Skip to main content

2015 | OriginalPaper | Buchkapitel

Physics-Based Modeling of Hot-Carrier Degradation

verfasst von : Stanislav Tyaginov

Erschienen in: Hot Carrier Degradation in Semiconductor Devices

Verlag: Springer International Publishing

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

We present and verify a physics-based model of hot-carrier degradation (HCD). This model is based on a thorough solution of the Boltzmann transport equation. Such a solution can be achieved using either a stochastic solver based on the Monte Carlo approach or a deterministic counterpart that is based on representation of the carrier energy distribution function as a series of spherical harmonics. We discuss and check two implementations of our model based on these methods. The model is verified vs. the HCD experimental data measured in long-channel transistors as well as in ultra-scaled MOSFETs. Because both stochastic and deterministic methods have advantages and shortcomings, we study the limits of applicability of these methods. We aim to cover and link all main features of HCD, namely, the interplay between hot and colder carriers, which leads to two competing mechanisms of bond breakage and the strong localization of hot-carrier damage. Our model is linked and compared with other approaches to HCD simulations. Special attention is paid to the importance of the particular model ingredients, such as competing mechanisms of the Si–H bond dissociation, electron–electron scattering, variations in the bond-breakage energy, as well as its reduction due to the interaction between the dipole moment of the bond and the electric field. We also analyze the role of electron–electron scattering in HCD measured in devices with different gate lengths.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Literatur
1.
Zurück zum Zitat E.H. Nicollian, C.N. Berglund, P.F. Schmidt, J.M. Andrews, Electrochemical charging of thermal SiO2 films by injected electron currents. J. Appl. Phys. 42(12), 5654–5664 (1971)CrossRef E.H. Nicollian, C.N. Berglund, P.F. Schmidt, J.M. Andrews, Electrochemical charging of thermal SiO2 films by injected electron currents. J. Appl. Phys. 42(12), 5654–5664 (1971)CrossRef
2.
Zurück zum Zitat T.H. Ning, P.W. Cook, R.H. Dennard, C.M. Osburn, S.E. Schuster, H.N. Yu, 1 μm most VLSI technology – Part IV: Hot-electron design constraints. IEEE Trans. Electron Dev. 26, 346–353 (1979)CrossRef T.H. Ning, P.W. Cook, R.H. Dennard, C.M. Osburn, S.E. Schuster, H.N. Yu, 1 μm most VLSI technology – Part IV: Hot-electron design constraints. IEEE Trans. Electron Dev. 26, 346–353 (1979)CrossRef
3.
Zurück zum Zitat C. Hu, Lucky electron model for channel hot electron emission, in Proceedings of the International Electron Devices Meeting (IEDM), 1979, pp. 22–25 C. Hu, Lucky electron model for channel hot electron emission, in Proceedings of the International Electron Devices Meeting (IEDM), 1979, pp. 22–25
4.
Zurück zum Zitat T. Mizuno, A. Toriumi, M. Iwase, M. Takanashi, H. Niiyama, M. Fukmoto, M. Yoshimi, Hot-carrier effects in 0. 1 μm gate length CMOS devices, in Proceedings of the International Electron Devices Meeting (IEDM), 1992, pp. 695–698 T. Mizuno, A. Toriumi, M. Iwase, M. Takanashi, H. Niiyama, M. Fukmoto, M. Yoshimi, Hot-carrier effects in 0. 1 μm gate length CMOS devices, in Proceedings of the International Electron Devices Meeting (IEDM), 1992, pp. 695–698
5.
Zurück zum Zitat A. Bravaix, C. Guerin, V. Huard, D. Roy, J. Roux, E. Vincent, Hot-carrier acceleration factors for low power management in DC-AC stressed 40nm NMOS node at high temperature, in Proceedings of the International Reliability Physics Symposium (IRPS), 2009, pp. 531–546 A. Bravaix, C. Guerin, V. Huard, D. Roy, J. Roux, E. Vincent, Hot-carrier acceleration factors for low power management in DC-AC stressed 40nm NMOS node at high temperature, in Proceedings of the International Reliability Physics Symposium (IRPS), 2009, pp. 531–546
6.
Zurück zum Zitat B. Tuttle, C.G. Van de Walle, Structure, energetics, and vibrational properties of Si–H bond dissociation in silicon. Phys. Rev. B 59(20), 12884–12889 (1999)CrossRef B. Tuttle, C.G. Van de Walle, Structure, energetics, and vibrational properties of Si–H bond dissociation in silicon. Phys. Rev. B 59(20), 12884–12889 (1999)CrossRef
7.
Zurück zum Zitat W. McMahon, K. Matsuda, J. Lee, K. Hess, J. Lyding, The effects of a multiple carrier model of interface states generation of lifetime extraction for MOSFETs, in Proceedings of the International Conference on Modelling and Simulation Micro, vol. 1, 2002, pp. 576–579 W. McMahon, K. Matsuda, J. Lee, K. Hess, J. Lyding, The effects of a multiple carrier model of interface states generation of lifetime extraction for MOSFETs, in Proceedings of the International Conference on Modelling and Simulation Micro, vol. 1, 2002, pp. 576–579
8.
