Skip to main content
Fachgebiete
Automobil + Motoren Bauwesen + Immobilien Business IT + Informatik Elektrotechnik + Elektronik Energie + Nachhaltigkeit Finance + Banking Management + Führung Marketing + Vertrieb Maschinenbau + Werkstoffe Versicherung + Risiko
DE
EN
Bücher
Zeitschriften
Themenseiten
Organisationspsychologie Projektmanagement Marketing Smart Manufacturing
Weitere Formate
Podcasts Webinare Technik Webinare Wirtschaft Kongresse Veranstaltungskalender Awards
Jetzt Einzelzugang starten
Zugang für Unternehmen
Referenzkunden
SLX-Digitalkonferenz: Zukunftswerkstatt 2024

Mehr Umsatz mit Top-Kontakten

Am 7. Mai erfahren Sie, wie Vertriebsteams Leadgenerierung, Leadnurturing und Leadstrategien effizient steuern können.
Erweiterte Suche
Anmelden
nach oben
Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 16/2018

07.07.2018

Rapid & low-cost prototyping of metallic patterns in limited facilities condition

verfasst von: Amir Abidov, Sungjin Kim, Yong Bae Kim, Christian Gomez-Solis

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 16/2018

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

This paper presents rapid and cost-efficient prototyping metalizing method for fabrication of metal contacts. It demonstrates the technical improvement in metalizing achieved by transparency photomask printing compared to conventional methods. It describes fabrication of microelectrodes on various substrates such as glass and plastic using conventional office laser printer. Presented method can be used for quick prototyping of sensors, microheaters, micro hotplates and metal interconnects. Experimental results showed that prepared metallic micro contacts on glass substrate are compatible with conventional soldering.
Vorheriger Artikel Electrical effective parameters of the grains and the Montgomery's method in ceramics
Nächster Artikel Low-stress design of bonding structure and its thermal shock performance (− 50 to 250 °C) in SiC/DBC power die-attached modules

