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Erschienen in: Journal of Materials Science: Materials in Electronics 23/2017

22.08.2017

Phosphor–silicone interaction effects in high power white light emitting diode packages

verfasst von: Jiajie Fan, Mengni Zhang, Xiao Luo, Cheng Qian, Xuejun Fan, Aimin Ji, Guoqi Zhang

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 23/2017

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Abstract

As a widespread application of high power phosphor-converted white light emitting diodes (pc-WLEDs) with long lifetime and color-consistence, the highly reliable phosphor/silicone composite, one of core materials used for light-conversion, working under severe operation conditions has become increasingly necessary. This paper selects three widely used monochromatic phosphors (Aluminates, Silicates and Nitrides based) as well as a pristine silicone to determine the potential interaction effects in their phosphor/silicone composites operated under different environments. Firstly, the transient thermal quenching and long-term high temperature ageing tests are used to investigate the thermal stabilities of both monochromatic phosphor powders and phosphor/silicone composites. Furthermore, the degradation mechanisms of phosphor/silicone composites aged under the high temperature & blue light exposure and high temperature & high humidity conditions are studied by considering the interaction effect. The results show that: (1) the thermal stabilities of different phosphors are different and the phosphor/silicone composites have more severe thermal quenching effects than those of their corresponding phosphor powders, but with the similar degradation trends; (2) the blue light irradiation can deteriorate silicone which is related to the photolysis effect; (3) the moisture can accelerate the degradation of phosphor/silicone composites because the change of pH condition, owing to the dissolution of phosphor powders in moisture, can degrade both phosphors and silicone.

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Metadaten
Titel
Phosphor–silicone interaction effects in high power white light emitting diode packages
verfasst von
Jiajie Fan
Mengni Zhang
Xiao Luo
Cheng Qian
Xuejun Fan
Aimin Ji
Guoqi Zhang
Publikationsdatum
22.08.2017
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 23/2017
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-017-7692-x

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