Zurück zum Zitat S. Tyaginov, I. Starkov, H. Enichlmair, J.M. Park, C. Jungemann, T. Grasser, Physics-based hot-carrier degradation models (invited). ECS Trans. 35(4), 321–352 (2011)CrossRef S. Tyaginov, I. Starkov, H. Enichlmair, J.M. Park, C. Jungemann, T. Grasser, Physics-based hot-carrier degradation models (invited). ECS Trans. 35(4), 321–352 (2011)CrossRef
9.
Zurück zum Zitat P.A. Childs, C.C. Leung, New mechanism of hot carrier generation in very short channel MOSFETs. Electron. Lett. 31(2), 139–141 (1995)CrossRef P.A. Childs, C.C. Leung, New mechanism of hot carrier generation in very short channel MOSFETs. Electron. Lett. 31(2), 139–141 (1995)CrossRef
10.
Zurück zum Zitat S.E. Rauch, G. La Rosa, F.J. Guarin, Role of E-E scattering in the enhancement of channel hot carrier degradation of deep-submicron NMOSFETs at high V _gs conditions. IEEE Trans. Device Mater. Reliab. 1(2), 113–119 (2001)CrossRef S.E. Rauch, G. La Rosa, F.J. Guarin, Role of E-E scattering in the enhancement of channel hot carrier degradation of deep-submicron NMOSFETs at high V _gs conditions. IEEE Trans. Device Mater. Reliab. 1(2), 113–119 (2001)CrossRef
11.
Zurück zum Zitat J.D. Bude, Gate-current by impact ionization feedback in submicron MOSFET technologies, in Proceedings of the VLSI Symposium on Technical Digest, 1995, pp. 101–102 J.D. Bude, Gate-current by impact ionization feedback in submicron MOSFET technologies, in Proceedings of the VLSI Symposium on Technical Digest, 1995, pp. 101–102
12.
Zurück zum Zitat F. Venturi, E. Sangiorgi, B. Ricco, The impact of voltage scaling on electron heating and device performance of submicrometer MOSFET’s. IEEE Trans. Electron Devices 38(8), 1895–1904 (1991)CrossRef F. Venturi, E. Sangiorgi, B. Ricco, The impact of voltage scaling on electron heating and device performance of submicrometer MOSFET’s. IEEE Trans. Electron Devices 38(8), 1895–1904 (1991)CrossRef
13.
Zurück zum Zitat J.E. Chung, M.C. Jeng, J.E. Moon, P.K. Ko, C. Hu, Low-voltage hot-electron currents and degradation in deep-submicrometer MOSFET’s. IEEE Trans. Electron Devices 37, 1651–1657 (1990)CrossRef J.E. Chung, M.C. Jeng, J.E. Moon, P.K. Ko, C. Hu, Low-voltage hot-electron currents and degradation in deep-submicrometer MOSFET’s. IEEE Trans. Electron Devices 37, 1651–1657 (1990)CrossRef
14.
Zurück zum Zitat W. McMahon, A. Haggag, K. Hess, Reliability scaling issues for nanoscale devices. IEEE Trans. Nanotechnol. 2(1), 33–38 (2003)CrossRef W. McMahon, A. Haggag, K. Hess, Reliability scaling issues for nanoscale devices. IEEE Trans. Nanotechnol. 2(1), 33–38 (2003)CrossRef
15.
Zurück zum Zitat A. Bravaix, V. Huard, Hot-carrier degradation issues in advanced CMOS nodes, in Proceedings of the European Symposium on Reliability of Electron Devices Failure Physics and Analysis (ESREF), tutorial, 2010 A. Bravaix, V. Huard, Hot-carrier degradation issues in advanced CMOS nodes, in Proceedings of the European Symposium on Reliability of Electron Devices Failure Physics and Analysis (ESREF), tutorial, 2010
16.
Zurück zum Zitat S. Rauch, G. La Rosa, CMOS hot carrier: From physics to end of life projections, and qualification, in Proceedings of the International Reliability Physics Symposium (IRPS), tutorial, 2010 S. Rauch, G. La Rosa, CMOS hot carrier: From physics to end of life projections, and qualification, in Proceedings of the International Reliability Physics Symposium (IRPS), tutorial, 2010
17.
Zurück zum Zitat S.E. Tyaginov, I.A. Starkov, O. Triebl, J. Cervenka, C. Jungemann, S. Carniello, J.M. Park, H. Enichlmail, C. Kernstock, E. Seebacher, R. Minixhofer, H. Ceric, T. Grasser, Interface traps density-of-states as a vital component for hot-carrier degradation modeling. Microelectron. Reliab. 50, 1267–1272 (2010)CrossRef S.E. Tyaginov, I.A. Starkov, O. Triebl, J. Cervenka, C. Jungemann, S. Carniello, J.M. Park, H. Enichlmail, C. Kernstock, E. Seebacher, R. Minixhofer, H. Ceric, T. Grasser, Interface traps density-of-states as a vital component for hot-carrier degradation modeling. Microelectron. Reliab. 50, 1267–1272 (2010)CrossRef
18.
Zurück zum Zitat Y.M. Randriamihaja, A. Zaka, V. Huard, M. Rafik, D. Rideau, D. Roy, A. Bravaix, P. Palestri, Hot carrier degradation: From defect creation modeling to their impact on NMOS parameters, in Proceedings of the International Reliability Physics Symposium (IRPS), 2012, pp. 1–4 Y.M. Randriamihaja, A. Zaka, V. Huard, M. Rafik, D. Rideau, D. Roy, A. Bravaix, P. Palestri, Hot carrier degradation: From defect creation modeling to their impact on NMOS parameters, in Proceedings of the International Reliability Physics Symposium (IRPS), 2012, pp. 1–4
19.
