Skip to main content

Polymer Science, Series D

Ausgabe 2/2015

Inhalt (17 Artikel)

Modeling of plastic deformation of glasses in creeping and stress relaxation regimes

Al. Al. Berlin, M. A. Mazo, I. A. Strel’nikov, N. K. Balabaev

The influence of formation conditions on the kinetics of chemical cross linking of coverings based on chlorosulphonated polyethylene

A. Kh. Gumarov, S. N. Rusanova, I. R. Valiullin, V. G. Ivanov, R. M. Garipov, O. V. Stoyanov

Structure and properties of ultrathin poly-(3-hydroxybutirate) fibers modified by silicon and titanium dioxide particles

A. A. Olkhov, O. V. Staroverova, A. P. Bonartsev, I. I. Zharkova, E. D. Sklyanchuk, A. L. Iordanskii, S. Z. Rogovina, A. A. Berlin, A. A. Ishchenko

Changes in the characteristics of a high-filled polymeric compound in the area of its fastening to a rigid multilayer substrate

O. I. Sidorov, Yu. M. Milekhin, A. A. Matveev, T. P. Poisova, L. A. Davydova, E. I. Leonov

Film structural adhesives

A. P. Petrova, N. F. Lukina, L. A. Dement’eva, L. I. Anikhovskaya

Modification of acrylic adhesives with maleimides and copolymers of maleimide with methacrylic monomers

O. S. Goncharova, D. A. Aronovich, Z. S. Khamidulova, N. V. Zaitova, K. V. Shirshin

Designing new adhesive materials based on epoxy oligomers filled with organic compounds

A. V. Pestov, V. A. Kuznetsov, A. V. Mekhaev, T. I. Gorbunova, V. I. Saloutin, S. V. Smirnov, D. I. Vichuzhanin, P. P. Matafonov

A study of the mechanism of curing of the dicyandiamide-epoxydiane oligomer system in the presence of asymmetrical urea

L. V. Chursova, A. I. Tkachuk, N. N. Panina, Ya. M. Gurevich, A. N. Babin, G. V. Malkov

A thermoset structural acryl adhesive

O. A. Sineokova, Z. S. Khamidulova, O. G. Zhdanova, A. P. Sineokov

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen.