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Erschienen in:
1976 | OriginalPaper | Buchkapitel
Photoetching and Screen-Printing Conductor Patterns
verfasst von : C. E. Jowett
Erschienen in: The Engineering of Microelectronic Thin and Thick Films
Verlag: Macmillan Education UK
Enthalten in: Professional Book Archive
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The development of a microwave hybrid integrated circuit capability is built around the necessity for obtaining and controlling conductor geometries to fine tolerances (fractions of a millimetre). The new discrete devices which are becoming available, such as flip-chip devices, and beam-lead devices, require not only the fine tolerances but also fine lines in the range of 0.050–0.127 mm line widths and line spaces.