Zurück zum Zitat Y.M. Randriamihaja, X. Federspiel, V. Huard, A. Bravaix, P. Palestri, New hot carrier degradation modeling reconsidering the role of EES in ultra short n-channel MOSFETs, in Proceedings of the International Reliability Physics Symposium (IRPS), 2013, pp. 1–5 Y.M. Randriamihaja, X. Federspiel, V. Huard, A. Bravaix, P. Palestri, New hot carrier degradation modeling reconsidering the role of EES in ultra short n-channel MOSFETs, in Proceedings of the International Reliability Physics Symposium (IRPS), 2013, pp. 1–5
20.
Zurück zum Zitat S. Tyaginov, M. Bina, J. Franco, D. Osintsev, O. Triebl, B. Kaczer, T. Grasser, Physical modeling of hot-carrier degradation for short- and long-channel MOSFETs, in Proceedings of the International Reliability Physics Symposium (IRPS), 2014 (in press) S. Tyaginov, M. Bina, J. Franco, D. Osintsev, O. Triebl, B. Kaczer, T. Grasser, Physical modeling of hot-carrier degradation for short- and long-channel MOSFETs, in Proceedings of the International Reliability Physics Symposium (IRPS), 2014 (in press)
21.
Zurück zum Zitat C. Jungemann, B. Meinerzhagen, Hierarchical Device Simulation (Springer, Wien/New York, 2003)CrossRefMATH C. Jungemann, B. Meinerzhagen, Hierarchical Device Simulation (Springer, Wien/New York, 2003)CrossRefMATH
22.
Zurück zum Zitat S.-M. Hong, A.T. Pham, C. Jungemann, Deterministic Solvers for the Boltzmann Transport Equation, Springer edition (Springer, New York, 2011) S.-M. Hong, A.T. Pham, C. Jungemann, Deterministic Solvers for the Boltzmann Transport Equation, Springer edition (Springer, New York, 2011)
23.
Zurück zum Zitat C. Guerin, V. Huard, A. Bravaix, The energy-driven hot-carrier degradation modes of nMOSFETs. IEEE Trans. Device Mater. Reliab. 7(2), 225–235 (2007)CrossRef C. Guerin, V. Huard, A. Bravaix, The energy-driven hot-carrier degradation modes of nMOSFETs. IEEE Trans. Device Mater. Reliab. 7(2), 225–235 (2007)CrossRef
24.
Zurück zum Zitat A. Bravaix, V. Huard, F. Cacho, X. Federspiel, D. Roy et al., Hot-carrier degradation in decananometer CMOS nodes: From an energy driven to a unified current degradation modeling by multiple carrier degradation process, in Hot-Carrier Degradation, ed. by T. Grasser (Springer, Wien/New York, 2015) A. Bravaix, V. Huard, F. Cacho, X. Federspiel, D. Roy et al., Hot-carrier degradation in decananometer CMOS nodes: From an energy driven to a unified current degradation modeling by multiple carrier degradation process, in Hot-Carrier Degradation, ed. by T. Grasser (Springer, Wien/New York, 2015)
25.
Zurück zum Zitat S. Rauch, G. La Rosa, The energy driven paradigm of NMOSFET hot carrier effects, in Proceedings of the International Reliability Physics Symposium (IRPS), 2005 S. Rauch, G. La Rosa, The energy driven paradigm of NMOSFET hot carrier effects, in Proceedings of the International Reliability Physics Symposium (IRPS), 2005
26.
Zurück zum Zitat S.E. Rauch, G. La Rosa, The energy-driven paradigm of NMOSFET hot-carrier effects. IEEE Trans. Device Mater. Reliab. 5(4), 701–705 (2005)CrossRef S.E. Rauch, G. La Rosa, The energy-driven paradigm of NMOSFET hot-carrier effects. IEEE Trans. Device Mater. Reliab. 5(4), 701–705 (2005)CrossRef
27.
Zurück zum Zitat S. Rauch, F. Guarin, The energy driven hot carrier model, in Hot-Carrier Degradation, ed. by T. Grasser (Springer, Wien/New York, 2015) S. Rauch, F. Guarin, The energy driven hot carrier model, in Hot-Carrier Degradation, ed. by T. Grasser (Springer, Wien/New York, 2015)
28.
Zurück zum Zitat Y.M. Randriamihaja, V. Huard, X. Federspiel, A. Zaka, P. Palestri, D. Rideau, A. Bravaix, Microscopic scale characterization and modeling of transistor degradation under HC stress. Microelectron. Reliab. 52(11), 2513–2520 (2012)CrossRef Y.M. Randriamihaja, V. Huard, X. Federspiel, A. Zaka, P. Palestri, D. Rideau, A. Bravaix, Microscopic scale characterization and modeling of transistor degradation under HC stress. Microelectron. Reliab. 52(11), 2513–2520 (2012)CrossRef
29.
Zurück zum Zitat M.G. Ancona, N.S. Saks, D. McCarthy, Lateral disrtribution of hot-carrier-induced interface traps in MOSFET’s. IEEE Trans. Electron Devices 35(12), 221–2228 (1988)CrossRef M.G. Ancona, N.S. Saks, D. McCarthy, Lateral disrtribution of hot-carrier-induced interface traps in MOSFET’s. IEEE Trans. Electron Devices 35(12), 221–2228 (1988)CrossRef
30.
