Skip to main content

2025 | OriginalPaper | Buchkapitel

Performance Assessment of Stretchable Interconnects for Flexible Electronic Systems

verfasst von : Gulafsha Bhatti, Yash Agrawal, Vinay Palaparthy, Rutu Parekh

Erschienen in: Proceedings of Third International Conference on Computational Electronics for Wireless Communications

Verlag: Springer Nature Singapore

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

Flexible electronic (FE) systems have been at the forefront of rapidly transforming and fast-growing e-industries. With upcoming enhanced technologies, rigid devices are now been replaced with emerging ultra-thin, flexible, and portable systems. The hardwiring in on-boards is also getting updated with stretchable interconnect. The stretchable interconnects are becoming one of the most eminent parts of FE systems and need high research attention. Correspondingly, to attain efficient stretchable interconnects performance analyses such as its varying structures, stretchability, parasitic impedance extraction, power, and delay are computed in this work. Five different stretchable interconnect structures viz, straight (St), zigzag (Zz), serpentine (Sp), horseshoe (Hs), and rectangular (Rt) have been considered. The different interconnect geometries are parameterized to varying strain and stress effects on ANSYS workbench. For all the considered geometries, their RLC parasitics are extracted using ANSYS Q3D tool. Further, the signal integrity and performance of all the stretchable interconnect structures have been analyzed at varying frequencies using Cadence Virtuoso EDA tool.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Literatur
3.
Zurück zum Zitat Somarathna KU, Khinda GS, Garakani B, Abbara EM, Stoffel N, Borgesen P, Poliks MD (2021) Printed stretchable conductors for smart clothing: the effect of conductor geometry and substrate properties on electromechanical behaviors. In: IEEE 71st Electronic Components and Technology Conference (ECTC). https://doi.org/10.1109/ectc32696.2021.00090 Somarathna KU, Khinda GS, Garakani B, Abbara EM, Stoffel N, Borgesen P, Poliks MD (2021) Printed stretchable conductors for smart clothing: the effect of conductor geometry and substrate properties on electromechanical behaviors. In: IEEE 71st Electronic Components and Technology Conference (ECTC). https://​doi.​org/​10.​1109/​ectc32696.​2021.​00090
14.
Zurück zum Zitat Dang W, Khan S, Lorenzelli L, Vinciguerra V, Dahiya R (2015) Stretchable interconnects using screen printed nanocomposites of mwcnts with PDMS and P(VDF-TrFE). In: 2015 11th conference on Ph.D. Research in Microelectronics and Electronics (PRIME). https://doi.org/10.1109/prime.2015.7251381 Dang W, Khan S, Lorenzelli L, Vinciguerra V, Dahiya R (2015) Stretchable interconnects using screen printed nanocomposites of mwcnts with PDMS and P(VDF-TrFE). In: 2015 11th conference on Ph.D. Research in Microelectronics and Electronics (PRIME). https://​doi.​org/​10.​1109/​prime.​2015.​7251381
16.
19.
Metadaten
Titel
Performance Assessment of Stretchable Interconnects for Flexible Electronic Systems
verfasst von
Gulafsha Bhatti
Yash Agrawal
Vinay Palaparthy
Rutu Parekh
Copyright-Jahr
2025
Verlag
Springer Nature Singapore
DOI
https://doi.org/10.1007/978-981-97-1943-3_20