. Kouzani

Process variability in surface roughening of SU-8 by oxygen plasma

  • Technical Paper

Nagaraju Oruganti, Michel Goedert, Sang-Joon John Lee

Design and FEM simulation study of the electro-thermal excitation resonant beam with slit-structure

  • Technical Paper

Huichao Shi, Shangchun Fan, Weiwei Xing, Cheng Li, Jinhao Sun, Zhongwu Jing

A micro PDMS flow sensor based on time-of-flight measurement for conductive liquid

  • Technical Paper

Haixia Yu, Dachao Li, Robert C. Roberts, Kexin Xu, Norman C. Tien

Micro solar energy harvesting using thin film selective absorber coating and thermoelectric generators

  • Technical Paper

Emmanuel Ogbonnaya, Alfred Gunasekaran, Leland Weiss

MEMS tri-axial force sensor with an integrated mechanical stopper for guidewire applications

  • Technical Paper

Woo-Tae Park, Rama Krishna Kotlanka, Liang Lou, Muhammad Hamidullah, Chengkuo Lee

A novel approach to realize the local precise variotherm process in micro injection molding

  • Technical Paper

Lei Xie, Thalke Niesel, Monika Leester-Schädel, Gerhard Ziegmann, Stephanus Büttgenbach

Single-step UV diffraction lithography to define a hydrophobic SU-8 interconnected hoodoo structure

  • Technical Paper

Seungha Lee, Gi Seok Jeong, Junghyun Kim, Junghyo Yoon, Sewoon Han, Ji-Yoon Kang, Seok Chung, Sang-Hoon Lee

A high-efficiency three-dimensional helical micromixer in fused silica

  • Technical Paper

Keyin Liu, Qing Yang, Shengguan He, Feng Chen, Yulong Zhao, Xiaole Fan, Lei Li, Chao Shan, Hao Bian

Suspended bimaterial microchannel resonators for thermal sensing of local heat generation in liquid

  • Technical Paper

Masaya Toda, Tomoyuki Otake, Hidetoshi Miyashita, Yusuke Kawai, Takahito Ono

Raman spectroscopy characterization of a thermal bimorph actuator used in a bio-MEMS device

  • Technical Paper

S. Maggiolino, F. Antoniolli, G. Pezzotti, O. Sbaizero

Enhanced electromigration reliability via Ag nanoparticles modified eutectic Sn–58Bi solder joint

  • Technical Paper

Shafiq Ismathullakhan, Hungyin Lau, Yan-cheong Chan

Fabrication of micro-trench structures with high aspect ratio based on DRIE process for MEMS device applications

  • Technical Paper

Maoxiang Guo, Xiujian Chou, Jiliang Mu, Bing Liu, Jijun Xiong

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen. 

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    MKVS GbR/© MKVS GbR, Nordson/© Nordson, ViscoTec/© ViscoTec, BCD Chemie GmbH, Merz+Benteli/© Merz+Benteli, Robatech/© Robatech, Ruderer Klebetechnik GmbH, Xometry Europe GmbH/© Xometry Europe GmbH, Atlas Copco/© Atlas Copco, Sika/© Sika, Medmix/© Medmix, Kisling AG/© Kisling AG, Dosmatix GmbH/© Dosmatix GmbH, Innotech GmbH/© Innotech GmbH, Hilger u. Kern GmbH, VDI Logo/© VDI Wissensforum GmbH, Dr. Fritz Faulhaber GmbH & Co. KG/© Dr. Fritz Faulhaber GmbH & Co. KG, ECHTERHAGE HOLDING GMBH&CO.KG - VSE, mta robotics AG/© mta robotics AG, Bühnen, The MathWorks Deutschland GmbH/© The MathWorks Deutschland GmbH, Spie Rodia/© Spie Rodia, Schenker Hydraulik AG/© Schenker Hydraulik AG