Zurück zum Zitat Y. Leblebici, S.-M. Kang, Modeling of nMOS transistors for simulation of hot-carrier induced device abd circuit degradation. IEEE Trans. Comput. Aided Des. 11(2), 235–246 (1992)CrossRef Y. Leblebici, S.-M. Kang, Modeling of nMOS transistors for simulation of hot-carrier induced device abd circuit degradation. IEEE Trans. Comput. Aided Des. 11(2), 235–246 (1992)CrossRef
31.
Zurück zum Zitat A. Acovic, G. La Rosa, Y.C. Sun, A review of hot carrier degradation mechanism in MOSFETs. Microelectron. Reliab. 36(7/8), 845–869 (1996)CrossRef A. Acovic, G. La Rosa, Y.C. Sun, A review of hot carrier degradation mechanism in MOSFETs. Microelectron. Reliab. 36(7/8), 845–869 (1996)CrossRef
32.
Zurück zum Zitat I.A. Starkov, S.E. Tyaginov, H. Enichlmair, J. Cervenka, Ch. Jungemann, S. Carniello, J.M. Park, H. Ceric, T. Grasser, Hot-carrier degradation caused interface state profile - simulations vs. experiment. J. Vac. Sci. Technol. B 29(1), 01AB09–1–01AB09–8 (2011) I.A. Starkov, S.E. Tyaginov, H. Enichlmair, J. Cervenka, Ch. Jungemann, S. Carniello, J.M. Park, H. Ceric, T. Grasser, Hot-carrier degradation caused interface state profile - simulations vs. experiment. J. Vac. Sci. Technol. B 29(1), 01AB09–1–01AB09–8 (2011)
33.
Zurück zum Zitat D.J. DiMaria, J.W. Stasiak, Trap creation in silicon dioxide produced by hot electrons. J. Appl. Phys. 65(6), 2342–2356 (1989)CrossRef D.J. DiMaria, J.W. Stasiak, Trap creation in silicon dioxide produced by hot electrons. J. Appl. Phys. 65(6), 2342–2356 (1989)CrossRef
34.
Zurück zum Zitat D.J. DiMaria, Defect generation under substrate-hot-electron injection into ultrathin silicon dioxide layers. J. Appl. Phys. 86(4), 2100–2109 (1999)CrossRef D.J. DiMaria, Defect generation under substrate-hot-electron injection into ultrathin silicon dioxide layers. J. Appl. Phys. 86(4), 2100–2109 (1999)CrossRef
35.
Zurück zum Zitat D.J. DiMaria, J.H. Stathis, Anode hole injection, defect generation, and breakdown in ultrathin silicon dioxide films. J. Appl. Phys. 89(9), 5015–5024 (2001)CrossRef D.J. DiMaria, J.H. Stathis, Anode hole injection, defect generation, and breakdown in ultrathin silicon dioxide films. J. Appl. Phys. 89(9), 5015–5024 (2001)CrossRef
36.
Zurück zum Zitat I. Starkov, H. Enichlmair, S. Tyaginov, T. Grasser, Analysis of the threshold voltage turn-around effect in high-voltage n-MOSFETs due to hot-carrier stress, in Proceedings of the International Reliability Physics Symposium (IRPS), 2012, 6 pp. I. Starkov, H. Enichlmair, S. Tyaginov, T. Grasser, Analysis of the threshold voltage turn-around effect in high-voltage n-MOSFETs due to hot-carrier stress, in Proceedings of the International Reliability Physics Symposium (IRPS), 2012, 6 pp.
37.
Zurück zum Zitat K. Hess, L.F. Register, B. Tuttle, J. Lyding, I.C. Kizilyalli, Impact of nanostructure research on conventional solid-state electronics: The giant isotope effect in hydrogen desorption and CMOS lifetime. Phys. E 3, 1–7 (1998)CrossRef K. Hess, L.F. Register, B. Tuttle, J. Lyding, I.C. Kizilyalli, Impact of nanostructure research on conventional solid-state electronics: The giant isotope effect in hydrogen desorption and CMOS lifetime. Phys. E 3, 1–7 (1998)CrossRef
38.
Zurück zum Zitat S.E. Rauch, F.J. Guarin, G. La Rosa, Impact of E-E scattering to the hot carrier degradation of deep submicron NMOSFETs. IEEE Electron Device Lett. 19(12), 463–465 (1998)CrossRef S.E. Rauch, F.J. Guarin, G. La Rosa, Impact of E-E scattering to the hot carrier degradation of deep submicron NMOSFETs. IEEE Electron Device Lett. 19(12), 463–465 (1998)CrossRef
39.
Zurück zum Zitat E. Li, E. Rosenbaum, J. Tao, G.C.-F. Yeap, M.R. Lin, P. Fang, Hot-carrier effects in nMOSFETs in 0. 1 μm CMOS technology, in Proceedings of the International Reliability Physics Symposium (IRPS), 1999, pp. 253–258 E. Li, E. Rosenbaum, J. Tao, G.C.-F. Yeap, M.R. Lin, P. Fang, Hot-carrier effects in nMOSFETs in 0. 1 μm CMOS technology, in Proceedings of the International Reliability Physics Symposium (IRPS), 1999, pp. 253–258
40.
