Skip to main content

2011 | OriginalPaper | Buchkapitel

5. Root Cause and Failure Analysis

verfasst von : Allyson L. Hartzell, Mark G. da Silva, Herbert R. Shea

Erschienen in: MEMS Reliability

Verlag: Springer US

Aktivieren Sie unsere intelligente Suche um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

This chapter will cover strategies for identifying root cause and corrective action of reliability field failures. The MEMS reliability program must include strategies for identifying potential failure modes, failure mechanisms, risk areas in design and process, and containment strategies. Containment of the failure is crucial to achieving a low field failure rate while the root cause is determined and the proper corrective action is developed, checked for effectiveness, and then finally implemented into production.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Literatur
1.
Zurück zum Zitat Document SAE J 1739: Potential Failure Mode and Effects Analysis in Design (Design FMEA) and Potential Failure Mode and Effects Analysis in Manufacturing and Assembly Processes (Process FMEA) Reference Manual, SAE, 400 Commonwealth Drive, Warrendale, PA 15096–0001. Document SAE J 1739: Potential Failure Mode and Effects Analysis in Design (Design FMEA) and Potential Failure Mode and Effects Analysis in Manufacturing and Assembly Processes (Process FMEA) Reference Manual, SAE, 400 Commonwealth Drive, Warrendale, PA 15096–0001.
2.
Zurück zum Zitat Bhattacharya, S., Hartzell, A. (2007) J. Micro/Nanolith, MEMS MOEMS, Jul–Sep 6(3), 033010-1–033010-12. Bhattacharya, S., Hartzell, A. (2007) J. Micro/Nanolith, MEMS MOEMS, Jul–Sep 6(3), 033010-1–033010-12.
3.
Zurück zum Zitat Stoney, G.G. (1909) The tension of metallic films deposited by electrolysis. Proc. R. Soc. London, Ser. A. 82(553), 172–175.CrossRef Stoney, G.G. (1909) The tension of metallic films deposited by electrolysis. Proc. R. Soc. London, Ser. A. 82(553), 172–175.CrossRef
4.
Zurück zum Zitat LaVern, A.S. (2002) PhD Thesis, Air Force Institute of Technology, April 2002 “Characterization of Residual Stress in Microelectromechanical Systems (MEMS) Devices using Raman Spectroscopy”. LaVern, A.S. (2002) PhD Thesis, Air Force Institute of Technology, April 2002 “Characterization of Residual Stress in Microelectromechanical Systems (MEMS) Devices using Raman Spectroscopy”.
5.
Zurück zum Zitat Ken, G., et al. (2004) Creep of thin film Au on bimaterial Au/Si microcantilevers. Acta Materialia 52, 2133–2146.CrossRef Ken, G., et al. (2004) Creep of thin film Au on bimaterial Au/Si microcantilevers. Acta Materialia 52, 2133–2146.CrossRef
6.
Zurück zum Zitat Arthur Lin, Y. (1999) Parametric Wafer Map Visualization. IEEE Comput. Graphics Appl. 19(4), 14–17, (Jul/Aug).CrossRef Arthur Lin, Y. (1999) Parametric Wafer Map Visualization. IEEE Comput. Graphics Appl. 19(4), 14–17, (Jul/Aug).CrossRef
7.
Zurück zum Zitat Arman G., et al. (2000) Mechanical Reliability of Surface Micromachined Self-Assembling Two-Axis MEMS Tilting Mirrors. Prov. SPIE. 4180, MEMS Reliability for Critical Applications. Arman G., et al. (2000) Mechanical Reliability of Surface Micromachined Self-Assembling Two-Axis MEMS Tilting Mirrors. Prov. SPIE. 4180, MEMS Reliability for Critical Applications.
8.
Zurück zum Zitat Wyko NT9100 Optical Profiling System, 2007 Veeco Instruments Inc. DS544, Rev A0. Wyko NT9100 Optical Profiling System, 2007 Veeco Instruments Inc. DS544, Rev A0.
9.
Zurück zum Zitat Koev, S.T., Ghodssi, R. (2008) Advanced interferometric profile measurements through refractive media. Rev. Sci. Instrum. 79, 093702.CrossRef Koev, S.T., Ghodssi, R. (2008) Advanced interferometric profile measurements through refractive media. Rev. Sci. Instrum. 79, 093702.CrossRef
10.
Zurück zum Zitat Goldstein J, Newbury DE, Joy DC, Lyman CE (2003) Scanning Electron Microscopy and X-ray Microanalysis. New York: Springer.CrossRef Goldstein J, Newbury DE, Joy DC, Lyman CE (2003) Scanning Electron Microscopy and X-ray Microanalysis. New York: Springer.CrossRef
