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Microsystem Technologies

Ausgabe 9/2015 Special issue on design, test, integration and packaging of EMS/MOEMS, 2013

Inhalt (26 Artikel)

Miniaturization of package for an implantable heart monitoring device

  • Technical Paper

Anh-Tuan T. Nguyen, Fjodors Tjulkins, K. E. Aasmundtveit, Nils Hoivik, Lars Hoff, Kristin Imenes

The effect of sensing area position on the mechanical response of mass-detecting cantilever sensor

  • Technical Paper

Marius Pustan, Cristian Dudescu, Corina Birleanu

Suspended integration of pyrolytic carbon membrane on C-MEMS

  • Technical Paper

Shuang Xi, Tielin Shi, Hu Long, Liangliang Xu, Zirong Tang

Synthesis of Sn nanoparticles and their size effect on the melting point

  • Technical Paper

Yang Ju, Takafumi Tasaka, Hayato Yamauchi, Tomoki Nakagawa

Diagnosis of parametric defects in dual axis IC accelerometers

  • Technical Paper

Álvaro Gómez-Pau, Luz Balado, Joan Figueras

Using proximity exposure to produce asymmetrical lens for light control films

  • Technical Paper

Tung-Yu Chang, Chien-Hsin Hung, Zhen-Jie Lian, Hsiharng Yang

Reliability of RF MEMS capacitive and ohmic switches for space redundancy configurations

  • Technical Paper

Andrea Lucibello, Romolo Marcelli, Emanuela Proietti, Giancarlo Bartolucci, Viviana Mulloni, Benno Margesin

Multi-frequency CMOS oscillator based on CMOS MEMS SAW resonator

  • Technical Paper

Jamilah Karim, Ahmad Anwar Zainuddin, A. H. M. Zahirul Alam, Anis Nurashikin Nordin

Piezoelectric thin films for double electrode CMOS MEMS surface acoustic wave (SAW) resonator

  • Technical Paper

Aliza Aini Md Ralib, Anis Nurashikin Nordin, AHM Zahirul Alam, Uda Hashim, Raihan Othman

RF-MEMS packaging by using quartz caps and epoxy polymers

  • Technical Paper

Flavio Giacomozzi, Viviana Mulloni, Sabrina Colpo, Alessandro Faes, Guido Sordo, Stefano Girardi

A novel approach for MEMS with galvanic protection on SOI wafer

  • Technical Paper

Wenshan Wei, Weilong You, Wei Zhao, Zhengyin Yu, Jun Pang, Heng Yang

Influence of grains and surface roughness in boron and phosphorus implanted LPCVD polycrystalline silicon thin film

  • Technical Paper

Kulwant Singh, Sanjeev Kumar, Robin Joyce, Rajesh Saha, Soney Varghese, Jamil Akhtar

A silicon microring resonator with a nanolatch mechanism

  • Technical Paper

Syotaro Abe, Kazuhiro Hane

Fabrication of novel MEMS inertial switch with six layers on a metal substrate

  • Technical Paper

Liqun Du, Ming Zhao, Aoan Wang, Shengli Chen, Weirong Nie

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    MKVS GbR/© MKVS GbR, Nordson/© Nordson, ViscoTec/© ViscoTec, BCD Chemie GmbH, Merz+Benteli/© Merz+Benteli, Robatech/© Robatech, Ruderer Klebetechnik GmbH, Xometry Europe GmbH/© Xometry Europe GmbH, Atlas Copco/© Atlas Copco, Sika/© Sika, Medmix/© Medmix, Kisling AG/© Kisling AG, Dosmatix GmbH/© Dosmatix GmbH, Innotech GmbH/© Innotech GmbH, Hilger u. Kern GmbH, VDI Logo/© VDI Wissensforum GmbH, Dr. Fritz Faulhaber GmbH & Co. KG/© Dr. Fritz Faulhaber GmbH & Co. KG, ECHTERHAGE HOLDING GMBH&CO.KG - VSE, mta robotics AG/© mta robotics AG, Bühnen, The MathWorks Deutschland GmbH/© The MathWorks Deutschland GmbH, Spie Rodia/© Spie Rodia, Schenker Hydraulik AG/© Schenker Hydraulik AG