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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 5/2016

19.01.2016

Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with an epoxy adhesive at its ends

verfasst von: E. Suhir, R. Ghaffarian

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 5/2016

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Abstract

A simple, easy-to-use and physically meaningful predictive model is suggested for the assessment of the thermal stresses in a ball-grid-array (BGA) or a column-grid-array (CGA) system with an epoxy adhesive at the peripheral portions of the assembly. It is shown that the application of such a design can lead to a considerable relief in the interfacial stress. The paper is a continuation and an extension of the recently published paper, in which a low modulus solder was considered for the peripheral portions of the assembly. The important difference is that while the soldering temperature has been assumed to be the same for the solder material throughout the assembly, the peripheral epoxy adhesive is applied at an appreciably lower (curing) temperature than the solder at the assembly’s mid-portion. The numerical example has indicated that the application of the CGA technology enables one to achieve a 19.25 % stress relief in the case of an epoxy adhesive, while a 34.11 % stress relief could be expected in the case of a low modulus solder at the assembly ends. When a BGA technology is considered, the application of an epoxy or a low modulus solder at the peripheral portions of the assembly leads to the stress relief of about 14.42 % in the case of an epoxy and of about 12.80 % in the case of a low modulus solder. When CGA technology is used, the application of an epoxy at the peripheral portions of the assembly leads to about 8.70 % stress relief, while the application of a low modulus solder results in about 24.10 % relief. It is concluded that, with the yield stress in shear of 1.85 kgf/mm2 for the solder in the assembly’s mid-portion and 1.35 kgf/mm2—for the peripheral solder material, the application of the CGA technology in combination with an epoxy adhesive or a low modulus solder at the assembly ends might enable one to avoid inelastic strains in the solder, thereby increasing dramatically its fatigue lifetime, just because the low-cycle fatigue situation will be replaced in such a case with the elastic fatigue condition.
Vorheriger Artikel Luminescence and magnetism studies of strongly quantum confined SnO2 dots
Nächster Artikel Direct growth of CuO/ITO nanowires by the vapor solid oxidation method

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Metadaten
Titel
Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with an epoxy adhesive at its ends
verfasst von
E. Suhir
R. Ghaffarian
Publikationsdatum
19.01.2016
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 5/2016
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-016-4310-2

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