Optimizing the dicing saw parameters of 60 μm wafer dicing street

Wafer surface dicing chipping can expand to impact chip circuits, which may cause serious defects during the IC assembly process, potentially resulting in IC circuit function failure. Throughout the semiconductor wafer process, the street design of wafer dicing is gradually narrowed, that raising the importance of controlling chipping performance. To obtain the key factor of dicing parameters, this paper studies and evaluates the dicing of a wafer with a street width of 60 µm and thickness of 200 µm using mechanical dicing saw and diamond dicing blade. In this design of experiment, experimental data were analyzed using analysis of variance to obtain key parameters for surface chipping. The results show that high cutting spindle speed of 50,000 rpm with shallow cutting depth of 50 µm provides better surface chipping performance, and improves chipping of abnormal base with a blade dicing saw.