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Erschienen in: Journal of Materials Science: Materials in Electronics 6/2017

19.12.2016

Properties of nanostructured pure β-In2S3 thin films prepared by sulfurization-assisted electrodeposition

verfasst von: Meng Liu, Zhilin Li, Jing Ji, Meiling Dou, Feng Wang

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 6/2017

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Abstract

The development of pure-phase semi-conducting buffering materials as the substitution of conventional cadmium sulfide (CdS) is extremely important for the large-scale application of solar cells. Herein, we demonstrated a facile approach to deposit pure-phase indium sulfide (In2S3) thin films on the indium tin oxide (ITO) substrates by sulfurizing the co-electrodeposited In2S3 films. The effect of sulfurization temperatures (200–550 °C) on the surface morphologies, crystal structures, optical and electrical properties of In2S3 films was investigated. The results showed that the highly-oriented pure β-In2S3 thin films were obtained as the sulfurization temperature exceeded 250 °C. The obtained β-In2S3 films possessed a relatively ideal S/In atomic ratio and a continuous and densely packed surface feature. The optical band gaps of the β-In2S3 films have been determined in the range of 1.93 ± 0.01–2.06 ± 0.01 eV, which can be controlled by adjusting the sulfurization temperature. The electrical properties tests demonstrated that the pure β-In2S3 films obtained by sulfurizing at 550 °C exhibited the characteristic n-type semiconductors with a low electrical resistivity of 38.8 Ω cm, a carrier concentration of 3.8 × 1015 cm−3 and a carrier mobility of 42.3 cm2 V−1 s−1. This facile synthetic route is promising for the preparation of pure-phase In2S3 films, and then gives the guidance for future design and synthesis of other metal sulfide films for high-performance solar cells.

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Metadaten
Titel
Properties of nanostructured pure β-In2S3 thin films prepared by sulfurization-assisted electrodeposition
verfasst von
Meng Liu
Zhilin Li
Jing Ji
Meiling Dou
Feng Wang
Publikationsdatum
19.12.2016
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 6/2017
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-016-6161-2

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