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Erschienen in:
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2018 | OriginalPaper | Buchkapitel

4. Sensor Embodiment and Flexible Electronics

verfasst von : P. Kassanos, S. Anastasova, C. M. Chen, Guang-Zhong Yang

Erschienen in: Implantable Sensors and Systems

Verlag: Springer International Publishing

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Abstract

Sensor embodiment and packaging are particularly important for implantable systems. One key element is the development of flexible electronics. Traditional electronics, based on rigid silicon technologies, is associated with a number of intrinsic disadvantages. The inherent brittleness of inorganic semiconductors and stiffness of Si wafer-based devices represent a major issue when interfaced with tissues. This is because our internal organs are complex and they have innate responses to reject foreign bodies. Furthermore, tissues are soft, and they undergo constant motion and deformation. In this chapter, we will discuss current progress in flexible printed circuit board (FPC/FPCB) technologies and provide a review of new fabrication techniques and materials for making soft devices and interconnects suitable for implantable applications. Issues related to geometrical designs for mechanically resilient flexible devices, hermetic packaging, biocompatibility and encapsulation are addressed.

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Vorheriges Kapitel Electrical and Physical Sensors for Biomedical Implants
Nächstes Kapitel Ultra-Low Power Application-Specific Integrated Circuits for Sensing
Literatur
1.
A. Bozkurt, A. Lal, Low-cost flexible printed circuit technology based microelectrode array for extracellular stimulation of the invertebrate locomotory system. Sens. Actuators Phys. 169(1), 89–97 (2011)CrossRef
2.
P. Kassanos, H.M.D. Ip, G.-Z. Yang, A tetrapolar bio-impedance sensing system for gastrointestinal tract monitoring, in 2015 IEEE 12th International Conference on Wearable and Implantable Body Sensor Networks (BSN) (2015), pp. 1–6
3.
C. Kallmayer, E. Simon, Large area sensor integration in textiles, in 2012 9th International Multi-Conference on Systems, Signals and Devices (SSD) (2012), pp. 1–5
4.
A. Nelson et al., Wearable multi-sensor gesture recognition for paralysis patients, in 2013 IEEE SENSORS (2013), pp. 1–4
5.
R.G. Haahr et al., An electronic patch for wearable health monitoring by reflectance pulse oximetry. IEEE Trans. Biomed. Circuits Syst. 6(1), 45–53 (2012)CrossRef
6.
C.M. Chen, R. Kwasnicki, B. Lo, G.-Z. Yang, Wearable tissue oxygenation monitoring sensor and a forearm vascular phantom design for data validation, in 2014 11th International Conference on Wearable and Implantable Body Sensor Networks (2014), pp. 64–68
7.
R. Dekker et al., Living chips and chips for the living, in 2012 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM) (2012), pp. 1–9
8.
J. Reeder et al., Mechanically adaptive organic transistors for implantable electronics. Adv. Mater. 26(29), 4967–4973 (2014)CrossRef
9.
10.
L. Xu et al., 3D multifunctional integumentary membranes for spatiotemporal cardiac measurements and stimulation across the entire epicardium. Nat. Commun. 5, 3329 (2014)
11.
D.-H. Kim et al., Epidermal electronics. Science 333(6044), 838–843 (2011)CrossRef
12.
W.-H. Yeo et al., Multifunctional epidermal electronics printed directly onto the skin. Adv. Mater. 25(20), 2773–2778 (2013)CrossRef
13.
H. Tao et al., Silk-based resorbable electronic devices for remotely controlled therapy and in vivo infection abatement. Proc. Natl. Acad. Sci. 111(49), 17385–17389 (2014)CrossRef
14.
J. Viventi et al., Flexible, foldable, actively multiplexed, high-density electrode array for mapping brain activity in vivo. Nat. Neurosci. 14(12), 1599–1605 (2011)CrossRef
15.
S.P. Lee et al., Catheter-based systems with integrated stretchable sensors and conductors in cardiac electrophysiology. Proc. IEEE 103(4), 682–689 (2015)CrossRef
16.
D.-H. Kim et al., Materials for multifunctional balloon catheters with capabilities in cardiac electrophysiological mapping and ablation therapy. Nat. Mater. 10(4), 316–323 (2011)CrossRef
17.
T. Yokota et al., Ultraflexible organic photonic skin. Sci. Adv. 2(4), e1501856 (2016)CrossRef
18.
S.-W. Hwang et al., A physically transient form of silicon electronics. Science 337(6102), 1640–1644 (2012)CrossRef
19.
M.S. Mannoor et al., Graphene-based wireless bacteria detection on tooth enamel. Nat. Commun. 3, 763 (2012)CrossRef
20.
H. Tao et al., Implantable, multifunctional, bioresorbable optics. Proc. Natl. Acad. Sci. 109(48), 19584–19589 (2012)CrossRef
21.
D.-H. Kim et al., Electronic sensor and actuator webs for large-area complex geometry cardiac mapping and therapy. Proc. Natl. Acad. Sci. 109(49), 19910–19915 (2012)CrossRef
22.
L. Xu et al., Materials and fractal designs for 3D multifunctional integumentary membranes with capabilities in cardiac electrotherapy. Adv. Mater. 27(10), 1731–1737 (2015)CrossRef
23.
G. Park et al., Immunologic and tissue biocompatibility of flexible/stretchable electronics and optoelectronics. Adv. Healthc. Mater. 3(4), 515–525 (2014)CrossRef
24.
M.A. Deeds, P.A. Sandborn, MOEMS chip-level optical fiber interconnect. IEEE Trans. Adv. Packag. 28(4), 612–618 (2005)CrossRef
25.
M. Lapisa, G. Stemme, F. Niklaus, Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS. IEEE J. Sel. Top. Quantum Electron. 17(3), 629–644 (2011)CrossRef
26.
R. Özgün, B.J. Jung, B.M. Dhar, H.E. Katz, A.G. Andreou, Silicon-on-insulator (SOI) integration for organic field effect transistor (OFET) based circuits, in 2011 IEEE International Symposium of Circuits and Systems (ISCAS) (2011), pp. 2253–2256
27.
M. Luo, A.W. Martinez, C. Song, F. Herrault, M.G. Allen, A Microfabricated wireless RF pressure sensor made completely of biodegradable materials. J. Microelectromechanical Syst. 23(1), 4–13 (2014)CrossRef
28.
T. Adrega, S.P. Lacour, Stretchable gold conductors embedded in PDMS and patterned by photolithography: fabrication and electromechanical characterization. J. Micromechanics Microengineering 20(5), 055025 (2010)CrossRef
29.
X. Hu, P. Krull, B. de Graff, K. Dowling, J.A. Rogers, W.J. Arora, Stretchable inorganic-semiconductor electronic systems. Adv. Mater. 23(26), 2933–2936 (2011)CrossRef
30.
Y. Sun, W.M. Choi, H. Jiang, Y.Y. Huang, J.A. Rogers, Controlled buckling of semiconductor nanoribbons for stretchable electronics. Nat. Nanotechnol. 1(3), 201–207 (2006)CrossRef
31.
M.J. Allen et al., Soft transfer printing of chemically converted graphene. Adv. Mater. 21(20), 2098–2102 (2009)CrossRef
32.
