Ausgabe 7-8/2012 Special issue of the conference 'Smart Sensors, Actuators and MEMS' within the SPIE EUROPE Symposium 'MICROTECHNOLOGIES' Prague, Czech Republic, 18-20 April 2011
Inhalt (43 Artikel)
Special issue of the conference ‘Smart Sensors, Actuators and MEMS’, within the SPIE EUROPE Symposium ‘MICROTECHNOLOGIES’ Prague, Czech Republic, 18–20 April 2011
- Editorial
Ulrich Schmid, Thomas Becker, Bernd Michel
Cleaning of structured templates from nanoparticle accumulation using silicone
- Technical Paper
S. Merzsch, H. S. Wasisto, A. Waag, I. Kirsch, E. Uhde, T. Salthammer, E. Peiner
Low-cost fiber-optic waveguide sensor for the colorimetric detection of ammonia
- Technical Paper
Katrin Schmitt, Jonas Rist, Carolin Peter, Jürgen Wöllenstein
Thermopile-based THz antenna
- Technical Paper
Béla Szentpáli, Gábor Matyi, Péter Fürjes, Endre László, Gábor Battistig, István Bársony, Gergely Károlyi, Tibor Berceli
Nanowire silicon as a material for thermoelectric energy conversion
- Technical Paper
A. Stranz, J. Kähler, S. Merzsch, A. Waag, E. Peiner
Platinated ultrathin films made of carbon nanotubes
- Technical Paper
Timo Bohnenberger, Frank Steinhäußer, Jovan Matovic, Ulrich Schmid
Fabrication, packaging, and characterization of p-SOI Wheatstone bridges for harsh environments
- Technical Paper
J. Kähler, A. Stranz, L. Doering, S. Merzsch, N. Heuck, A. Waag, E. Peiner
Long-term stability of Ag and Cu thin films on glass, LTCC and alumina substrates
- Technical Paper
A. Bittner, N. Pagel, H. Seidel, U. Schmid
Microfabricated self-resonant structure as a passive wireless dielectric constant and conductivity sensor
- Technical Paper
Sheng Zhang, Praveenkumar Pasupathy, Dean P. Neikirk
Design and evaluation process of a robust pressure sensor for measurements in boundary layers of liquid fluids
- Technical Paper
T. Beutel, M. Leester-Schädel, S. Büttgenbach
Determination of exposure to engineered carbon nanoparticles using a self-sensing piezoresistive silicon cantilever sensor
- Technical Paper
H. S. Wasisto, S. Merzsch, A. Waag, I. Kirsch, E. Uhde, T. Salthammer, E. Peiner
Selective modal excitation in coupled piezoelectric microcantilevers
- Technical Paper
M. Gil, T. Manzaneque, J. Hernando-García, A. Ababneh, H. Seidel, J. L. Sánchez-Rojas
Metallo-porphyrin zinc as gas sensitive material for colorimetric gas sensors on planar optical waveguides
- Technical Paper
Carolin Peter, Katrin Schmitt, Martin Apitz, Juergen Woellenstein
Micro harvester using isotropic charging of electrets deposited on vertical sidewalls for conversion of 3D vibrational energy
- Technical Paper
Ulrich Mescheder, Antwi Nimo, Bernhard Müller, Awad Saad Abou Elkeir
Measurement of Young’s modulus and residual stress of thin SiC layers for MEMS high temperature applications
- Technical Paper
Oliver Pabst, Michael Schiffer, Ernst Obermeier, Tolga Tekin, Klaus Dieter Lang, Ha-Duong Ngo
Hardware implementation of an electrostatic MEMS-actuator linearization
- Technical Paper
F. Mair, M. Egretzberger, A. Kugi
Gold-based thin multilayers for ohmic contacts in RF-MEMS switches
- Technical Paper
V. Mulloni, J. Iannacci, R. Bartali, V. Micheli, S. Colpo, N. Laidani, B. Margesin
Measurement technique for the thermal properties of thin-film diaphragms embedded in calorimetric flow sensors
- Technical Paper
Roman Beigelbeck, Samir Cerimovic, Almir Talic, Franz Kohl, Franz Keplinger
Role of the electro-thermo-mechanical multiple coupling on the operation of RF-microswitch
- Technical Paper
Eugenio Brusa, Mircea Gheorghe Munteanu
Modelling and characterization of AlN-actuated microcantilevers vibrating in the first in-plane mode
- Technical Paper
V. Ruiz, J. Hernando-García, A. Ababneh, H. Seidel, U. Schmid, J. L. Sánchez-Rojas