11.
Zurück zum Zitat Kahn, H., Ballarini, R., Heuer, A.H. (2001) On the Fracture Toughness of Polysilicon MEMS Structures. Mat. Res. Soc. Symp. Proc. 657 (© 2001 Materials Research Society). 13–18. Kahn, H., Ballarini, R., Heuer, A.H. (2001) On the Fracture Toughness of Polysilicon MEMS Structures. Mat. Res. Soc. Symp. Proc. 657 (© 2001 Materials Research Society). 13–18.
12.
Zurück zum Zitat Miller, D.C., et al. (2008) Connections between morphological and mechanical evolution during galvanic corrosion of micromachined polysilicon and monocyrstalline silicon. J. Appl. Phys. 103, 123518.CrossRef Miller, D.C., et al. (2008) Connections between morphological and mechanical evolution during galvanic corrosion of micromachined polysilicon and monocyrstalline silicon. J. Appl. Phys. 103, 123518.CrossRef
13.
Zurück zum Zitat Guy F. Dirras, George Coles, Anthony J Wagner, Stephen Carlo, Caroline Newman, Kevin J. Hemker, William N. Sharpe, “On the Role of the Underlying Microstructure on the Mechanical Properties of Microelectromechanical Systems (MEMS) Materials” Materials Science of Microelectromechanical Systems (MEMS) Devices III, MRS Proceedings Volume 657. Guy F. Dirras, George Coles, Anthony J Wagner, Stephen Carlo, Caroline Newman, Kevin J. Hemker, William N. Sharpe, “On the Role of the Underlying Microstructure on the Mechanical Properties of Microelectromechanical Systems (MEMS) Materials” Materials Science of Microelectromechanical Systems (MEMS) Devices III, MRS Proceedings Volume 657.
14.
Zurück zum Zitat Nunan, K., Ready, G., Sledziewski, J. (2001) LPCVD and PECVD Operations Designed for iMEMS Sensor Devices. Vacuum Coating Technol. 2(1), 26–37. Nunan, K., Ready, G., Sledziewski, J. (2001) LPCVD and PECVD Operations Designed for iMEMS Sensor Devices. Vacuum Coating Technol. 2(1), 26–37.
15.
Zurück zum Zitat Gnauck, P., Hoffrogge, P. (2003) A new SEM/FIB Crossbeam Inspection Tool for high Resolution Mateirals and Device Characterization. Proc of SPIE. 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II. Gnauck, P., Hoffrogge, P. (2003) A new SEM/FIB Crossbeam Inspection Tool for high Resolution Mateirals and Device Characterization. Proc of SPIE. 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II.
16.
Zurück zum Zitat Walraven, J., et al. (2000) Failure analysis of tungsten coated polysilicon micromachined mircroengines. Proc. of SPIE. 4180, MEMS Reliability for Critical Applications. Walraven, J., et al. (2000) Failure analysis of tungsten coated polysilicon micromachined mircroengines. Proc. of SPIE. 4180, MEMS Reliability for Critical Applications.
17.
Zurück zum Zitat Bharat, B., Huiwen, L. (2004) Micro/nanoscale tribological and mechanical characterization for MEMS/NEMS. Proc. of SPIE. 5392, Testing, Reliability and Application of Micro- and Nano-Material Systems II. Bharat, B., Huiwen, L. (2004) Micro/nanoscale tribological and mechanical characterization for MEMS/NEMS. Proc. of SPIE. 5392, Testing, Reliability and Application of Micro- and Nano-Material Systems II.
18.
Zurück zum Zitat Loretto, M.H. (1984) Electron Beam Analysis of Materials. New York: Springer Science and Business Media.CrossRef Loretto, M.H. (1984) Electron Beam Analysis of Materials. New York: Springer Science and Business Media.CrossRef
19.
Zurück zum Zitat Miller, D., et al. (2007) Thermo-mechanical evolution of multilayer thin films: Part II. Microstructure evolution in Au/Cr/Si microcantilevers. Thin Solid Films 515, 3224–3240.CrossRef Miller, D., et al. (2007) Thermo-mechanical evolution of multilayer thin films: Part II. Microstructure evolution in Au/Cr/Si microcantilevers. Thin Solid Films 515, 3224–3240.CrossRef
20.