X. Liang, Z. Fu, S.Y. Chou, Graphene transistors fabricated via transfer-printing in device active-areas on large wafer. Nano Lett. 7(12), 3840–3844 (2007)CrossRef
33.
A. Carlson, A.M. Bowen, Y. Huang, R.G. Nuzzo, J.A. Rogers, Transfer printing techniques for materials assembly and micro/nanodevice fabrication. Adv. Mater. 24(39), 5284–5318 (2012)CrossRef
34.
C. Kim, P.E. Burrows, S.R. Forrest, Micropatterning of organic electronic devices by cold-welding. Science 288(5467), 831–833 (2000)CrossRef
35.
C. Kim, S.R. Forrest, Fabrication of organic light-emitting devices by low-pressure cold welding. Adv. Mater. 15(6), 541–545 (2003)
36.
S.R. Forrest, The path to ubiquitous and low-cost organic electronic appliances on plastic. Nature 428, 911–918 (2004)
37.
C. Kim, M. Shtein, S.R. Forrest, Nanolithography based on patterned metal transfer and its application to organic electronic devices. Appl. Phys. Lett. 80(21), 4051–4053 (2002)CrossRef
38.
D.R. Hines, V.W. Ballarotto, E.D. Williams, Y. Shao, S.A. Solin, Transfer printing methods for the fabrication of flexible organic electronics. J. Appl. Phys. 101(2), 024503 (2007)CrossRef
39.
J. Zaumseil et al., Three-dimensional and multilayer nanostructures formed by nanotransfer printing. Nano Lett. 3(9), 1223–1227 (2003)CrossRef
40.
J.-H. Ahn et al., Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon. Appl. Phys. Lett. 90(21), 213501 (2007)CrossRef
41.
D.-H. Kim et al., Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations. Proc. Natl. Acad. Sci. 105(48), 18675–18680 (2008)CrossRef
42.
A. Perl, D.N. Reinhoudt, J. Huskens, Microcontact printing: limitations and achievements. Adv. Mater. 21(22), 2257–2268 (2009)CrossRef
43.
S. Khan, L. Lorenzelli, R.S. Dahiya, Technologies for printing sensors and electronics over large flexible substrates: a review. IEEE Sens. J. 15(6), 3164–3185 (2015)CrossRef
44.
R. Parashkov, E. Becker, T. Riedl, H.H. Johannes, W. Kowalsky, Large area electronics using printing methods. Proc. IEEE 93(7), 1321–1329 (2005)CrossRef
45.
J. Zaumseil, T. Someya, Z. Bao, Y.-L. Loo, R. Cirelli, J.A. Rogers, Nanoscale organic transistors that use source/drain electrodes supported by high resolution rubber stamps. Appl. Phys. Lett. 82(5), 793–795 (2003)CrossRef
46.
S.Y. Chou, P.R. Krauss, P.J. Renstrom, Imprint lithography with 25-nanometer resolution. Science 272(5258), 85–87 (1996)CrossRef
47.
S.Y. Chou, P.R. Krauss, P.J. Renstrom, Nanoimprint lithography. J. Vac. Sci. Technol. B 14(6), 4129–4133 (1996)CrossRef
48.
S.Y. Chou, P.R. Krauss, W. Zhang, L. Guo, L. Zhuang, Sub-10 nm imprint lithography and applications. J. Vac. Sci. Technol. B 15(6), 2897–2904 (1997)CrossRef
49.
D.J. Resnick, S.V. Sreenivasan, C.G. Willson, Step & flash imprint lithography. Mater. Today 8(2), 34–42 (2005)CrossRef
50.
J. Wang, X. Sun, L. Chen, S.Y. Chou, Direct nanoimprint of submicron organic light-emitting structures. Appl. Phys. Lett. 75(18), 2767–2769 (1999)CrossRef
51.
P. Maury et al., Roll-to-roll UV imprint lithography for flexible electronics. Microelectron. Eng. 88(8), 2052–2055 (2011)CrossRef
52.
J. Han, S. Choi, J. Lim, B.S. Lee, S. Kang, Fabrication of transparent conductive tracks and patterns on flexible substrate using a continuous UV roll imprint lithography. J. Phys. Appl. Phys. 42(11), 115503 (2009)CrossRef
53.
S.H. Ahn, L.J. Guo, High-Speed roll-to-roll nanoimprint lithography on flexible plastic substrates. Adv. Mater. 20(11), 2044–2049 (2008)CrossRef
54.
H. Gold et al., Self-aligned flexible organic thin-film transistors with gates patterned by nano-imprint lithography. Org. Electron. 22, 140–146 (2015)CrossRef
55.
A. Larmagnac, S. Eggenberger, H. Janossy, J. Vörös, Stretchable electronics based on Ag-PDMS composites. Sci. Rep. 4 (2014)
56.
S. Khan, W. Dang, L. Lorenzelli, R. Dahiya, Flexible pressure sensors based on screen-printed P(VDF-TrFE) and P(VDF-TrFE)/MWCNTs. IEEE Trans. Semicond. Manuf. 28(4), 486–493 (2015)CrossRef
57.
S. Khan, S. Tinku, L. Lorenzelli, R.S. Dahiya, Flexible tactile sensors using screen-printed P(VDF-TrFE) and MWCNT/PDMS composites. IEEE Sens. J. 15(6), 3146–3155 (2015)CrossRef
58.
J. Ping, Y. Wang, Y. Ying, J. Wu, Application of electrochemically reduced graphene oxide on screen-printed ion-selective electrode. Anal. Chem. 84(7), 3473–3479 (2012)CrossRef
59.
D. Numakura, Advanced screen printing ‘practical approaches for printable & flexible electronics’, in 2008 3rd International Microsystems, Packaging, Assembly Circuits Technology Conference (2008), pp. 205–208
60.
R. Soukup, A. Hamáček, J. Řeboun, Organic based sensors: Novel screen printing technique for sensing layers deposition, in 2012 35th International Spring Seminar on Electronics Technology (2012), pp. 19–24
61.
G.E. Jabbour, R. Radspinner, N. Peyghambarian, Screen printing for the fabrication of organic light-emitting devices. IEEE J. Sel. Top. Quantum Electron. 7(5), 769–773 (2001)CrossRef
62.
Y. Kim, H. Kim, H.J. Yoo, Electrical characterization of screen-printed circuits on the fabric. IEEE Trans. Adv. Packag. 33(1), 196–205 (2010)MathSciNet
63.
B. Karaguzel et al., Flexible, durable printed electrical circuits. J. Text. Inst. 100(1), 1–9 (2009)CrossRef
64.
J. Chang, X. Zhang, T. Ge, J. Zhou, Fully printed electronics on flexible substrates: high gain amplifiers and DAC. Org. Electron. 15(3), 701–710 (2014)CrossRef
65.
G.D. Martin, S.D. Hoath, I.M. Hutchings, Inkjet printing—the physics of manipulating liquid jets and drops. J. Phys: Conf. Ser. 105(1), 012001 (2008)
66.
B. Derby, Inkjet printing of functional and structural materials: fluid property requirements, feature stability, and resolution. Annu. Rev. Mater. Res. 40(1), 395–414 (2010)CrossRef
67.
Y.-F. Liu, W.-S. Hwang, Y.-F. Pai, M.-H. Tsai, Low temperature fabricated conductive lines on flexible substrate by inkjet printing. Microelectron. Reliab. 52(2), 391–397 (2012)CrossRef
68.
