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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 12/2015

04.09.2015

Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with a low modulus solder at its ends

verfasst von: Ephraim Suhir, Reza Ghaffarian

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 12/2015

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Abstract

A simple, easy-to-use and physically meaningful predictive model is suggested for the assessment of thermal stresses in a ball-grid-array or a column-grid-array with a low modulus solder material at the peripheral portions of the assembly. It is shown that the application of such a design can lead to a considerable relief in the interfacial stresses, even to an extent that inelastic strains in the solder joints could be avoided. If this happens, the fatigue strength of the bond and of the assembly as a whole will be improved dramatically: low-cycle fatigue conditions will be replaced by the elastic fatigue condition, and Palmgren–Minor rule of linear accumulation of damages could be used instead of one of the numerous Coffin–Manson models to assess the lifetime of the material.
Vorheriger Artikel Band gap tailoring and enhanced visible emission by two-step annealing in Zn0.94Cu0.04Cr0.02O nanocrystals
Nächster Artikel Influence of oxygen pressure on the growth and physical properties of pulsed laser deposited Cu2O thin films

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Metadaten
Titel
Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with a low modulus solder at its ends
verfasst von
Ephraim Suhir
Reza Ghaffarian
Publikationsdatum
04.09.2015
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 12/2015
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-015-3635-6

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