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Microsystem Technologies

Ausgabe 7/2015

Inhalt (26 Artikel)

Micropump operation at various driving signals: numerical simulation and experimental verification

  • Technical Paper

Borut Pečar, Danilo Vrtačnik, Drago Resnik, Matej Možek, Tine Dolžan, Robert Brajkovič, Dejan Križaj

Non-destructive wafer-level bond defect identification by scanning acoustic microscopy

  • Technical Paper

S. Brand, S. Tismer, S. T. Moe, K. Schjølberg-Henriksen

Characterization of low temperature synthesized hexagonal diamond thin films

  • Technical Paper

KyungNam Kang, Jeonghwan Kim, Yoonyoung Jin, Pratul K. Ajmera

Vibration sensitivity analytical analysis for rocking mass microgyroscope

  • Technical Paper

Xiong Wang, Xiaobin Xu, Tao Zhu, Xuezhong Wu

Low-cost silicon wafer dicing using a craft cutter

  • Open Access
  • Technical Paper

Yiqiang Fan, Arpys Arevalo, Huawei Li, Ian G. Foulds

A novel fabrication process for MEMS spiral inductors realized on oxide islands

  • Technical Paper

Teweldebrhan Kifle, Sudhir Chandra, S. K. Koul

Analysis and review on usage of broadband techniques in design of printed antennas for UWB communications

  • Technical Paper

G. Sasibhushana Rao, S. Srinivasa Kumar, Ramu Pillalamarri

Generalized thermoelastic vibration of a microbeam with an axial force

  • Technical Paper

Ahmed E. Abouelregal, Ashraf M. Zenkour

Design and analysis of a compact synthetic-jet-based air pump for large airflow

  • Technical Paper

Yu-Jen Wang, Chung-De Chen, Chien Li

Polymer micro molding with bulk metallic glass mold

  • Technical Paper

Xiang Zhang, Jiang Ma, Ge Fang, Bingli Sun, Junfeng Li, Qian Li

Theoretical investigation of the mechanical coupling in a differential vibrating beam accelerometer

  • Technical Paper

Zhen Zhou, Jie Shi, Bao-yin Yao, Li-shuang Feng

Parallel integration of ionic wind generators on PCBs for enhancing flow rate

  • Technical Paper

Seung Jun Lee, Longnan Li, Kilsung Kwon, Wonjung Kim, Daejoong Kim

Low-temperature quartz wafer bonding using hyperbranched polyurethane oligomers

  • Technical Paper

Jian Zhao, Fei Jin, Jianying Zhao, Shaomin Liu

Label free electrical detection of prostate specific antigen with millimeter grade biomolecule-gated AlGaN/GaN high electron mobility transistors

  • Technical Paper

Jia-dong Li, Jun-jie Cheng, Bin Miao, Xiao-wei Wei, Jie Xie, Jin-cheng Zhang, Zhi-qiang Zhang, Hai-Wen Li, Dong-min Wu

The thermal-mechanical performance of the uncooled infrared optical-readout bi-material FPA

  • Technical Paper

Kong Yan-mei, Liu Rui-wen, Jiao Bin-bin, Lu Di-ke, Zhu En-cheng, Fu Qiang-sheng, Chen Da-peng

Optimization of molecularly thin lubricant to improve bearing capacity at the head-disk interface

  • Technical Paper

Shahla Chowdhury, Antonis I. Vakis, Andreas A. Polycarpou

Development of microfluidic based multidirectional flow sensor inspired from artificial cupula

  • Technical Paper

M. N. M. Nawi, A. A. Manaf, M. R. Arshad, O. Sidek

Tools for ultrasonic hot embossing

  • Technical Paper

S. Liao, C. Gerhardy, J. Sackmann, W. K. Schomburg

Laser moulding, a new low-cost fabrication process for micro- and nanostructured components

  • Technical Paper

Markus Wissmann, Heino Besser, Markus Beiser, Wilhelm Pfleging

A microchannel neural interface with embedded microwires targeting the peripheral nervous system

  • Technical Paper

Bongkyun Kim, Alejandro Reyes, Bernardo Garza, Yoonsu Choi

Micromachined sample stages to reduce thermal drift in atomic force microscopy

  • Technical Paper

Semih Sevim, Selin Tolunay, Hamdi Torun

MEMS filter’s design and modeling based on width-extensional mode plate resonator for wireless applications

  • Technical Paper

Achraf Bem Amar, Dorra Bahloul, François Gagnon, Ammar B. Kouki

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen. 

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    MKVS GbR/© MKVS GbR, Nordson/© Nordson, ViscoTec/© ViscoTec, BCD Chemie GmbH, Merz+Benteli/© Merz+Benteli, Robatech/© Robatech, Ruderer Klebetechnik GmbH, Xometry Europe GmbH/© Xometry Europe GmbH, Atlas Copco/© Atlas Copco, Sika/© Sika, Medmix/© Medmix, Kisling AG/© Kisling AG, Dosmatix GmbH/© Dosmatix GmbH, Innotech GmbH/© Innotech GmbH, Hilger u. Kern GmbH, VDI Logo/© VDI Wissensforum GmbH, Dr. Fritz Faulhaber GmbH & Co. KG/© Dr. Fritz Faulhaber GmbH & Co. KG, ECHTERHAGE HOLDING GMBH&CO.KG - VSE, mta robotics AG/© mta robotics AG, Bühnen, The MathWorks Deutschland GmbH/© The MathWorks Deutschland GmbH, Spie Rodia/© Spie Rodia, Schenker Hydraulik AG/© Schenker Hydraulik AG