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Erschienen in:
1984 | OriginalPaper | Buchkapitel
Nondestructive Evaluation of Some Bonded Joints
verfasst von : T. C. Ward, Margaret Sheridan, D. L. Kotzev
Erschienen in: Adhesive Joints
Verlag: Springer US
Enthalten in: Professional Book Archive
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Free films and lap-shear bonded metal joints were compared with respect to their linear dynamic viscoelastic behavior. Thermosetting and thermoplastic adhesives were investigated. Damping phenomena and relative shear moduli indicated a broader mechanical relaxation occurring at higher temperatures in the bonded assemblies. Triblock copolymer model adhesives were used to illustrate the importance of sample preparation in the evaluation of bonded materials.