Zurück zum Zitat C. Lin, S. Biesemans, L.K. Han, K. Houlihan, T. Schiml, K. Schruefer, C. Wann, R. Markhopf, Hot carrier reliability for 0. 13 μm CMOS technology with dual gate oxide thickness, in Proceedings of the International Electron Devices Meeting (IEDM), 2000, 135–138 C. Lin, S. Biesemans, L.K. Han, K. Houlihan, T. Schiml, K. Schruefer, C. Wann, R. Markhopf, Hot carrier reliability for 0. 13 μm CMOS technology with dual gate oxide thickness, in Proceedings of the International Electron Devices Meeting (IEDM), 2000, 135–138
41.
Zurück zum Zitat R. Woltjer, A. Hamada, E. Takeda, PMOSFET hot carrier damage: Oxide charge and interface states. Semicond. Sci. Technol. 7, B581–B584 (1992)CrossRef R. Woltjer, A. Hamada, E. Takeda, PMOSFET hot carrier damage: Oxide charge and interface states. Semicond. Sci. Technol. 7, B581–B584 (1992)CrossRef
42.
Zurück zum Zitat F.-C. Hsu, K.-Y. Chu, Temperature dependence of hot-electron induced degradation in MOSFET’s, IEEE Electron Device Lett. 5(5), 148–150 (1984)CrossRef F.-C. Hsu, K.-Y. Chu, Temperature dependence of hot-electron induced degradation in MOSFET’s, IEEE Electron Device Lett. 5(5), 148–150 (1984)CrossRef
43.
Zurück zum Zitat P.A. Childs, C.C. Leung, A onedimensional solution of the Boltzmann transport equation including eelectron–electron interactions. J. Appl. Phys. 79(1), 222–227 (1996)CrossRef P.A. Childs, C.C. Leung, A onedimensional solution of the Boltzmann transport equation including eelectron–electron interactions. J. Appl. Phys. 79(1), 222–227 (1996)CrossRef
44.
Zurück zum Zitat B. Ricco, E. Sangiorgi, D. Cantrarelli, Low voltage hot-electron effects in short channel MOSFETs, in Proceedings of the International Electron Devices Meeting (IEDM), 1984, pp. 92–95 B. Ricco, E. Sangiorgi, D. Cantrarelli, Low voltage hot-electron effects in short channel MOSFETs, in Proceedings of the International Electron Devices Meeting (IEDM), 1984, pp. 92–95
45.
Zurück zum Zitat A. Abramo, C. Fiegna, F. Venturi, Hot carrier effects in short MOSFETs at low applied voltages. IEDM Tech. Dig. 301–304 (1995) A. Abramo, C. Fiegna, F. Venturi, Hot carrier effects in short MOSFETs at low applied voltages. IEDM Tech. Dig. 301–304 (1995)
46.
Zurück zum Zitat J.W. Lyding, K. Hess, I.C. Kizilyalli, Reduction of hot electron degradation in metal oxide semiconductor transistors by deuterium processing. Appl. Phys. Lett. 68(18), 2526–2528 (1996)CrossRef J.W. Lyding, K. Hess, I.C. Kizilyalli, Reduction of hot electron degradation in metal oxide semiconductor transistors by deuterium processing. Appl. Phys. Lett. 68(18), 2526–2528 (1996)CrossRef
47.
Zurück zum Zitat K. Hess, A. Haggag, W. McMahon, B. Fischer, K. Cheng, J. Lee, L. Lyding, Simulation of Si-SiO2 defect generation in CMOS chips: From atomistic structure to chip failure rates, in Proceedings of the International Electron Devices Meeting (IEDM), 2000, pp. 93–96 K. Hess, A. Haggag, W. McMahon, B. Fischer, K. Cheng, J. Lee, L. Lyding, Simulation of Si-SiO2 defect generation in CMOS chips: From atomistic structure to chip failure rates, in Proceedings of the International Electron Devices Meeting (IEDM), 2000, pp. 93–96
48.
Zurück zum Zitat A. Haggag, W. McMahon, K. Hess, K. Cheng, J. Lee, J. Lyding, High-performance chip reliability from short-time-tests. statistical models for optical interconnect and HCI/TDDB/NBTI deep-submicron transistor failures, in Proceedings of the International Reliability Physics Symposium (IRPS), 2001, pp. 271–279 A. Haggag, W. McMahon, K. Hess, K. Cheng, J. Lee, J. Lyding, High-performance chip reliability from short-time-tests. statistical models for optical interconnect and HCI/TDDB/NBTI deep-submicron transistor failures, in Proceedings of the International Reliability Physics Symposium (IRPS), 2001, pp. 271–279
49.
Zurück zum Zitat C. Guerin, V. Huard, A. Bravaix, General framework about defect creation at the Si∕SiO2 interface. J. Appl. Phys. 105, 114513–1–114513–12 (2009) C. Guerin, V. Huard, A. Bravaix, General framework about defect creation at the Si∕SiO2 interface. J. Appl. Phys. 105, 114513–1–114513–12 (2009)
50.
Zurück zum Zitat B.N.J. Persson, Ph. Avouris, Local bond breaking via STM-induced excitations: The role of temperature. Surf. Sci. 390(1–3), 45–54 (1997)CrossRef B.N.J. Persson, Ph. Avouris, Local bond breaking via STM-induced excitations: The role of temperature. Surf. Sci. 390(1–3), 45–54 (1997)CrossRef
51.