D. Soltman, V. Subramanian, Inkjet-printed line morphologies and temperature control of the coffee ring effect. Langmuir 24(5), 2224–2231 (2008)CrossRef
69.
J. Stringer, B. Derby, Formation and stability of lines produced by inkjet printing. Langmuir 26(12), 10365–10372 (2010)CrossRef
70.
E. Fribourg-Blanc, D.M.T. Dang, C.M. Dang, Characterization of silver nanoparticle based inkjet printed lines. Microsyst. Technol. 19(12), 1961–1971 (2013)CrossRef
71.
T.H.J. van Osch, J. Perelaer, A.W.M. de Laat, U.S. Schubert, Inkjet printing of narrow conductive tracks on untreated polymeric substrates. Adv. Mater. 20(2), 343–345 (2008)CrossRef
72.
B.J. Kang, J.H. Oh, Geometrical characterization of inkjet-printed conductive lines of nanosilver suspensions on a polymer substrate. Thin Solid Films 518(10), 2890–2896 (2010)CrossRef
73.
J. Perelaer et al., Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials. J. Mater. Chem. 20(39), 8446–8453 (2010)CrossRef
74.
A. Chiolerio et al., Inkjet printing and low power laser annealing of silver nanoparticle traces for the realization of low resistivity lines for flexible electronics. Microelectron. Eng. 88(8), 2481–2483 (2011)CrossRef
75.
S. Chung, S.O. Kim, S.K. Kwon, C. Lee, Y. Hong, All-inkjet-printed organic thin-film transistor inverter on flexible plastic substrate. IEEE Electron Device Lett. 32(8), 1134–1136 (2011)CrossRef
76.
I. Theodorakos, F. Zacharatos, R. Geremia, D. Karnakis, I. Zergioti, Selective laser sintering of Ag nanoparticles ink for applications in flexible electronics. Appl. Surf. Sci. 336, 157–162 (2015)CrossRef
77.
S.H. Ko, J. Chung, H. Pan, C.P. Grigoropoulos, D. Poulikakos, Fabrication of multilayer passive and active electric components on polymer using inkjet printing and low temperature laser processing. Sens. Actuators Phys. 134(1), 161–168 (2007)CrossRef
78.
D. Tobjörk et al., IR-sintering of ink-jet printed metal-nanoparticles on paper. Thin Solid Films 520(7), 2949–2955 (2012)CrossRef
79.
P.J. Smith, D.-Y. Shin, J.E. Stringer, B. Derby, N. Reis, Direct ink-jet printing and low temperature conversion of conductive silver patterns. J. Mater. Sci. 41(13), 4153–4158 (2006)CrossRef
80.
S. Jeong, H.C. Song, W.W. Lee, Y. Choi, B.-H. Ryu, Preparation of aqueous Ag Ink with long-term dispersion stability and its inkjet printing for fabricating conductive tracks on a polyimide film. J. Appl. Phys. 108(10), 102805 (2010)CrossRef
81.
G. McKerricher, J.G. Perez, A. Shamim, Fully inkjet printed RF inductors and capacitors using polymer dielectric and silver conductive ink with through vias. IEEE Trans. Electron Devices 62(3), 1002–1009 (2015)CrossRef
82.
J.F. Salmerón et al., Properties and printability of inkjet and screen-printed silver patterns for RFID antennas. J. Electron. Mater. 43(2), 604–617 (2013)CrossRef
83.
Y. Liu, T. Cui, K. Varahramyan, All-polymer capacitor fabricated with inkjet printing technique. Solid-State Electron. 47(9), 1543–1548 (2003)CrossRef
84.
B. Chen, T. Cui, Y. Liu, K. Varahramyan, All-polymer RC filter circuits fabricated with inkjet printing technology. Solid-State Electron. 47(5), 841–847 (2003)CrossRef
85.
D. Mager et al., An MRI receiver coil produced by inkjet printing directly on to a flexible substrate. IEEE Trans. Med. Imaging 29(2), 482–487 (2010)CrossRef
86.
B.S. Cook, A. Shamim, Inkjet printing of novel wideband and high gain antennas on low-cost paper substrate. IEEE Trans. Antennas Propag. 60(9), 4148–4156 (2012)CrossRef
87.
L. Yang, A. Rida, R. Vyas, M.M. Tentzeris, RFID tag and RF structures on a paper substrate using inkjet-printing technology. IEEE Trans. Microw. Theory Tech. 55(12), 2894–2901 (2007)CrossRef
88.
R. Vyas et al., Inkjet printed, self powered, wireless sensors for environmental, gas, and authentication-based sensing. IEEE Sens. J. 11(12), 3139–3152 (2011)CrossRef
89.
H.-Y. Tseng, V. Subramanian, All inkjet-printed, fully self-aligned transistors for low-cost circuit applications. Org. Electron. 12(2), 249–256 (2011)CrossRef
90.
S. Chung, J. Jang, J. Cho, C. Lee, S.-K. Kwon, Y. Hong, All-inkjet-printed organic thin-film transistors with silver gate, source/drain electrodes. Jpn. J. Appl. Phys. 50(3S), 03CB05 (2011)
91.
T. Kawase, T. Shimoda, C. Newsome, H. Sirringhaus, R.H. Friend, Inkjet printing of polymer thin film transistors. Thin Solid Films 438–439, 279–287 (2003)CrossRef
92.
H. Sirringhaus et al., High-resolution inkjet printing of all-polymer transistor circuits. Science 290(5499), 2123–2126 (2000)CrossRef
93.
D.J. Lichtenwalner, A.E. Hydrick, A.I. Kingon, Flexible thin film temperature and strain sensor array utilizing a novel sensing concept. Sens. Actuators Phys. 135(2), 593–597 (2007)CrossRef
94.
H. Al-Chami, E. Cretu, Inkjet printing of microsensors, in IEEE 15th International Mixed-Signals, Sensors, and Systems Test Workshop 2009 (IMS3TW ’09) (2009), pp. 1–6
95.
P. Alpuim, V. Correia, E.S. Marins, J.G. Rocha, I.G. Trindade, S. Lanceros-Mendez, Piezoresistive silicon thin film sensor array for biomedical applications. Thin Solid Films 519(14), 4574–4577 (2011)CrossRef
96.
F. Molina-Lopez, D. Briand, N.F. de Rooij, All additive inkjet printed humidity sensors on plastic substrate. Sens. Actuators B Chem. 166–167, 212–222 (2012)CrossRef
97.
M.V. Kulkarni, S.K. Apte, S.D. Naik, J.D. Ambekar, B.B. Kale, Ink-jet printed conducting polyaniline based flexible humidity sensor. Sens. Actuators B Chem. 178, 140–143 (2013)CrossRef
98.
A. Rivadeneyra, J. Fernández-Salmerón, M. Agudo, J.A. López-Villanueva, L.F. Capitan-Vallvey, A.J. Palma, Design and characterization of a low thermal drift capacitive humidity sensor by inkjet-printing. Sens. Actuators B Chem. 195, 123–131 (2014)CrossRef
99.
U. Altenberend et al., Towards fully printed capacitive gas sensors on flexible PET substrates based on Ag interdigitated transducers with increased stability. Sens. Actuators B Chem. 187, 280–287 (2013)CrossRef
100.