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

Jetzt informieren
Anhänge
Nur mit Berechtigung zugänglich
Literatur
1.
S.L. Kim, G.M. Kim, Micropatterning on roll surface using photo-lithography processes. Int. J. Precis. Eng. Manuf. 12(5), 763–768 (2011)CrossRef
2.
J.H. Kim, S.S. Chang, G. Lim, A simple approach for an ultra-precise patterning using deep X-ray lithography with a micron-patterned X-ray mask. Int. J. Precis. Eng. Manuf. 15(11), 2385–2390 (2014)CrossRef
3.
I.-B. Park, Y.-M. Ha, M.-S. Kim, S.-H. Lee, Fabrication of a micro-lens array with a nonlayered method in projection microstereolithography. Int. J. Precis. Eng. Manuf. 11(3), 483–490 (2010)CrossRef
4.
S.-Y. Hwang, H.-H. Park, S.-M. Kang, H.-B. Shin, H.K. Kang, Fabrication of nanopatterned metal sheet using photolithography and electroplating. Thin Solid Films 546, 132–135 (2013)CrossRef
5.
S.H. Lee et al., Continuous fabrication of bio-inspired water collecting surface via roll-type photolithography. Int. J. Precis. Eng. Manuf. Technol. 1(2), 119–124 (2014)CrossRef
6.
X. Liu, T.-J. Tarn, F. Huang, J. Fan, Recent advances in inkjet printing synthesis of functional metal oxides. Particuology 19, 1–13 (2014)CrossRef
7.
M.-S. Kim, W.-S. Chu, Y.-M. Kim, A.P.G. Avila, S.-H. Ahn, Direct metal printing of 3D electrical circuit using rapid prototyping. Int. J. Precis. Eng. Manuf. 10(5), 147–150 (2010)CrossRef
8.
T. Lim, J. Yang, S. Lee, J. Chung, D. Hong, Deposit pattern of inkjet printed pico-liter droplet. Int. J. Precis. Eng. Manuf. 13(6), 827–833 (2012)CrossRef
9.
Y.-M. Choi, E.-S. Lee, T.-M. Lee, K.-Y. Kim, Optimization of a reverse-offset printing process and its application to a metal mesh touch screen sensor. Microelectron. Eng. 134, 1–6 (2015)CrossRef
10.
K. Nomura, H. Ushijima, R. Mitsui, S. Takahashi, S. Nakajima, Screen-offset printing for fine conductive patterns. Microelectron. Eng. 123, 58–61 (2014)CrossRef
11.
W. Wu, S. Yang, S. Zhang, H. Zhang, C. Jiang, Fabrication, characterization and screen printing of conductive ink based on carbon@Ag core-shell nanoparticles. J. Colloid Interface Sci. 427, 15–19 (2014)CrossRef
12.
J.M. Hoey, A. Lutfurakhmanov, D.L. Schulz, I.S. Akhatov, A review on aerosol-based direct-write and its applications for microelectronics. J. Nanotechnol. 2012, 1–22 (2012)CrossRef
13.
J. Lessing, A.C. Glavan, S.B. Walker, C. Keplinger, J.A. Lewis, G.M. Whitesides, Inkjet printing of conductive inks with high lateral resolution on omniphobic ‘R F paper’ for paper-based electronics and MEMS. Adv. Mater. 26(27), 4677–4682 (2014)CrossRef
14.
F. Hossein-Babaei, S. Moghadam, S. Masoumi, Forming ohmic Ag/SnO2 contacts. Mater. Lett. 141, 141–144 (2015)CrossRef
15.
P.N. Vinod, SEM and specific contact resistance analysis of screen-printed Ag contacts formed by fire-through process on the shallow emitters of silicon solar cell. J. Mater. Sci. Mater. Electron. 20(10), 1026–1032 (2009)CrossRef
16.
L. Yi, J. Li, C. Guo, L. Li, J.B. Liu, Liquid metal ink enabled rapid prototyping of electrochemical sensor for wireless glucose detection on the platform of mobile phone. J. Med. Devices Trans. ASME 9(4), 1–7 (2015)
17.
N. Dossi, F. Terzi, E. Piccin, R. Toniolo, G. Bontempelli, Rapid prototyping of sensors and conductive elements by day-to-day writing tools and emerging manufacturing technologies. Electroanalysis 28(2), 250–264 (2016)CrossRef
18.
M. Abdelgawad, A.R. Wheeler, Rapid prototyping in copper substrates for digital microfluidics. Adv. Mater. 19(1), 133–137 (2007)CrossRef
19.
V. Linder, H. Wu, X. Jiang, G.M. Whitesides, Rapid prototyping of 2D structures with feature sizes larger than 8 µm. Anal. Chem. 75(10), 2522–2527 (2003)CrossRef
20.
D.J. Friedman, S.L. Albin, Clustered defects in IC fabrication: impact on process control charts. Microelectron. Reliab. 32(1–2), 293–294 (1992)
21.
C. Zhu, W. Ning, H. Li, T. Zheng, G. Xu, L. Luo, Void control during plating process and thermal annealing of through-mask electroplated copper interconnects. Microelectron. Reliab. 54(4), 773–777 (2014)CrossRef
22.
S.M. Sze, G.S. May, Fundamentals of Semiconductor Fabrication (Wiley, New Jersey, 2004)
23.
K.S. Teh, Additive direct-write microfabrication for MEMS: a review. Front. Mech. Eng. 12(4), 490–509 (2017)CrossRef
24.
Z.X. Cai, X.Y. Zeng, J. Duan, Fabrication of platinum microheater on alumina substrate by micro-pen and laser sintering. Thin Solid Films 519(11), 3893–3896 (2011)CrossRef
Metadaten
Titel
Rapid & low-cost prototyping of metallic patterns in limited facilities condition
verfasst von
Amir Abidov
Sungjin Kim
Yong Bae Kim
Christian Gomez-Solis
Publikationsdatum
07.07.2018
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 16/2018
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-018-9567-1

Weitere Artikel der Ausgabe 16/2018

Journal of Materials Science: Materials in Electronics 16/2018 Zur Ausgabe

OriginalPaper

Synthesis and optical properties of orange–red emitting Sm3+-activated Ca9LiGd2/3(PO4)7 phosphors

OriginalPaper

Determination of the critical carrier concentration for the metal–insulator transition in Ga-doped ZnO

OriginalPaper

Bi2ZnOB2O6: a polar material capable of photocatalytic degradation of Rhodamine B

OriginalPaper

Enhancing the NO sensing properties of the SnO2 nanowires sensors by Ar–O2 plasma modification

OriginalPaper

Facile preparation and enhanced dielectric performance of rod-like TiO2/P(VDF-TrFE-CFE) composites

OriginalPaper

Electrochemical synthesis of cobalt disulfide nanoparticles and their application as potential photocatalyst

Neuer Inhalt

    Bildnachweise