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Experimental Mechanics

Erschienen in:

01.01.2015

Multiscale Displacement Field Measurement Using Digital Image Correlation: Application to the Identification of Elastic Properties

verfasst von: J.-C. Passieux, F. Bugarin, C. David, J.-N. Périé, L. Robert

Erschienen in: Experimental Mechanics | Ausgabe 1/2015

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Abstract

As any Digital Image Correlation (DIC) method, Finite-Element (FE) based DIC methods lead to uncertainties which are related to the spatial resolution (in pixel/element). To overcome the tricky and well-known compromise between spatial resolution and uncertainty, a multiscale approach to FE-DIC is proposed. Additional nearfield images are used to improve locally the resolution of the measurement for a given measurement mesh. An automatic and accurate estimation of the nearfield/farfield transformation is obtained by a dedicated DIC based method, in order to bridge precisely the measurement performed at both scales. This multiscale measurement is then associated to a multiscale Finite Element Model Updating (FEMU) identification technique. After being validated on synthetic test cases, the method is applied to a tensile test carried out on an open-hole specimen made of glass/epoxy laminate. The four in-plane orthotropic elastic parameters are identified at different levels of loading. Results show that the multiscale approach greatly improves the uncertainty of both the measured displacements and the identified material parameters.

Vorheriger Artikel Estimation of Elastoplastic Parameters via Weighted FEMU and Integrated-DIC

Nächster Artikel Simultaneous Assessment of Mechanical Properties and Boundary Conditions Based on Digital Image Correlation

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Titel: Multiscale Displacement Field Measurement Using Digital Image Correlation: Application to the Identification of Elastic Properties
verfasst von: J.-C. Passieux
F. Bugarin
C. David
J.-N. Périé
L. Robert
Publikationsdatum: 01.01.2015
Verlag: Springer US
Erschienen in: Experimental Mechanics / Ausgabe 1/2015
Print ISSN: 0014-4851
Elektronische ISSN: 1741-2765
DOI: https://doi.org/10.1007/s11340-014-9872-4

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