P. Sjöberg et al., Paper-based potentiometric ion sensors constructed on ink-jet printed gold electrodes. Sens. Actuators B Chem. 224, 325–332 (2016)CrossRef
101.
N. Komuro, S. Takaki, K. Suzuki, D. Citterio, Inkjet printed (bio)chemical sensing devices. Anal. Bioanal. Chem. 405(17), 5785–5805 (2013)CrossRef
102.
J. Wu et al., Inkjet-printed microelectrodes on PDMS as biosensors for functionalized microfluidic systems. Lab Chip 15(3), 690–695 (2015)CrossRef
103.
C.L. Kang, Y. Xu, K.L. Yung, W. Chen, Laser Induced Forward Transfer. Adv. Mater. Res. 591–593, 1135–1138 (2012)CrossRef
104.
P. Serra, J.M. Fernandez-Pradas, M. Colina, M. Duocastella, J. Dominguez, J.L. Morenza, Laser-induced forward transfer: a direct-writing technique for biosensors preparation. J. Laser MicroNanoengineering 1(3), 236–242 (2006)CrossRef
105.
C. Boutopoulos, I. Kalpyris, E. Serpetzoglou, I. Zergioti, Laser-induced forward transfer of silver nanoparticle ink: time-resolved imaging of the jetting dynamics and correlation with the printing quality. Microfluid. Nanofluidics 16(3), 493–500 (2013)CrossRef
106.
R. Fardel, M. Nagel, F. Nüesch, T. Lippert, A. Wokaun, Laser-induced forward transfer of organic LED building blocks studied by time-resolved shadowgraphy. J. Phys. Chem. C 114(12), 5617–5636 (2010)CrossRef
107.
C. Boutopoulos, C. Pandis, K. Giannakopoulos, P. Pissis, I. Zergioti, Polymer/carbon nanotube composite patterns via laser induced forward transfer. Appl. Phys. Lett. 96(4), 041104 (2010)CrossRef
108.
A.P. Suryavanshi, M.-F. Yu, Probe-based electrochemical fabrication of freestanding Cu nanowire array. Appl. Phys. Lett. 88(8), 083103 (2006)CrossRef
109.
J. Hu, M.-F. Yu, Meniscus-confined three-dimensional electrodeposition for direct writing of wire bonds. Science 329(5989), 313–316 (2010)CrossRef
110.
B.Y. Ahn et al., Omnidirectional printing of flexible, stretchable, and spanning silver microelectrodes. Science 323(5921), 1590–1593 (2009)CrossRef
111.
E. Macdonald et al., 3D printing for the rapid prototyping of structural electronics. IEEE Access 2, 234–242 (2014)CrossRef
112.
P. Mostafalu, M. Akbari, K.A. Alberti, Q. Xu, A. Khademhosseini, S.R. Sonkusale, A toolkit of thread-based microfluidics, sensors, and electronics for 3D tissue embedding for medical diagnostics. Microsyst. Nanoeng. 2, 16039 (2016)CrossRef
113.
T.F. O’Connor, K.M. Rajan, A.D. Printz, D.J. Lipomi, Toward organic electronics with properties inspired by biological tissue. J. Mater. Chem. B 3(25), 4947–4952 (2015)CrossRef
114.
L. Cai, C. Wang, Carbon nanotube flexible and stretchable electronics. Nanoscale Res. Lett. 10(1), 1–21 (2015)CrossRef
115.
J. Li et al., Graphene film-functionalized germanium as a chemically stable, electrically conductive, and biologically active substrate. J. Mater. Chem. B 3(8), 1544–1555 (2015)CrossRef
116.
S. Wang, Y. Huang, J.A. Rogers, Mechanical designs for inorganic stretchable circuits in soft electronics. IEEE Trans. Compon. Packag. Manuf. Technol. 5(9), 1201–1218 (2015)CrossRef
117.
C. Wang, J.-.C. Chien, K. Takei, T. Takahashi, J. Nah, A.M. Niknejad, Extremely bendable, high-performance integrated circuits using semiconducting carbon nanotube networks for digital, analog, and radio-frequency applications. Nano Lett. 12(3), 1527–1533 (2012)
118.
C. Wang, D. Hwang, Z. Yu, K. Takei, J. Park, T. Chen, User-interactive electronic skin for instantaneous pressure visualization. Nat Mater 12, 899–904 (2013)
119.
N. Chou, S. Yoo, S. Kim, A largely deformable surface type neural electrode array based on PDMS. IEEE Trans. Neural Syst. Rehabil. Eng. 21(4), 544–553 (2013)CrossRef
120.
S.J. Kim et al., The potential role of polymethyl methacrylate as a new packaging material for the implantable medical device in the bladder. Biomed. Res. Int. 2015, 852456 (2015)
121.
W. J. Bae et al., AB222. Comparison of biocompatibility between PDMS and PMMA as packaging materials for the intravesical implantable device: changes of macrophage and macrophage migratory inhibitory factor. Transl. Androl. Urol. 3(Suppl 1) (2014)
122.
B. Rubehn, T. Stieglitz, In vitro evaluation of the long-term stability of polyimide as a material for neural implants. Biomaterials 31(13), 3449–3458 (2010)CrossRef
123.
Y. Qin, M.M.R. Howlader, M.J. Deen, Y.M. Haddara, P.R. Selvaganapathy, Polymer integration for packaging of implantable sensors. Sens. Actuators B Chem. 202, 758–778 (2014)CrossRef
124.
M.M.R. Howlader, M. Iwashita, K. Nanbu, K. Saijo, T. Suga, Enhanced Cu/LCP adhesion by pre-sputter cleaning prior to Cu deposition. IEEE Trans. Adv. Packag. 28(3), 495–502 (2005)CrossRef
125.
Y. Zhang, D. Li, Y. Li, S. Zhang, M. Wang, Y. Li, High electric conductivity of liquid crystals formed by ordered self-assembly of nonionic surfactant N,N-bis(2-hydroxyethyl)dodecanamide in water. Soft Matter 11(9), 1762–1766 (2015)CrossRef
126.
C.J. Bettinger, J.P. Bruggeman, A. Misra, J.T. Borenstein, R. Langer, Biocompatibility of biodegradable semiconducting melanin films for nerve tissue engineering. Biomaterials 30(17), 3050–3057 (2009)CrossRef
127.
C.L.E. Nijst et al., Synthesis and characterization of photocurable elastomers from poly(glycerol-co-sebacate). Biomacromol 8(10), 3067–3073 (2007)CrossRef
128.
M. Strange, D. Plackett, M. Kaasgaard, F.C. Krebs, Biodegradable polymer solar cells. Sol. Energy Mater. Sol. Cells 92(7), 805–813 (2008)CrossRef
129.
A. Campana, T. Cramer, D.T. Simon, M. Berggren, F. Biscarini, Electrocardiographic recording with conformable organic electrochemical transistor fabricated on resorbable bioscaffold. Adv. Mater. 26(23), 3874–3878 (2014)CrossRef
130.
G. Mattana, D. Briand, A. Marette, A. Vásquez Quintero, N.F. de Rooij, Polylactic acid as a biodegradable material for all-solution-processed organic electronic devices. Org. Electron. 17, 77–86 (2015)
131.
D.-H. Kim et al., Dissolvable films of silk fibroin for ultrathin conformal bio-integrated electronics. Nat. Mater. 9(6), 511–517 (2010)CrossRef
132.
