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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 3/2016

25.11.2015

Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package design

verfasst von: E. Suhir, R. Ghaffarian, J. Nicolics

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 3/2016

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Abstract

There is an obvious incentive for using bow-free (temperature change insensitive) assemblies in various areas of engineering, including electron device and electronic packaging fields. The induced stresses in a bow-free assembly could be, however, rather high, considerably higher than in an assembly, whose bow is not restricted. The simplest and trivial case of a bow-free assembly is a tri-component body, in which the inner component is sandwiched between two identical outer components (“mirror” structure), is addressed in our analysis, and a simple and physically meaningful analytical stress model is suggested. It is concluded that if acceptable stresses (below yield stress of the solder material) are achievable, a mirror (bow-free, temperature-change-insensitive) design should be preferred, because it results in an operationally stable performance of the system.
Vorheriger Artikel Studies on phase change Ge15Se77Sb8 thin films by laser irradiation
Nächster Artikel Flexible organic photo-thermogalvanic cell for low power applications

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Metadaten
Titel
Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package design
verfasst von
E. Suhir
R. Ghaffarian
J. Nicolics
Publikationsdatum
25.11.2015
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 3/2016
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-015-4042-8

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