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Erschienen in: Journal of Materials Science: Materials in Electronics 24/2017

06.09.2017

Optimized sintering properties and temperature stability of MgZrTa2O8 ceramics with CuO addition for microwave application

verfasst von: Wang-Suo Xia, Lan-Yang Zhang, Ying Wang, Jun-Ting Zhang, Rong-Rong Feng, Li-Wei Shi

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 24/2017

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Abstract

Microwave dielectric ceramics CuO–modified MgZrTa2O8 were synthesized by the conventional solid-state reaction method. The effects of CuO additives on the sintering characteristics and microwave dielectric properties have been investigated. With CuO addition, the sintering temperature of MgZrTa2O8 ceramics can be effectively lowered from 1475 to 1375 °C without decreasing its dielectric properties obviously and the temperature coefficient of the resonant frequency of MgZrTa2O8 ceramics have been optimized to near-zero. The crystalline phase exhibited a wolframite crystal structure and no second phase was detected at low addition levels. The grain growth of CuO–modified MgZrTa2O8 ceramics was accelerated due to liquid phase effect. The relative dielectric constants (εr) were correlated with apparent density and were not significantly different for all levels of CuO concentration. The quality factors (Q × ƒ) and temperature coefficient of resonant frequency (τƒ), which were strongly dependent on the CuO concentration, were analyzed by the grain size and the dielectric constant respectively. A best Q × ƒ value of 116400 GHz and τƒ value of −6.19 ppm/℃ were obtained for specimen with 0.05 wt% CuO addition at 1375 °C.

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Metadaten
Titel
Optimized sintering properties and temperature stability of MgZrTa2O8 ceramics with CuO addition for microwave application
verfasst von
Wang-Suo Xia
Lan-Yang Zhang
Ying Wang
Jun-Ting Zhang
Rong-Rong Feng
Li-Wei Shi
Publikationsdatum
06.09.2017
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 24/2017
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-017-7790-9

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