Y. Liu et al., Highly flexible and lightweight organic solar cells on biocompatible silk fibroin. ACS Appl. Mater. Interfaces. 6(23), 20670–20675 (2014)CrossRef
133.
C.J. Bettinger, Z. Bao, Organic thin-film transistors fabricated on resorbable biomaterial substrates. Adv. Mater. 22(5), 651–655 (2010)CrossRef
134.
M. Irimia-Vladu et al., Indigo—a natural pigment for high performance ambipolar organic field effect transistors and circuits. Adv. Mater. 24(3), 375–380 (2012)CrossRef
135.
M. Irimia-Vladu, N.S. Sariciftci, S. Bauer, Exotic materials for bio-organic electronics. J. Mater. Chem. 21(5), 1350–1361 (2011)CrossRef
136.
M. Irimia-Vladu et al., Biocompatible and biodegradable materials for organic field-effect transistors. Adv. Funct. Mater. 20(23), 4069–4076 (2010)CrossRef
137.
T.K. Das, S. Prusty, Review on conducting polymers and their applications. Polym.-Plast. Technol. Eng. 51(14), 1487–1500 (2012)CrossRef
138.
N.K. Guimard, N. Gomez, C.E. Schmidt, Conducting polymers in biomedical engineering. Prog. Polym. Sci. 32(8–9), 876–921 (2007)CrossRef
139.
S. Kim, J.-H. Kim, O. Jeon, I.C. Kwon, K. Park, Engineered polymers for advanced drug delivery. Eur. J. Pharm. Biopharm. 71(3), 420–430 (2009)CrossRef
140.
J.K. Oh, R. Drumright, D.J. Siegwart, K. Matyjaszewski, The development of microgels/nanogels for drug delivery applications. Prog. Polym. Sci. 33(4), 448–477 (2008)CrossRef
141.
S. Nambiar, J.T.W. Yeow, Conductive polymer-based sensors for biomedical applications. Biosens. Bioelectron. 26(5), 1825–1832 (2011)CrossRef
142.
H. Shirakawa, E.J. Louis, A.G. MacDiarmid, C.K. Chiang, A.J. Heeger, Synthesis of electrically conducting organic polymers: halogen derivatives of polyacetylene, (CH)x. J. Chem. Soc. Chem. Commun. 16, 578–580 (1977)CrossRef
143.
C.K. Chiang et al., Electrical conductivity in doped polyacetylene. Phys. Rev. Lett. 39(17), 1098–1101 (1977)CrossRef
144.
C.K. Chiang, S.C. Gau, C.R.F. Jr, Y.W. Park, A.G. MacDiarmid, A.J. Heeger, Polyacetylene, (CH)x: n-type and p-type doping and compensation. Appl. Phys. Lett. 33(1), 18–20 (1978)CrossRef
145.
S. Stassi, V. Cauda, G. Canavese, C.F. Pirri, Flexible tactile sensing based on piezoresistive composites: a review. Sensors 14(3), 5296–5332 (2014)CrossRef
146.
C. Li, P.M. Wu, S. Lee, A. Gorton, M.J. Schulz, C.H. Ahn, Flexible dome and bump shape piezoelectric tactile sensors using PVDF-TrFE copolymer. J. Microelectromechanical Syst. 17(2), 334–341 (2008)CrossRef
147.
V. Maheshwari, R.F. Saraf, High-resolution thin-film device to sense texture by touch. Science 312(5779), 1501–1504 (2006)CrossRef
148.
T. Nelson, R. vanDover, S. Jin, S. Hackwood, G. Beni, Shear-sensitive magnetoresistive robotic tactile sensor. IEEE Trans. Magn. 22(5), 394–396 (1986)
149.
G.M. Krishna, K. Rajanna, Tactile sensor based on piezoelectric resonance. IEEE Sens. J. 4(5), 691–697 (2004)CrossRef
150.
S.C.B. Mannsfeld et al., Highly sensitive flexible pressure sensors with microstructured rubber dielectric layers. Nat. Mater. 9(10), 859–864 (2010)CrossRef
151.
J.A. Dobrzynska, M.A.M. Gijs, Flexible polyimide-based force sensor. Sens. Actuators Phys. 173(1), 127–135 (2012)CrossRef
152.
Y. Zhou, C.-W. Chiu, H. Liang, Interfacial structures and properties of organic materials for biosensors: an overview. Sensors 12(11), 15036–15062 (2012)CrossRef
153.
J. Janata, M. Josowicz, Conducting polymers in electronic chemical sensors. Nat. Mater. 2(1), 19–24 (2003)CrossRef
154.
M. Gerard, A. Chaubey, B.D. Malhotra, Application of conducting polymers to biosensors. Biosens. Bioelectron. 17(5), 345–359 (2002)CrossRef
155.
D.D. Borole, U.R. Kapadi, P.P. Mahulikar, D.G. Hundiwale, Conducting polymers: an emerging field of biosensors. Des. Monomers Polym. 9(1), 1–11 (2006)CrossRef
156.
C.-C. Wen, W. Fang, Tuning the sensing range and sensitivity of three axes tactile sensors using the polymer composite membrane. Sens. Actuators Phys. 145–146, 14–22 (2008)CrossRef
157.
B.J. Kane, M.R. Cutkosky, G.T.A. Kovacs, A traction stress sensor array for use in high-resolution robotic tactile imaging. J. Microelectromechanical Syst. 9(4), 425–434 (2000)CrossRef
158.
H. Hu, K. Shaikh, C. Liu, Super flexible sensor skin using liquid metal as interconnect, 2007 in IEEE Sensors (2007), pp. 815–817
159.
M.-Y. Cheng, C.-M. Tsao, Y.-Z. Lai, Y.-J. Yang, The development of a highly twistable tactile sensing array with stretchable helical electrodes. Sens. Actuators Phys. 166(2), 226–233 (2011)CrossRef
160.
Y.-J. Yang et al., An integrated flexible temperature and tactile sensing array using PI-copper films. Sens. Actuators Phys. 143(1), 143–153 (2008)CrossRef
161.
B. Dong, M. Krutschke, X. Zhang, L. Chi, H. Fuchs, Fabrication of polypyrrole wires between microelectrodes. Small 1(5), 520–524 (2005)CrossRef
162.
B. Dong, D.Y. Zhong, L.F. Chi, H. Fuchs, Patterning of conducting polymers based on a random copolymer strategy: toward the facile fabrication of nanosensors exclusively based on polymers. Adv. Mater. 17(22), 2736–2741 (2005)CrossRef
163.
A. Ambrosi, C.K. Chua, A. Bonanni, M. Pumera, Electrochemistry of graphene and related materials. Chem. Rev. 114(14), 7150–7188 (2014)CrossRef
164.
A. Nathan et al., Flexible electronics: the next ubiquitous platform. Proc. IEEE. 100(Special Centennial Issue), May 2012, pp. 1486–1517
165.
A.K. Geim, K.S. Novoselov, The rise of graphene. Nat. Mater. 6(3), 183–191 (2007)CrossRef
166.
K.S. Novoselov et al., Electric field effect in atomically thin carbon films. Science 306(5696), 666–669 (2004)CrossRef
167.
