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2007 | OriginalPaper | Buchkapitel

56. Packaging and Reliability Issues in Micro/Nano Systems

verfasst von : Jongbaeg Kim, Ph.D., Yu-Ting Cheng, Prof., Mu Chiao, Prof., Liwei Lin, Prof.

Erschienen in: Springer Handbook of Nanotechnology

Verlag: Springer Berlin Heidelberg

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Abstract

The potential of MEMS/NEMS technologies has been viewed as a revolution comparable or even bigger than that of microelectronics. These scientific and engineering advancements in micro-/nano-electromechanical systems (MEMS)/(NEMS) could bring previously unthinkable applications to reality, from space systems, environmental instruments, to daily-life appliances. As presented in previous chapters, the development of core MEMS/NEMS processes has already demonstrated a lot of commercial applications as well as future potentials with elaborate functionalities. However, creating a low-cost reliable package for the protection of these MEMS/NEMS products is still a very difficult task. Without addressing these packaging and reliability issues, no commercial products can be sold on the market. Packaging design and modeling, packaging material selection, packaging process integration, and packaging cost are the main issues to be considered. In this chapter, we will present the fundamentals of MEMS/NEMS packaging technology, including packaging processes, hermetic and vacuum encapsulations, thermal issues, packaging reliability, and future packaging trends. The future development of MEMS packaging will rely on the success of the implementation of several unique techniques, such as packaging design kits for system and circuit designer, low-cost wafer-level and chip-scale packaging techniques, effective testing techniques, and reliable fabrication of an interposer [56.1] with vertical through-interconnects for device integrations.

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Vorheriges Kapitel High Volume Manufacturing and Field Stability of MEMS Products

Nächstes Kapitel Technological Convergence from the Nanoscale

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Titel: Packaging and Reliability Issues in Micro/Nano Systems
verfasst von: Jongbaeg Kim, Ph.D.
Yu-Ting Cheng, Prof.
Mu Chiao, Prof.
Liwei Lin, Prof.
Verlag: Springer Berlin Heidelberg
Buch: Springer Handbook of Nanotechnology
Print ISBN: 978-3-540-29855-7

Electronic ISBN: 978-3-540-29857-1

Copyright-Jahr: 2007
DOI: https://doi.org/10.1007/978-3-540-29857-1_56

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