Zurück zum Zitat J.W. Lyding, K. Hess, G.C. Abeln, D.S. Thompson, J.S. Moore, M.C. Hersam, E.T. Foley, J. Lee, S.T. Hwang, H. Choi, Ph. Avouris, I.C. Kizialli, Ultrahigh vacuum-scanning tunneling microscopy nanofabrication and hydrogen/deuterium desorption from silicon surfaces: Implications for complementary metal oxide semiconductor technology. Appl. Surf. Sci. 13-132, 221–230 (1998)CrossRef J.W. Lyding, K. Hess, G.C. Abeln, D.S. Thompson, J.S. Moore, M.C. Hersam, E.T. Foley, J. Lee, S.T. Hwang, H. Choi, Ph. Avouris, I.C. Kizialli, Ultrahigh vacuum-scanning tunneling microscopy nanofabrication and hydrogen/deuterium desorption from silicon surfaces: Implications for complementary metal oxide semiconductor technology. Appl. Surf. Sci. 13-132, 221–230 (1998)CrossRef
52.
Zurück zum Zitat K. Stokbro, C. Thirstrup, M. Sakurai, U. Quaade, B.Y.-K. Hu, F. Perez-Murano, F. Grey, STM-induced hydrogen desorption via a hole resonance. Phys. Rev. Lett. 80, 2618–2621 (1998)CrossRef K. Stokbro, C. Thirstrup, M. Sakurai, U. Quaade, B.Y.-K. Hu, F. Perez-Murano, F. Grey, STM-induced hydrogen desorption via a hole resonance. Phys. Rev. Lett. 80, 2618–2621 (1998)CrossRef
53.
Zurück zum Zitat A. Stesmans, Revision of H2 passivation of P2 interface defects in standard (111)Si∕SiO2. Appl. Phys. Lett. 68(19), 2723–2725 (1996)CrossRef A. Stesmans, Revision of H2 passivation of P2 interface defects in standard (111)Si∕SiO2. Appl. Phys. Lett. 68(19), 2723–2725 (1996)CrossRef
54.
Zurück zum Zitat A. Stesmans, Passivation of Pb0 and Pb1 interface defects in thermal (100) Si∕SiO2 with molecular hydrogen. Appl. Phys. Lett. 68(15), 2076–2078 (1996)CrossRef A. Stesmans, Passivation of Pb0 and Pb1 interface defects in thermal (100) Si∕SiO2 with molecular hydrogen. Appl. Phys. Lett. 68(15), 2076–2078 (1996)CrossRef
55.
Zurück zum Zitat G. Pobegen, S. Tyaginov, M. Nelhiebel, T. Grasser, Observation of normally distributed activation energies for the recovery from hot carrier damage. IEEE Electron Device Lett. 34(8), 939–941 (2013)CrossRef G. Pobegen, S. Tyaginov, M. Nelhiebel, T. Grasser, Observation of normally distributed activation energies for the recovery from hot carrier damage. IEEE Electron Device Lett. 34(8), 939–941 (2013)CrossRef
56.
Zurück zum Zitat K. Hess, A. Haggag, W. McMahon, K. Cheng, J. Lee, J. Lyding, The physics of determining chip reliability. Circuits Devices Mag. 33–38 (2001) K. Hess, A. Haggag, W. McMahon, K. Cheng, J. Lee, J. Lyding, The physics of determining chip reliability. Circuits Devices Mag. 33–38 (2001)
57.
Zurück zum Zitat O. Penzin, A. Haggag, W. McMahon, E. Lyumkis, K. Hess, MOSFET degradation kinetics and its simulation. IEEE Trans. Electron Devices 50(6), 1445–1450 (2003)CrossRef O. Penzin, A. Haggag, W. McMahon, E. Lyumkis, K. Hess, MOSFET degradation kinetics and its simulation. IEEE Trans. Electron Devices 50(6), 1445–1450 (2003)CrossRef
58.
Zurück zum Zitat C. Guerin, V. Huard, A. Bravaix, The energy-driven hot carrier degradation modes, in Proceedings of the International Reliability Physics Symposium (IRPS), 2007, pp. 692–693 C. Guerin, V. Huard, A. Bravaix, The energy-driven hot carrier degradation modes, in Proceedings of the International Reliability Physics Symposium (IRPS), 2007, pp. 692–693
59.
Zurück zum Zitat A. Bravaix, V. Huard, D. Goguenheim, E. Vincent, Hot-carrier to cold-carrier device lifetime modeling with temperature for low power 40nm Si-Bulk NMOS and PMOS FETs, in Proceedings of the International Electron Devices Meeting (IEDM), 2011, pp. 622–625 A. Bravaix, V. Huard, D. Goguenheim, E. Vincent, Hot-carrier to cold-carrier device lifetime modeling with temperature for low power 40nm Si-Bulk NMOS and PMOS FETs, in Proceedings of the International Electron Devices Meeting (IEDM), 2011, pp. 622–625
60.
