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Microsystem Technologies

Ausgabe 7/2018

Inhalt (35 Artikel)

MEMS based energy harvesting for the Internet of Things: a survey

  • Review Paper

Hongwen Sun, Minqi Yin, Wangtong Wei, Jiacheng Li, Haibin Wang, Xin Jin

Investigation of new micromachined coplanar probe for near-field microwave microscopy

  • Technical Paper

Sofiane Ben Mbarek, Fethi Choubani, Bernard Cretin

Cell therapy using an array of ultrathin hollow microneedles

  • Technical Paper

Florina Silvia Iliescu, Jeremy Choon Meng Teo, Danilo Vrtacnik, Hayden Taylor, Ciprian Iliescu

Effects of the ‘spring structure’ on the performance of a vibrating plate of the piezoelectric inkjet print-head

  • Technical Paper

Xing Wang, Xiaolei Xiao, Liping Qi, Qiusen Wang, Jiao Dou, Helin Zou

Design, fabrication and testing of reduced graphene oxide strain gauge based pressure sensor with increased sensitivity

  • Technical Paper

M. S. Manjunath, N. Nagarjuna, G. Uma, M. Umapathy, M. M. Nayak, K. Rajanna

Use of double-raised-border structure for quality factor enhancement of type II piston mode FBAR

  • Technical Paper

Xinyi Li, Jingfu Bao, Yulin Huang, Benfeng Zhang, Gongbin Tang, Tatsuya Omori, Ken-ya Hashimoto

Wideband auto-tunable vibration energy harvester using change in centre of gravity

  • Technical Paper

Rohit Somkuwar, Jaya Chandwani, Raghavendra Deshmukh

Investigation of free vibration response of smart sandwich micro-beam on Winkler–Pasternak substrate exposed to multi physical fields

  • Technical Paper

Ali Ghorbanpour Arani, Hassan BabaAkbar-Zarei, Pouya Pourmousa, Masume Eskandari

Synthesis, green emission and photosensitivity of Al-doped ZnO film

  • Technical Paper

Deepu Thomas, Kishor Kumar Sadasivuni, Sadiya Waseem, Bijandra Kumar, John-John Cabibihan

A design method and its CAD prototype system for surface micromachined MEMS devices

  • Technical Paper

Changfu Zhang, Kang Yun, Peiyong Cheng, Haihong Ai

Thermal performance optimization of Si micro flat heat pipes by Box–Behnken design

  • Technical Paper

Mohammad Hamidnia, Yi Luo, Xiaodong Wang, Gang Jing

Design of a XYZ scanner for home-made high-speed atomic force microscopy

  • Technical Paper

Kunhai Cai, Xianbin He, Yanling Tian, Xianping Liu, Dawei Zhang, Bijan Shirinzadeh

Design and fabrication of high performance condenser microphone using C-slotted diaphragm

  • Technical Paper

Bahram Azizollah Ganji, Sedighe Babaei Sedaghat, Alberto Roncaglia, Luca Belsito

Residual stress release for SU-8 structures by water assist ultrasonic

  • Technical Paper

Xingtian Qu, Jinlai Li, Zhifu Yin

Optimization of a MEMS variable capacitor with high linearity and large tuning ratio

  • Technical Paper

Zhuhao Gong, Huiliang Liu, Xin Guo, Zewen Liu

A contact-enhanced MEMS inertial switch with electrostatic force assistance and multi-step pulling action for prolonging contact time

  • Technical Paper

Jian Li, Yan Wang, Yue Li, Bo Fu, Yunna Sun, Jinyuan Yao, Guifu Ding, Xiaolin Zhao, Zhuoqing Yang

Fabrication of microelectrodes on diamond anvil for the resistance measurement in high pressure experiment

  • Technical Paper

Jing Liu, Hu Cheng, Yanchun Li, Junran Zhang, Futing Yi

Correction to: A new analytical model for switching time of a perforated MEMS switch

  • Correction

K. Guha, N. M. Laskar, H. J. Gogoi, K. L. Baishnab, K. Srinivasa Rao, N. P. Maity

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen. 

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