Room temperature nanojoining of Cu-Ag core-shell nanoparticles and nanowires

Room temperature (T _room, 300 K) nanojoining of Ag has been widely employed in fabrication of microelectronic applications where the shapes and structures of microelectronic components must be maintained. In this research, the joining processes of pure Ag nanoparticles (NPs), Cu-Ag core-shell NPs, and nanowires (NWs) are studied using molecular dynamics simulations at T _room. The evolution of densification, potential energy, and structural deformation during joining process are analyzed to identify joining mechanisms. Depending on geometry, different joining mechanisms including crystallization-amorphization, reorientation, Shockley partial dislocation are determined. A three-stage joining scenario is observed in both joining process of NPs and NWs. Besides, the Cu core does not participate in all joining processes, however, it enhances the mobility of Ag shell atoms, contributing to a higher densification and bonding strength at T _room, compared with pure Ag nanomaterials. The tensile test shows that the nanojoint bears higher rupture strength than the core-shell NW itself. This study deepens understanding in the underlying joining mechanisms and thus nanojoint with desirable thermal, electrical, and mechanical properties could be potentially achieved.