Zurück zum Zitat S.E. Tyaginov, I.A. Starkov, O. Triebl, J. Cervenka, C. Jungemann, S. Carniello, J.M. Park, H. Enichlmair, M. Karner, Ch. Kernstock, E. Seebacher, R. Minixhofer, H. Ceric, T. Grasser, Hot-carrier degradation modeling using full-band Monte-Carlo simulations, in Proceedings of the International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA), 2010 S.E. Tyaginov, I.A. Starkov, O. Triebl, J. Cervenka, C. Jungemann, S. Carniello, J.M. Park, H. Enichlmair, M. Karner, Ch. Kernstock, E. Seebacher, R. Minixhofer, H. Ceric, T. Grasser, Hot-carrier degradation modeling using full-band Monte-Carlo simulations, in Proceedings of the International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA), 2010
61.
Zurück zum Zitat S. Tyaginov, I. Starkov, O. Triebl, H. Enichlmair, C. Jungemann, J.M. Park, H. Ceric, T. Grasser, Secondary generated holes as a crucial component for modeling of HC degradation in high-voltage n-MOSFET, in Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2011, pp. 123–126 S. Tyaginov, I. Starkov, O. Triebl, H. Enichlmair, C. Jungemann, J.M. Park, H. Ceric, T. Grasser, Secondary generated holes as a crucial component for modeling of HC degradation in high-voltage n-MOSFET, in Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2011, pp. 123–126
62.
Zurück zum Zitat S. Tyaginov, I. Starkov, Ch. Jungemann, H. Enichlmair, J.M. Park, T. Grasser, Impact of the carrier distribution function on hot-carrier degradation modeling, in Proceedings of the European Solid-State Device Research Conference (ESSDERC), 2011, pp. 151–154 S. Tyaginov, I. Starkov, Ch. Jungemann, H. Enichlmair, J.M. Park, T. Grasser, Impact of the carrier distribution function on hot-carrier degradation modeling, in Proceedings of the European Solid-State Device Research Conference (ESSDERC), 2011, pp. 151–154
63.
Zurück zum Zitat Institute for Microelectronic, TU Wien, MiniMOS-NT Device and Circuit Simulator Institute for Microelectronic, TU Wien, MiniMOS-NT Device and Circuit Simulator
64.
Zurück zum Zitat I. Starkov, H. Enichlmair, S. Tyaginov, T. Grasser, Charge-pumping extraction techniques for hot-carrier induced interface and oxide trap spatial distributions in MOSFETs, in Proceedings of the International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA), 2012, pp. 1–6 I. Starkov, H. Enichlmair, S. Tyaginov, T. Grasser, Charge-pumping extraction techniques for hot-carrier induced interface and oxide trap spatial distributions in MOSFETs, in Proceedings of the International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA), 2012, pp. 1–6
65.
Zurück zum Zitat T. Grasser, T.-W. Tang, H. Kosina, S. Selberherr, A review of hydrodynamic and energy-transport models for semiconductor device simulation. Proc. IEEE 91(2), 251–273 (2003)CrossRef T. Grasser, T.-W. Tang, H. Kosina, S. Selberherr, A review of hydrodynamic and energy-transport models for semiconductor device simulation. Proc. IEEE 91(2), 251–273 (2003)CrossRef
66.
Zurück zum Zitat T. Grasser, C. Jungemann, H. Kosina, B. Meinerzhagen, S. Selberherr, Advanced transport models for sub-micrometer devices, in Proceedings of the Simulation of Semiconductor Processes and Devices (SISPAD), 2004, pp. 1–8 T. Grasser, C. Jungemann, H. Kosina, B. Meinerzhagen, S. Selberherr, Advanced transport models for sub-micrometer devices, in Proceedings of the Simulation of Semiconductor Processes and Devices (SISPAD), 2004, pp. 1–8
67.
Zurück zum Zitat A. Zaka, Q. Rafhay, M. Iellina, P. Palestri, R. Clerc, D. Rideau, D. Garetto, J. Singer, G. Pananakakis, C. Tavernier, H. Jaouen, On the accuracy of current TCAD hot carrier injection models in nanoscale devices. Solid State Electron. 54(12), 1669–1674 (2010)CrossRef A. Zaka, Q. Rafhay, M. Iellina, P. Palestri, R. Clerc, D. Rideau, D. Garetto, J. Singer, G. Pananakakis, C. Tavernier, H. Jaouen, On the accuracy of current TCAD hot carrier injection models in nanoscale devices. Solid State Electron. 54(12), 1669–1674 (2010)CrossRef
68.
Zurück zum Zitat A. Gehring, T. Grasser, H. Kosina, S. Selberherr, Simulation of hot-electron oxide tunneling current based on a non-Maxwellian electron energy distribution function. J. Appl. Phys. 92(10), 6019–6027 (2002)CrossRef A. Gehring, T. Grasser, H. Kosina, S. Selberherr, Simulation of hot-electron oxide tunneling current based on a non-Maxwellian electron energy distribution function. J. Appl. Phys. 92(10), 6019–6027 (2002)CrossRef
69.
Zurück zum Zitat T. Grasser, H. Kosina, S. Selberherr, Influence of the distribution function shape and the band structure on impact ionization modeling. J. Appl. Phys. 90(12), 6165–6171 (2001)CrossRef T. Grasser, H. Kosina, S. Selberherr, Influence of the distribution function shape and the band structure on impact ionization modeling. J. Appl. Phys. 90(12), 6165–6171 (2001)CrossRef
70.
