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Erschienen in:
2001 | OriginalPaper | Buchkapitel
Plastic Ball Grid Array
verfasst von : Mark J. Kuzawinski, Thomas R. Homa
Erschienen in: Area Array Interconnection Handbook
Verlag: Springer US
Enthalten in: Professional Book Archive
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Plastic Ball Grid Array (PBGA) packages are modules constructed utilizing standard printed circuit card and board technologies. The typical PBGA substrate is a thin (less than 0.035 inches) laminate similar to card technologies used for personal computers. Although the interconnections between a chip and substrate are typically wire bonds, flip-chip dice can be attached to PBGA packages as well. PBGA technologies also support chip scale packaging (CSP) discussed in Chapters 18 and 23.