F. Withers et al., Light-emitting diodes by band-structure engineering in van der Waals heterostructures. Nat. Mater. 14(3), 301–306 (2015)CrossRef
168.
Q.H. Wang, K. Kalantar-Zadeh, A. Kis, J.N. Coleman, M.S. Strano, Electronics and optoelectronics of two-dimensional transition metal dichalcogenides. Nat. Nanotechnol. 7(11), 699–712 (2012)CrossRef
169.
F. Schwierz, Graphene transistors. Nat. Nanotechnol. 5(7), 487–496 (2010)CrossRef
170.
S.-K. Lee et al., All graphene-based thin film transistors on flexible plastic substrates. Nano Lett. 12(7), 3472–3476 (2012)CrossRef
171.
S.-K. Lee et al., Stretchable graphene transistors with printed dielectrics and gate electrodes. Nano Lett. 11(11), 4642–4646 (2011)CrossRef
172.
S. Riazimehr et al., Spectral sensitivity of graphene/silicon heterojunction photodetectors. Solid-State Electron. 115(Part B), 207–212 (2016)
173.
M.C. Lemme et al., Gate-activated photoresponse in a graphene p–n junction. Nano Lett. 11(10), 4134–4137 (2011)CrossRef
174.
T. Mueller, F. Xia, P. Avouris, Graphene photodetectors for high-speed optical communications. Nat. Photonics 4(5), 297–301 (2010)CrossRef
175.
X. Gan et al., Chip-integrated ultrafast graphene photodetector with high responsivity. Nat. Photonics 7(11), 883–887 (2013)CrossRef
176.
A. Pospischil et al., CMOS-compatible graphene photodetector covering all optical communication bands. Nat. Photonics 7(11), 892–896 (2013)CrossRef
177.
F.H.L. Koppens, T. Mueller, P. Avouris, A.C. Ferrari, M.S. Vitiello, M. Polini, Photodetectors based on graphene, other two-dimensional materials and hybrid systems. Nat. Nanotechnol. 9(10), 780–793 (2014)CrossRef
178.
D.-M. Sun, C. Liu, W.-C. Ren, H.-M. Cheng, A review of carbon nanotube- and graphene-based flexible thin-film transistors. Small 9(8), 1188–1205 (2013)CrossRef
179.
L. Buglione, E.L.K. Chng, A. Ambrosi, Z. Sofer, M. Pumera, Graphene materials preparation methods have dramatic influence upon their capacitance. Electrochem. Commun. 14(1), 5–8 (2012)CrossRef
180.
A. Bonanni, M. Pumera, High-resolution impedance spectroscopy for graphene characterization. Electrochem. Commun. 26, 52–54 (2013)CrossRef
181.
G. Eda, M. Chhowalla, Chemically derived graphene oxide: towards large-area thin-film electronics and optoelectronics. Adv. Mater. 22(22), 2392–2415 (2010)CrossRef
182.
S. Bae et al., Roll-to-roll production of 30-inch graphene films for transparent electrodes. Nat. Nanotechnol. 5(8), 574–578 (2010)CrossRef
183.
T. Kobayashi et al., Production of a 100-m-long high-quality graphene transparent conductive film by roll-to-roll chemical vapor deposition and transfer process. Appl. Phys. Lett. 102(2), 023112 (2013)CrossRef
184.
L. Gao, G.-X. Ni, Y. Liu, B. Liu, A.H. Castro Neto, K.P. Loh, Face-to-face transfer of wafer-scale graphene films. Nature 505(7482), 190–194 (2014)
185.
C. Yan, J.H. Cho, J.-H. Ahn, Graphene-based flexible and stretchable thin film transistors. Nanoscale 4(16), 4870–4882 (2012)CrossRef
186.
K.S. Kim et al., Large-scale pattern growth of graphene films for stretchable transparent electrodes. Nature 457(7230), 706–710 (2009)CrossRef
187.
M.F. El-Kady, V. Strong, S. Dubin, R.B. Kaner, Laser Scribing of High-Performance and flexible graphene-based electrochemical capacitors. Science 335(6074), 1326–1330 (2012)CrossRef
188.
V.L. Solozhenko, A.G. Lazarenko, J.-P. Petitet, A.V. Kanaev, Bandgap energy of graphite-like hexagonal boron nitride. J. Phys. Chem. Solids 62(7), 1331–1334 (2001)CrossRef
189.
H. Amano, T. Asahi, I. Akasaki, Stimulated emission near ultraviolet at room temperature from a GaN film grown on sapphire by MOVPE using an AlN buffer layer. Jpn. J. Appl. Phys. 29(Part 2, No. 2), L205–L206 (1990)
190.
K. Watanabe, T. Taniguchi, H. Kanda, Direct-bandgap properties and evidence for ultraviolet lasing of hexagonal boron nitride single crystal. Nat. Mater. 3(6), 404–409 (2004)CrossRef
191.
M. Wang et al., A platform for large-scale graphene electronics—CVD growth of single-layer graphene on CVD-grown hexagonal boron nitride. Adv. Mater. 25(19), 2746–2752 (2013)CrossRef
192.
C.R. Dean et al., Boron nitride substrates for high-quality graphene electronics. Nat. Nanotechnol. 5(10), 722–726 (2010)CrossRef
193.
K.K. Kim et al., Synthesis and characterization of hexagonal boron nitride film as a dielectric layer for graphene devices. ACS Nano 6(10), 8583–8590 (2012)CrossRef
194.
Z. Liu et al., In-plane heterostructures of graphene and hexagonal boron nitride with controlled domain sizes. Nat. Nanotechnol. 8(2), 119–124 (2013)CrossRef
195.
E. Kim, T. Yu, E.S. Song, B. Yu, Chemical vapor deposition-assembled graphene field-effect transistor on hexagonal boron nitride. Appl. Phys. Lett. 98(26), 262103 (2011)CrossRef
196.
J. Lee et al., High-performance current saturating graphene field-effect transistor with hexagonal boron nitride dielectric on flexible polymeric substrates. IEEE Electron Device Lett. 34(2), 172–174 (2013)CrossRef
197.
R. Coehoorn, C. Haas, J. Dijkstra, C.J.F. Flipse, R.A. de Groot, A. Wold, Electronic structure of MoSe2, MoS2, and WSe2. I. Band-structure calculations and photoelectron spectroscopy. Phys. Rev. B 35(12), 6195–6202 (1987)CrossRef
198.
C. Feng, J. Ma, H. Li, R. Zeng, Z. Guo, H. Liu, Synthesis of molybdenum disulfide (MoS2) for lithium ion battery applications. Mater. Res. Bull. 44(9), 1811–1815 (2009)CrossRef
199.
C. Lee et al., Frictional characteristics of atomically thin sheets. Science 328(5974), 76–80 (2010)CrossRef
200.
J.A. Wilson, A.D. Yoffe, The transition metal dichalcogenides discussion and interpretation of the observed optical, electrical and structural properties. Adv. Phys. 18(73), 193–335 (1969)CrossRef
201.
B. Radisavljevic, A. Radenovic, J. Brivio, V. Giacometti, A. Kis, Single-layer MoS2 transistors. Nat. Nanotechnol. 6(3), 147–150 (2011)CrossRef
202.
N.R. Pradhan et al., Field-effect transistors based on few-layered α-MoTe2. ACS Nano. 8(6), 5911–5920 (2014)CrossRef
203.