Zurück zum Zitat A. Gnudi, D. Ventura, G. Baccarani, One-dimensional simulation of a bipolar transistor by means of spherical harmonics expansion of the Boltzmann transport equation, in Proceedings of the Simulation of Semiconductor Devices and Processes (SISDEP), vol. 4, 1991, pp. 205–213 A. Gnudi, D. Ventura, G. Baccarani, One-dimensional simulation of a bipolar transistor by means of spherical harmonics expansion of the Boltzmann transport equation, in Proceedings of the Simulation of Semiconductor Devices and Processes (SISDEP), vol. 4, 1991, pp. 205–213
71.
Zurück zum Zitat A. Gnudi, D. Ventura, G. Baccarani, F. Oden, Two-dimensional MOSFET simulations by means of a multidimensional spherical harmonics expansion of the Boltzmann transport equation. Solid State Electron. 36(4), 575–581 (1993)CrossRef A. Gnudi, D. Ventura, G. Baccarani, F. Oden, Two-dimensional MOSFET simulations by means of a multidimensional spherical harmonics expansion of the Boltzmann transport equation. Solid State Electron. 36(4), 575–581 (1993)CrossRef
72.
Zurück zum Zitat K. Rupp, T. Grasser, A. Jungel, On the feasibility of spherical harmonics expansions of the Boltzmann transport equation for three-dimensional device geometries, in Proceedings of the International Electron Devices Meeting (IEDM), 2011, pp. 789–792 K. Rupp, T. Grasser, A. Jungel, On the feasibility of spherical harmonics expansions of the Boltzmann transport equation for three-dimensional device geometries, in Proceedings of the International Electron Devices Meeting (IEDM), 2011, pp. 789–792
73.
Zurück zum Zitat K. Rupp, P. Lagger, T. Grasser, A. Jüngel, Inclusion of carrier-carrier-scattering into arbitrary-order spherical harmonics expansions of the Boltzmann transport equation, in Proceedings of the International Workshop on Computational Electronics (IWCE), 2012, pp. 1–4 K. Rupp, P. Lagger, T. Grasser, A. Jüngel, Inclusion of carrier-carrier-scattering into arbitrary-order spherical harmonics expansions of the Boltzmann transport equation, in Proceedings of the International Workshop on Computational Electronics (IWCE), 2012, pp. 1–4
74.
Zurück zum Zitat M. Bina, K. Rupp, S. Tyaginov, O. Triebl, T. Grasser, Modeling of hot carrier degradation using a spherical harmonics expansion of the bipolar Boltzmann transport equation, in Proceedings of the International Electron Devices Meeting (IEDM), 2012, pp. 713–716 M. Bina, K. Rupp, S. Tyaginov, O. Triebl, T. Grasser, Modeling of hot carrier degradation using a spherical harmonics expansion of the bipolar Boltzmann transport equation, in Proceedings of the International Electron Devices Meeting (IEDM), 2012, pp. 713–716
75.
Zurück zum Zitat S. Tyaginov, M. Bina, J. Franco, D. Osintsev, Y. Wimmer, O. Triebl, B. Kaczer, T. Grasser, Essential ingredients for modeling of hot-carrier degradation in ultra-scaled MOSFETs, in Proceedings of the International Integrated Reliability Workshop (IIRW), 2013, pp. 98–101 S. Tyaginov, M. Bina, J. Franco, D. Osintsev, Y. Wimmer, O. Triebl, B. Kaczer, T. Grasser, Essential ingredients for modeling of hot-carrier degradation in ultra-scaled MOSFETs, in Proceedings of the International Integrated Reliability Workshop (IIRW), 2013, pp. 98–101
76.
Zurück zum Zitat J.W. McPherson, Quantum mechanical treatment of Si-O bond breakage in silica under time dependent dielectric breakdown testing, in Proceedings of the International Reliability Physics Symposium (IRPS), 2007, pp. 209–216 J.W. McPherson, Quantum mechanical treatment of Si-O bond breakage in silica under time dependent dielectric breakdown testing, in Proceedings of the International Reliability Physics Symposium (IRPS), 2007, pp. 209–216
77.
Zurück zum Zitat V. Huard, M. Denais, C. Parthasarathy, NBTI degradation: From physical mechanisms to modelling. Microelectron. Reliab. 46(1), 1–23 (2006)CrossRef V. Huard, M. Denais, C. Parthasarathy, NBTI degradation: From physical mechanisms to modelling. Microelectron. Reliab. 46(1), 1–23 (2006)CrossRef
78.
Zurück zum Zitat S. Tyaginov, M. Bina, J. Franco, Y. Wimmer, D. Osintsev, B. Kaczer, T. Grasser, A predictive physical model for hot-carrier degradation in ultra-scaled MOSFETs, in Proceedings of the Simulation of Semiconductor Processes and Devices (SISPAD), 2014 (submitted) S. Tyaginov, M. Bina, J. Franco, Y. Wimmer, D. Osintsev, B. Kaczer, T. Grasser, A predictive physical model for hot-carrier degradation in ultra-scaled MOSFETs, in Proceedings of the Simulation of Semiconductor Processes and Devices (SISPAD), 2014 (submitted)
Metadaten
Titel
Physics-Based Modeling of Hot-Carrier Degradation
verfasst von
Stanislav Tyaginov
Copyright-Jahr
2015
DOI
https://doi.org/10.1007/978-3-319-08994-2_4

Neuer Inhalt