Zurück zum Zitat Thornell, G., et al. (1999) Residual stress in sputtered gold films on quartz measured by the cantilevel beam deflection technique. IEEE Trans Ultrasonics, Ferroelectrics, Frequency Control, 46(4), July. Thornell, G., et al. (1999) Residual stress in sputtered gold films on quartz measured by the cantilevel beam deflection technique. IEEE Trans Ultrasonics, Ferroelectrics, Frequency Control, 46(4), July.
21.
Zurück zum Zitat Alie, S., Hartzell, A., Karpman, M., Martin, J.R., Nunan, K. (2003) Optical mirror coatings for high-temperature diffusion barriers and mirror shaping United States Patent 6508561, Analog Devices. Alie, S., Hartzell, A., Karpman, M., Martin, J.R., Nunan, K. (2003) Optical mirror coatings for high-temperature diffusion barriers and mirror shaping United States Patent 6508561, Analog Devices.
22.
Zurück zum Zitat Knieling, T., Lang, W., Benecke, W. (2007) Gas phase hydrophobisation of MEMS silicon structures with self-assembling monolayers for avoiding in-use sticking. Sensors Actuators B 126, 13–17.CrossRef Knieling, T., Lang, W., Benecke, W. (2007) Gas phase hydrophobisation of MEMS silicon structures with self-assembling monolayers for avoiding in-use sticking. Sensors Actuators B 126, 13–17.CrossRef
23.
Zurück zum Zitat Mowat, I., et al. (2007) Analytical methods for nanotechnology. NSTI Nanotech 2007 Proceedings, Santa Clara, May 20–24. Mowat, I., et al. (2007) Analytical methods for nanotechnology. NSTI Nanotech 2007 Proceedings, Santa Clara, May 20–24.
24.
Zurück zum Zitat Tepolt, G.B. (2010) Hermetic vacuum sealing of MEMS devices containing organic components. SPIE 2010 Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX, Conference 7592. Tepolt, G.B. (2010) Hermetic vacuum sealing of MEMS devices containing organic components. SPIE 2010 Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX, Conference 7592.
25.
Zurück zum Zitat Mastrangelo, C.H. (1999) Supression of Stiction in MEMS. MRS. Mastrangelo, C.H. (1999) Supression of Stiction in MEMS. MRS.
26.
Zurück zum Zitat Mastrangelo, C.H., Hsu, C.H. (1992) A simple experimental technique for the measurement of work of adhesion of microstructures. Solid-State Sensor and Actuator Workshop, 1992, 5th Technical Digest, IEEE; 22–25 June. Mastrangelo, C.H., Hsu, C.H. (1992) A simple experimental technique for the measurement of work of adhesion of microstructures. Solid-State Sensor and Actuator Workshop, 1992, 5th Technical Digest, IEEE; 22–25 June.
27.
Zurück zum Zitat Maboudian, R., Carraro, C. (2004) Surface chemistry and tribology of MEMS. Ann. Rev. Phys. Chem. 55, 35–54.CrossRef Maboudian, R., Carraro, C. (2004) Surface chemistry and tribology of MEMS. Ann. Rev. Phys. Chem. 55, 35–54.CrossRef
28.
Zurück zum Zitat Wibbeler, J. et al. (1988) Parasitic charging of dielectric surfaces in capacitive microelectromechanical systems (MEMS). Sensor Actuators A 71, 74–80.CrossRef Wibbeler, J. et al. (1988) Parasitic charging of dielectric surfaces in capacitive microelectromechanical systems (MEMS). Sensor Actuators A 71, 74–80.CrossRef
29.
Zurück zum Zitat Reiter, G. et al. (1999) Destabilizing effect of long-range forces in thin liquid films on wettable surfaces. Europhys. Lett. 46(4), 512–518.MathSciNetCrossRef Reiter, G. et al. (1999) Destabilizing effect of long-range forces in thin liquid films on wettable surfaces. Europhys. Lett. 46(4), 512–518.MathSciNetCrossRef
30.
Zurück zum Zitat Danilov, V. et al. (2009) Plasma treatment of polydimethylsiloxane thin films studied by infrared reflection absorption spectroscopy. 29th ICPIG, July 12–17, Cancun, Mexico. Danilov, V. et al. (2009) Plasma treatment of polydimethylsiloxane thin films studied by infrared reflection absorption spectroscopy. 29th ICPIG, July 12–17, Cancun, Mexico.
Metadaten
Titel
Root Cause and Failure Analysis
verfasst von
Allyson L. Hartzell
Mark G. da Silva
Herbert R. Shea
Copyright-Jahr
2011
Verlag
Springer US
DOI
https://doi.org/10.1007/978-1-4419-6018-4_5

Neuer Inhalt