G.-H. Lee et al., Flexible and transparent MoS2 field-effect transistors on hexagonal boron nitride-graphene heterostructures. ACS Nano. 7(9), 7931–7936 (2013)CrossRef
204.
G. Fiori et al., Electronics based on two-dimensional materials. Nat. Nanotechnol. 9(10), 768–779 (2014)CrossRef
205.
D. B. Velusamy et al., Flexible transition metal dichalcogenide nanosheets for band-selective photodetection. Nat. Commun. 6, 8063 (2015)
206.
C. Kim, T.P. Nguyen, Q.V. Le, J.-M. Jeon, H.W. Jang, S.Y. Kim, Performances of liquid-exfoliated transition metal dichalcogenides as hole injection layers in organic light-emitting diodes. Adv. Funct. Mater. 25(28), 4512–4519 (2015)CrossRef
207.
A.C. Arias, J.D. MacKenzie, I. McCulloch, J. Rivnay, A. Salleo, Materials and applications for large area electronics: solution-based approaches, Chem. Rev. 110(1), 3–24 (2010)
208.
S.H. Chang, C.H. Chiang, F.S. Kao, C.L. Tien, C.G. Wu, Unraveling the enhanced electrical conductivity of PEDOT:PSS thin films for ITO-free organic photovoltaics. IEEE Photonics J. 6(4), 1–7 (2014)CrossRef
209.
H. Klauk, Organic thin-film transistors. Chem. Soc. Rev. 39, 2643–2666 (2010)
210.
T.W. Kelley et al., Recent progress in organic electronics: materials, devices, and processes. Chem. Mater. 16(23), 4413–4422 (2004)CrossRef
211.
F. Eder, H. Klauk, M. Halik, U. Zschieschang, G. Schmid, C. Dehm, Organic electronics on paper. Appl. Phys. Lett. 84(14), 2673–2675 (2004)CrossRef
212.
V. Benfenati et al., A transparent organic transistor structure for bidirectional stimulation and recording of primary neurons. Nat. Mater. 12(7), 672–680 (2013)MathSciNetCrossRef
213.
M. Katsuhara et al., 44.2: Distinguished Paper: a reliable flexible OLED display with an OTFT backplane manufactured using a scalable process. SID Symp. Dig. Tech. Pap. 40(1), 656–659 (2009)CrossRef
214.
T. Sekitani, T. Someya, Stretchable, large-area organic electronics. Adv. Mater. 22 (2010)
215.
A.S. Azam, M. Boukadoum, R. Izquierdo, A. Acharya, M. Packirisamy, Integrated multifunctional fluorescence biosensor based on OLED technology, in 2008 Joint 6th International IEEE Northeast Workshop on Circuits and Systems and TAISA Conference (NEWCAS-TAISA 2008) (2008), pp. 173–176
216.
K.L. Lin, K. Jain, Design and fabrication of stretchable multilayer self-aligned interconnects for flexible electronics and large-area sensor arrays using excimer laser photoablation. IEEE Electron Device Lett. 30(1), 14–17 (2009)CrossRef
217.
K.-S. Kim, K.-H. Jung, S.-B. Jung, Design and fabrication of screen-printed silver circuits for stretchable electronics. Microelectron. Eng. 120, 216–220 (2014)CrossRef
218.
H.J. Kim, T. Maleki, P. Wei, B. Ziaie, A Biaxial Stretchable interconnect with liquid-alloy-covered joints on elastomeric substrate. J. Microelectromechanical Syst. 18(1), 138–146 (2009)CrossRef
219.
H. Hocheng, C.-M. Chen, Design, fabrication and failure analysis of stretchable electrical routings. Sensors 14(7), 11855–11877 (2014)CrossRef
220.
T. Cheng, Y. Zhang, W.-Y. Lai, W. Huang, Stretchable thin-film electrodes for flexible electronics with high deformability and stretchability. Adv. Mater. 27(22), 3349–3376 (2015)CrossRef
221.
Y. Zhang et al., Experimental and theoretical studies of serpentine microstructures bonded to prestrained elastomers for stretchable electronics. Adv. Funct. Mater. 24(14), 2028–2037 (2014)CrossRef
222.
J. Lee et al., Stretchable GaAs photovoltaics with designs that enable high areal coverage. Adv. Mater. 23(8), 986–991 (2011)CrossRef
223.
C. Yu, H. Jiang, Forming wrinkled stiff films on polymeric substrates at room temperature for stretchable interconnects applications. Thin Solid Films 519(2), 818–822 (2010)CrossRef
224.
S.P. Lacour, J. Jones, Z. Suo, S. Wagner, Design and performance of thin metal film interconnects for skin-like electronic circuits. IEEE Electron Device Lett. 25(4), 179–181 (2004)CrossRef
225.
Y.Y. Hsu, M. Gonzalez, F. Bossuyt, J. Vanfleteren, I.D. Wolf, Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization. IEEE Trans. Electron Devices 58(8), 2680–2688 (2011)CrossRef
226.
Y. Zhang et al., Buckling in serpentine microstructures and applications in elastomer-supported ultra-stretchable electronics with high areal coverage. Soft Matter 9(33), 8062–8070 (2013)CrossRef
227.
Y.-Y. Hsu, M. Gonzalez, F. Bossuyt, F. Axisa, J. Vanfleteren, I. De Wolf, The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects. Thin Solid Films 519(7), 2225–2234 (2011)CrossRef
228.
Mario Gonzalez, Fabrice Axisa, Frederick Bossuyt, Yung-Yu. Hsu, Bart Vandevelde, Jan Vanfleteren, Design and performance of metal conductors for stretchable electronic circuits. Circuit World 35(1), 22–29 (2009)CrossRef
229.
M. Gonzalez, F. Axisa, M.V. Bulcke, D. Brosteaux, B. Vandevelde, J. Vanfleteren, Design of metal interconnects for stretchable electronic circuits. Microelectron. Reliab. 48(6), 825–832 (2008)CrossRef
230.
O. van der Sluis, Y.Y. Hsu, P.H.M. Timmermans, M. Gonzalez, J.P.M. Hoefnagels, Stretching-induced interconnect delamination in stretchable electronic circuits. J. Phys. Appl. Phys. 44(3), 034008 (2011)CrossRef
231.
S. Xu et al., Stretchable batteries with self-similar serpentine interconnects and integrated wireless recharging systems. Nat. Commun. 4, 1543 (2013)CrossRef
232.
Y.-Y. Hsu, M. Gonzalez, F. Bossuyt, F. Axisa, J. Vanfleteren, I.D. Wolf, The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit. J. Micromechanics Microengineering 20(7), 075036 (2010)CrossRef
233.
D.S. Gray, J. Tien, C.S. Chen, High-conductivity elastomeric electronics. Adv. Mater. 16(5), 393–397 (2004)CrossRef
234.
A.M. Hussain, E.B. Lizardo, G.A. Torres Sevilla, J.M. Nassar, M.M. Hussain, Ultrastretchable and flexible copper interconnect-based smart patch for adaptive thermotherapy. Adv. Healthcare Mater. 4(5), 665–673 (2015)CrossRef
235.
J.A. Fan et al., Fractal design concepts for stretchable electronics. Nat. Commun. 5, 3266 (2014)
236.
