Ausgabe 8/2009 Special Issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008
Inhalt (28 Artikel)
Foreword to special issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008
- Editorial
Bernard Courtois, Bernd Michel
Experimental validation of compact damping models of perforated MEMS devices
- Technical Paper
Timo Veijola, Giorgio De Pasquale, Aurelio Somà
Trapping of cells by insulator-based dielectrophoresis using open-top microstructures
- Technical Paper
Chun-Ping Jen, Teng-Wen Chen
Microfluidic device for continuous magnetophoretic separation of white blood cells
- Technical Paper
Ciprian Iliescu, Guolin Xu, Elena Barbarini, Marioara Avram, Andrei Avram
High quality factor silicon cantilever driven by piezoelectric thin film actuator for resonant based mass detection
- Technical Paper
Jian Lu, Tsuyoshi Ikehara, Yi Zhang, Takashi Mihara, Toshihiro Itoh, Ryutaro Maeda
Design and fabrication of novel micro electromagnetic actuator
- Technical Paper
Chia-Yen Lee, Zgen-Hui Chen, Hsien-Tseng Chang, Chih-Yung Wen, Chiang-Ho Cheng
Micro-hotplate based temperature stabilization system for CMOS SAW resonators
- Technical Paper
Anis Nurashikin Nordin, Ioana Voiculescu, Mona Zaghloul
A microwave probe nanostructure for atomic force microscopy
- Technical Paper
Y. Ju, M. Hamada, T. Kobayashi, H. Soyama
A microcantilever-based gas flow sensor for flow rate and direction detection
- Technical Paper
Rong-Hua Ma, Po-Cheng Chou, Yu-Hsiang Wang, Tzu-Han Hsueh, Lung-Ming Fu, Chia-Yen Lee
Design and development of a novel paddle test structure for the mechanical behavior measurement of thin films application for MEMS
- Technical Paper
Chi-Jia Tong, Ming-Tzer Lin
Linear and non-linear behavior of mechanical resonators for optimized inertial electromagnetic microgenerators
- Technical Paper
C. Serre, A. Pérez-Rodríguez, N. Fondevilla, E. Martincic, J. R. Morante, J. Montserrat, J. Esteve
Study on micro hot embossing of low temperature co-firable ceramic green substrates
- Technical Paper
Xuechuan Shan, H. P. Maw, S. H. Ling, Y. C. Lam
Design methodology and fabrication process of a microinductor for the next generation of DC–DC power converters
- Technical Paper
David Flynn, Marc P. Y. Desmulliez
Megasonic agitation for enhanced electrodeposition of copper
- Technical Paper
Jens Georg Kaufmann, Marc P. Y. Desmulliez, Yingtao Tian, Dennis Price, Mike Hughes, Nadia Strusevich, Chris Bailey, Changqing Liu, David Hutt
New high fill-factor triangular microlens array fabrication method using UV proximity printing
- Technical Paper
Tsung-Hung Lin, Hsiharng Yang, Ching-Kong Chao, Shih-Yu Hung
New high fill-factor triangular microlens array fabrication method using UV proximity printing
- Erratum
Tsung-Hung Lin, Hsiharng Yang, Ching-Kong Chao, Shih-Yu Hung
Micro-electroforming metallic bipolar electrodes for mini-DMFC stacks
- Technical Paper
Ruey Fang Shyu, Hsiharng Yang, Jun-Han Lee
A low-cost through via interconnection for ISM WLP
- Technical Paper
Jingli Yuan, Won-Kyu Jeung, Chang-Hyun Lim, Seung-Wook Park, Young-Do Kweon, Sung Yi
Contactless thermal characterization of high temperature test chamber
- Technical Paper
György Bognár, Z. Szűcs, V. Székely, M. Rencz
Processing and characterisation of precision microparts from nickel-based materials
- Technical Paper
D. M. Allen, H. J. Almond, K. Bedner, M. Cabeza, B. Courtot, A. Duval, S. A. Impey, M. Saumer
Characterization and modeling of electro-thermal MEMS structures
- Technical Paper
Péter Gábor Szabó, Vladimír Székely
Package hermeticity testing with thermal transient measurements
- Technical Paper
András Vass-Várnai, Márta Rencz
Study of mechanical response in micro-indentation of laminated ceramic green substrates
- Technical Paper
Y. C. Liu, Xuechuan Shan
A micro roller embossing process for structuring large-area substrates of laminated ceramic green tapes
- Technical Paper
Xuechuan Shan, Y. C. Soh, C. W. P. Shi, L. Jin, C. W. Lu
Sub-μm structured lotus surfaces manufacturing
- Technical Paper
Matthias Worgull, M. Heckele, T. Mappes, B. Matthis, G. Tosello, T. Metz, J. Gavillet, P. Koltay, H. N. Hansen