Artificial intelligence based optimization for vibration energy harvesting applications
- Technical Paper
Zdenek Hadas, Jiri Kurfurst, Cestmir Ondrusek, Vladislav Singule
New method for selectivity enhancement of SiC field effect gas sensors for quantification of NO x
- Technical Paper
Christian Bur, Peter Reimann, Mike Andersson, Anita Lloyd Spetz, Andreas Schütze
Studies on SiC, DLC and TiO2 thin films as piezoresistive sensor materials for high temperature application
- Technical Paper
M. A. Fraga, H. Furlan, R. S. Pessoa, L. A. Rasia, C. F. R. Mateus
Modeling the performance of a micromachined piezoelectric energy harvester
- Technical Paper
Ali B. Alamin Dow, M. Schneider, David Koo, Hasan A. Al-Rubaye, A. Bittner, U. Schmid, Nazir Kherani
Sensing viscosity and density of glycerol–water mixtures utilizing a suspended plate MEMS resonator
- Open Access
- Technical Paper
Samir Cerimovic, Roman Beigelbeck, Hannes Antlinger, Johannes Schalko, Bernhard Jakoby, Franz Keplinger
Through wafer via holes manufacturing by variable isotropy Deep RIE process for RF applications
- Technical Paper
D. Vasilache, S. Colpo, F. Giacomozzi, S. Ronchin, S. Gennaro, A. Q. A. Qureshi, B. Margesin
CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration
- Technical Paper
Viorel Dragoi, Eric Pabo, Jürgen Burggraf, Gerald Mittendorfer
MEMS-based microthruster with integrated platinum thin film resistance temperature detector (RTD), heater meander and thermal insulation for operation up to 1,000°C
- Technical Paper
Natsuki Miyakawa, Wolfgang Legner, Thomas Ziemann, Dimitri Telitschkin, Hans-Jörg Fecht, Alois Friedberger
Resonantly excited AlN-based microcantilevers for immunosensing
- Technical Paper
M. J. Oliver, J. Hernando-García, A. Ababneh, H. Seidel, U. Schmid, J. P. Andrés, P. Pobedinskas, K. Haenen, J. L. Sánchez-Rojas
Novel 3D manufacturing method combining microelectrial discharge machining and electrochemical polishing
- Technical Paper
Claudia Richter, Thomas Krah, Stephanus Büttgenbach
Cantilever probes for high speed AFM
- Technical Paper
C. Richter, P. Weinzierl, W. Engl, C. Penzkofer, B. Irmer, T. Sulzbach
Hysteresis correction of tactile sensor response with a generalized Prandtl–Ishlinskii model
- Technical Paper
José A. Sánchez-Durán, Óscar Oballe-Peinado, Julián Castellanos-Ramos, Fernando Vidal-Verdú
Modeling of gold microbeams as strain and pressure sensors for characterizing MEMS packages
- Technical Paper
A. Faes, G. Resta, F. Solazzi, B. Margesin
A MEMS-based thermal infrared emitter for an integrated NDIR spectrometer
- Technical Paper
C. Calaza, M. Salleras, N. Sabaté, J. Santander, C. Cané, L. Fonseca
Flexible and large area pressure sensors for human-neuroprostheses and human-neurorobotic interface assessment
- Technical Paper
J. Herrán, I. Fernández, E. Ochoteco, G. Cabañero, H. Grande, J. C. Moreno, E. Rocón, J. L. Pons
Integration of impedance spectroscopy sensors in a digital microfluidic platform
- Technical Paper
Thomas Lederer, Stefan Clara, Bernhard Jakoby, Wolfgang Hilber
Smart ultrasonic sensors systems: potential of aluminum nitride thin films for the excitation of the ultrasound at high frequencies
- Technical Paper
Susan Walter, Thomas Herzog, Henning Heuer, Hagen Bartzsch, Daniel Gloess
Battery-and wire-less tire pressure measurement systems (TPMS) sensor
- Technical Paper
Noaman Makki, Remon Pop-Iliev
Thin-film electro-acoustic sensors based on AlN and its alloys: possibilities and limitations
- Technical Paper
Gunilla Wingqvist
Binary Zero-Power Sensors: an alternative solution for power-free energy-autonomous sensor systems
- Open Access
- Technical Paper
Thomas Frank, Gerald Gerlach, Arndt Steinke
