Skip to main content
Erschienen in: Microsystem Technologies 12/2017

25.02.2017 | Technical Paper

Sensitivity improvement of a dual axis thermal accelerometer with modified cavity structure

verfasst von: Rahul Mukherjee, Pradip Mandal, Prasanta Kumar Guha

Erschienen in: Microsystem Technologies | Ausgabe 12/2017

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

An improved dual axis thermal accelerometer is proposed in this paper. The thermal accelerometer consists of a centrally placed micro-heater, temperature detectors (placed symmetrically opposite of the heater) and silicon islands. A cavity is etched in silicon bulk to create thermal insulation between heater and the temperature detectors. The islands enhance the accelerometer sensitivity significantly. 3D structures of both types of accelerometers (with and without island) were designed and simulated in an FEM simulator. The results show that, the sensitivity of the accelerometer increases from 0.335 to 0.657 K/g by adding two pairs of silicon islands along two axes (where g is the gravitational acceleration i.e. 9.8 m/s2 and K is the unit of temperature in Kelvin scale). The improvement of sensitivity is observed over a wide range of acceleration.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Literatur
Zurück zum Zitat Huang H, Liang M, Tang R, Oiler J, Yu H (2013) Molecular electronic transducer-based low-frequency accelerometer fabricated with post-CMOS compatible process using droplet as sensing body. IEEE Electron Device Lett 34:10. doi:10.1109/LED.2013.2277541 Huang H, Liang M, Tang R, Oiler J, Yu H (2013) Molecular electronic transducer-based low-frequency accelerometer fabricated with post-CMOS compatible process using droplet as sensing body. IEEE Electron Device Lett 34:10. doi:10.​1109/​LED.​2013.​2277541
Zurück zum Zitat Leung AM, Jones J, Czyzewska E, Chen J, Woods B (1998) Micromachined accelerometer based on convection heat transfer. Proceedings of the IEEE MEMS’98. 627–630. doi:10.1109/MEMSYS.1998.659830 Leung AM, Jones J, Czyzewska E, Chen J, Woods B (1998) Micromachined accelerometer based on convection heat transfer. Proceedings of the IEEE MEMS’98. 627–630. doi:10.​1109/​MEMSYS.​1998.​659830
Zurück zum Zitat Liang M, Yu H, Ngan M, Nickerson S, Nofen E, Dai LL (2015) MEMS accelerometer based on Molecular Electronic Transducers using Ionic Liquid. 2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO) 1167–1170. doi:10.1109/NANO.2015.7388833 Liang M, Yu H, Ngan M, Nickerson S, Nofen E, Dai LL (2015) MEMS accelerometer based on Molecular Electronic Transducers using Ionic Liquid. 2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO) 1167–1170. doi:10.​1109/​NANO.​2015.​7388833
Zurück zum Zitat Liang M, Huang H, Agafonov V, Tang R, Han R, Yu H (2016) Molecular electronic transducer based planetary seismometer with new fabrication process. 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS) 986–989. doi:10.1109/MEMSYS.2016.7421798 Liang M, Huang H, Agafonov V, Tang R, Han R, Yu H (2016) Molecular electronic transducer based planetary seismometer with new fabrication process. 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS) 986–989. doi:10.​1109/​MEMSYS.​2016.​7421798
Zurück zum Zitat Mukherjee R, Guha PK, Mandal P (2013) An advanced thermal accelerometer. Indian Patent, 1075/KOL/2013 Mukherjee R, Guha PK, Mandal P (2013) An advanced thermal accelerometer. Indian Patent, 1075/KOL/2013
Zurück zum Zitat Vetrivel S, Mathew R, Sankar AR (2016) Design and optimization of a doubly clamped piezoresistive acceleration sensor with an integrated silicon nanowire piezoresistor. Microsyst Technol 1–12. doi:10.1007/s00542-016-3219-2 Vetrivel S, Mathew R, Sankar AR (2016) Design and optimization of a doubly clamped piezoresistive acceleration sensor with an integrated silicon nanowire piezoresistor. Microsyst Technol 1–12. doi:10.​1007/​s00542-016-3219-2
Metadaten
Titel
Sensitivity improvement of a dual axis thermal accelerometer with modified cavity structure
verfasst von
Rahul Mukherjee
Pradip Mandal
Prasanta Kumar Guha
Publikationsdatum
25.02.2017
Verlag
Springer Berlin Heidelberg
Erschienen in
Microsystem Technologies / Ausgabe 12/2017
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-017-3338-4

Weitere Artikel der Ausgabe 12/2017

Microsystem Technologies 12/2017 Zur Ausgabe

Neuer Inhalt