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2018 | OriginalPaper | Buchkapitel

29. Nanosensors for Electronics Package Reliability

verfasst von : James E. Morris

Erschienen in: Nanopackaging

Verlag: Springer International Publishing

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Abstract

Metal nanoparticle applications are proliferating in nanoelectronics, e.g., in single-electron transistors, and in nanoelectronics packaging, e.g., with the introduction of nanoparticle nanocomposites, carbon nanotubes, nanoparticle conductive inks and vias, and underfill fillers. Nanosensors comprise a major segment of the new nanotechnology developments, and there are opportunities to exploit some of these concepts and devices in electronics package diagnostics and reliability prognostics. This chapter concentrates on two potential applications of one basic type of sensor structure (a metal nanodot array) for corrosion detection (by hydrogen sensing) and strain monitoring.

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Vorheriges Kapitel Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging

Nächstes Kapitel Application of Bio-nanotechnology to Electronic Packaging

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Titel: Nanosensors for Electronics Package Reliability
verfasst von: James E. Morris
Verlag: Springer International Publishing
Buch: Nanopackaging
Print ISBN: 978-3-319-90361-3

Electronic ISBN: 978-3-319-90362-0

Copyright-Jahr: 2018
DOI: https://doi.org/10.1007/978-3-319-90362-0_29

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