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2024 | OriginalPaper | Buchkapitel

Principle Component Analysis of Speckle Interferograms of Thermally Deformed Objects

verfasst von : Nikhil Bhagat, Prafull Padghan, Kamlesh Alti, Abhay Khamborkar

Erschienen in: Advances in Photonics and Electronics

Verlag: Springer Nature Switzerland

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Abstract

Today speckle is just not a noise anymore; it is now recognized as the signal that carries information regarding the surface of the material under investigation. However, getting this information from the signal is not trivial and hence it needs proper mathematical analysis. Static speckle interferograms are easier to handle than dynamic as the surface information is constantly changing in the latter case. Time-dependent speckle interferograms can be captured and used for further mathematical analysis. Here, we have studied thermal deformation in a metal using the principle component analysis (PCA) technique. The aim of this study is to know whether intense regional thermal deformation can be highlighted more distinctively and prominently using this method. We will try to answer this question in this paper.

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Vorheriges Kapitel Synthesis of SnS Nanoparticles Using Hydrothermal Method: Structural and Optical Characterization

Nächstes Kapitel Using Speckle Contrast as a Tool to Track Static and Dynamic Modifications of the Surface

E. Archbold, J. Burch, Visual observation of surface. Nature 222, 6–8 (1969)

P. Aswendt, R. Höfling, W. Totzauer, Digital speckle pattern interferometry applied to thermal strain measurements of metal-ceramic compounds Opt. Laser Technol. 22, 278–282 (1990)

D. Ambrosini, P. Rastogi, Optical methods in heat transfer and fluid flow. Opt. Lasers Eng. 44, 155–158 (2006)

D. Barker, M. Fourney, Measuring fluid velocities with speckle patterns. Opt. Lett. 1, 135 (1977)

V. Bavigadda, E. Mihaylova, R. Jallapuram, V. Toal, Vibration phase mapping using holographic optical element-based electronic speckle pattern interferometry. Opt. Lasers Eng. 50, 1161–1167 (2012)

G. Costa, P. Ottonello, E. Piano, U. Genova, G. Costa, Thermal expansion measurements by speckle interferometry. Opt. Soc. Am. 19, 1032–1033 (1980)

A. Dyrseth, R. Spooren, Measuring mixing dynamics of transparent fluids with electronic speckle pattern interferometry. Appl. Opt. 36, 6171–6177 (1997)

S. Debnath, J. You, S. Kim, Determination of film thickness and surface profile using reflectometry and spectrally resolved phase shifting interferometry. Int. J. Precis. Eng. Manuf. 10, 5–10 (2009)

Y. Fu, G. Pedrini, W. Osten, Vibration measurement by temporal Fourier analyses of a digital hologram sequence. Appl. Opt. 46, 5719–5727 (2007)

J. Gauci, K. Camilleri, O. Falzon, Principal component analysis for dynamic thermal video analysis. Infrared Phys. Technol. 109, 103359 (2020)

R. Kumar, I. Singh, C. Shakher, Measurement of out-of-plane static and dynamic deformations by processing digital speckle pattern interferometry fringes using wavelet transform. Opt. Lasers Eng. 41, 81–93 (2004)

A. Kishen, V. Murukeshan, V. Krishnakumar, A. Asundi, Analysis on the nature of thermally induced deformation in human dentine by electronic speckle pattern interferometry (ESPI). J. Dent. 29, 531–537 (2001)

C. Karaaliog̃lu, Y. Skarlatos, Measurement of thin film thickness by electronic speckle pattern interferometry. Opt. Commun. 234, 269–76 (2004)

J. López-Alonso, J. Alda, E. Bernabéu, Principal-component characterization of noise for infrared images. Appl. Opt. 41, 320 (2002)

T. Okamoto, T. Asakura, The statistics of dynamic speckles. Prog. Opt. 34, 183–248 (1995)

P. Padghan, K. Alti, Quantification of nanoscale deformations using electronic speckle pattern interferometer. Opt. Laser Technol. 107, 72–79 (2018)

C. Quan, S. Wang, C. Tay, Nanoscale surface deformation inspection using FFT and phase-shifting combined interferometry. Precis. Eng. 30, 23–31 (2006)

M. Rao, R. Samuel, A. Ananthan, Applications of electronic speckle interferometry (ESI) techniques for spacecraft structural components. Opt. Lasers Eng. 40, 563–571 (2003)

K. Ribeiro, R. Braga, G. Horgan, D. Ferreira, T. Safadi, Principal component analysis in the spectral analysis of the dynamic laser speckle patterns. J. Eur. Opt. Soc. 9 (2014)

J. Su, Y. Liu, Method to measurement of the thin film thickness based on digital Moiré technique. Proc. SPIE. 8417, 841713 (2012)

J. Shlens, A tutorial on principal component analysis: derivation, discussion and singular value decomposition 2, 1–16 (2003)

G. Tao, X. Li, H. Shi, Large deformation and mechanical behavior analysis using temporal speckle pattern interferometry. Proc. SPIE 4537, 394–397 (2002)

C. Tien, K. Yu, T. Tsai, C. Lin, C. Li, Measurement of surface roughness of thin films by a hybrid interference microscope with different phase algorithms. Appl. Opt. 53, H213 (2014)

L. Yang, X. Xie, L. Zhu, S. Wu, Y. Wang, Review of electronic speckle pattern interferometry (ESPI) for three dimensional displacement measurement. Chin. J. Mech. Eng. 27, 1–13 (2014)

X. Zhu, C. Tang, H. Ren, C. Sun, S. Yan, Image decomposition model BL-Hilbert-L2 for dynamic thermal measurements of the printed circuit board with a chip by ESPI. Opt. Laser Technol. 63, 125–131 (2014)

Titel: Principle Component Analysis of Speckle Interferograms of Thermally Deformed Objects
verfasst von: Nikhil Bhagat
Prafull Padghan
Kamlesh Alti
Abhay Khamborkar
Verlag: Springer Nature Switzerland
Buch: Advances in Photonics and Electronics
Print ISBN: 978-3-031-68037-3

Electronic ISBN: 978-3-031-68038-0

Copyright-Jahr: 2024
DOI: https://doi.org/10.1007/978-3-031-68038-0_7

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