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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 16/2019

05.08.2019

Preparation of highly conductive silver nanowires for electrically conductive adhesives

verfasst von: Jing Lu, Di Liu, Junfu Dai

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 16/2019

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Abstract

In this work, we reported a modified two-step polyol method to fabricate silver nanowires (AgNWs). The function of the reaction temperature and the first step and second step time was investigated. Through monitoring the experimental conditions, uniform AgNWs with a high aspect ratio were obtained. To further improve the electrical performance of the AgNWs, the resulting mixture was purified by centrifugation in the presence of a novel reagent (formamide). Without any post-treatment, the AgNWs exhibited low resistivity. Because this easily operated approach can reduce the production cost and time, it is expected to broaden the application of electrically conductive adhesives (ECAs) filled with AgNWs in the electronic industry.
Vorheriger Artikel Effect of acceptor Na1+ doping on the properties of perovskite SrCeO3
Nächster Artikel Microstructure and mechanical properties of nano-Ag sintered joint enhanced by Cu foam

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Metadaten
Titel
Preparation of highly conductive silver nanowires for electrically conductive adhesives
verfasst von
Jing Lu
Di Liu
Junfu Dai
Publikationsdatum
05.08.2019
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 16/2019
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-019-01964-z

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