L. Bowman, J.D. Meindl, The packaging of implantable integrated sensors. IEEE Trans. Biomed. Eng. BME-33(2), 248–255 (1986)
237.
D.F. Williams, Biocompatibility of Clinical Implant Materials (CRC Press, Boca Raton, 1981)
238.
G. Jiang, D.D. Zhou, Technology advances and challenges in hermetic packaging for implantable medical devices, in Implantable Neural Prostheses 2, ed. by D. Zhou, E. Greenbaum (Springer, New York, 2009), pp. 27–61CrossRef
239.
A. Cavallini et al., A subcutaneous biochip for remote monitoring of human metabolism: packaging and biocompatibility assessment. IEEE Sens. J. 15(1), 417–424 (2015)CrossRef
240.
T.J. Harpster, S.A. Nikles, M.R. Dokmeci, K. Najafi, Long-term hermeticity and biological performance of anodically bonded glass-silicon implantable packages. IEEE Trans. Device Mater. Reliab. 5(3), 458–466 (2005)CrossRef
241.
K. Najafi, Packaging of implantable microsystems, in 2007 IEEE Sensors (2007), pp. 58–63
242.
K. Najafi, in Micropackaging technologies for integrated microsystems: applications to MEMS and MOEMS (2003), pp. 1–19
243.
T.J. Harpster, S. Hauvespre, M.R. Dokmeci, K. Najafi, A passive humidity monitoring system for in situ remote wireless testing of micropackages. J. Microelectromechanical Syst. 11(1), 61–67 (2002)CrossRef
244.
T. Stieglitz, Manufacturing, assembling and packaging of miniaturized neural implants. Microsyst. Technol. 16(5), 723–734 (2010)CrossRef
245.
M. Schuettler, J.S. Ordonez, T.S. Santisteban, A. Schatz, J. Wilde, T. Stieglitz, Fabrication and test of a hermetic miniature implant package with 360 electrical feedthroughs, in 2010 Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) (2010), pp. 1585–1588
246.
M. Schuettler, A. Schatz, J.S. Ordonez, T. Stieglitz, Ensuring minimal humidity levels in hermetic implant housings, in 2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC (2011), pp. 2296–2299
247.
J.S. Ordonez, M. Schuettler, M. Ortmanns, T. Stieglitz, A 232-channel retinal vision prosthesis with a miniaturized hermetic package, in 2012 Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) (2012), pp. 2796–2799
248.
N. Saeidi, M. Schuettler, A. Demosthenous, N. Donaldson, Technology for integrated circuit micropackages for neural interfaces, based on gold–silicon wafer bonding. J. Micromechanics Microengineering 23(7), 075021 (2013)CrossRef
249.
N. Saeidi, J. Strutwolf, A. Marechal, A. Demosthenous, N. Donaldson, A capacitive humidity sensor suitable for CMOS integration. IEEE Sens. J. 13(11), 4487–4495 (2013)CrossRef
250.
N. Saeidi, A. Demosthenous, N. Donaldson, J. Alderman, Design and fabrication of corrosion and humidity sensors for performance evaluation of chip scale hermetic packages for biomedical implantable devices, in European Microelectronics and Packaging Conference 2009 (EMPC 2009) (2009), pp. 1–4
251.
A. Ivorra et al., Minimally invasive silicon probe for electrical impedance measurements in small animals. Biosens. Bioelectron. 19(4), 391–399 (2003)MathSciNetCrossRef
252.
R. Gómez et al., A SiC microdevice for the minimally invasive monitoring of ischemia in living tissues. Biomed. Microdevices 8(1), 43–49 (2006)CrossRef
253.
M. Tijero et al., SU-8 microprobe with microelectrodes for monitoring electrical impedance in living tissues. Biosens. Bioelectron. 24(8), 2410–2416 (2009)CrossRef
254.
A.A. Sharkawy, B. Klitzman, G.A. Truskey, W.M. Reichert, Engineering the tissue which encapsulates subcutaneous implants. I. Diffusion properties. J. Biomed. Mater. Res. 37(3), 401–412 (1997)CrossRef
255.
A.A. Sharkawy, B. Klitzman, G.A. Truskey, W.M. Reichert, Engineering the tissue which encapsulates subcutaneous implants. III. Effective tissue response times. J. Biomed. Mater. Res. 40(4), 598–605 (1998)CrossRef
256.
T. Trantidou, D.J. Payne, V. Tsiligkiridis, Y.-C. Chang, C. Toumazou, T. Prodromakis, The dual role of Parylene C in chemical sensing: acting as an encapsulant and as a sensing membrane for pH monitoring applications. Sens. Actuators B Chem. 186, 1–8 (2013)CrossRef
257.
G.S. Prihandana et al., Solute diffusion through fibrotic tissue formed around protective cage system for implantable devices. J. Biomed. Mater. Res. B Appl. Biomater. 103(6), 1180–1187 (2015)CrossRef
258.
M.M.R. Howlader, A.U. Alam, R.P. Sharma, M.J. Deen, Materials analyses and electrochemical impedance of implantable metal electrodes. Phys. Chem. Chem. Phys. 17(15), 10135–10145 (2015)CrossRef
259.
M. Schuettler, T. Stieglitz, Microassembly and micropackaging of implantable systems, in Implantable Sensor Systems for Medical Applications (Woodhead Publishing, Oxford, 2013), pp. 108–149
260.
M. Dokmeci, K. Najafi, A high-sensitivity polyimide capacitive relative humidity sensor for monitoring anodically bonded hermetic micropackages. J. Microelectromechanical Syst. 10(2), 197–204 (2001)CrossRef
261.
D. Cirmirakis, A. Demosthenous, N. Saeidi, N. Donaldson, Humidity-to-Frequency sensor in cmos technology with wireless readout. IEEE Sens. J. 13(3), 900–908 (2013)CrossRef
262.
G.S. Wilson, M. Ammam, In vivo biosensors. FEBS J. 274(21), 5452–5461 (2007)CrossRef
263.
G.S. Wilson, R. Gifford, Biosensors for real-time in vivo measurements. Biosens. Bioelectron. 20(12), 2388–2403 (2005)CrossRef
264.
S. Vaddiraju, I. Tomazos, D.J. Burgess, F.C. Jain, F. Papadimitrakopoulos, Emerging synergy between nanotechnology and implantable biosensors: a review. Biosens. Bioelectron. 25(7), 1553–1565 (2010)CrossRef
265.
C.N. Kotanen, A. Guiseppi-Elie, Monitoring systems and quantitative measurement of biomolecules for the management of Trauma. Biomed. Microdevices 15(3), 561–577 (2013)CrossRef
266.
J.H. Shin, M.H. Schoenfisch, Improving the biocompatibility of in vivo sensors via nitric oxide release. Analyst 131(5), 609–615 (2006)CrossRef
267.
M. Frost, M.E. Meyerhoff, In vivo chemical sensors: tackling biocompatibility. Anal. Chem. 78(21), 7370–7377 (2006)CrossRef
268.
Y. Onuki, U. Bhardwaj, F. Papadimitrakopoulos, D.J. Burgess, A review of the biocompatibility of implantable devices: current challenges to overcome foreign body response. J. Diabetes Sci. Technol. 2(6), 1003–1015 (2008)CrossRef
269.
L.A. Geddes, R. Roeder, Criteria for the selection of materials for implanted electrodes. Ann. Biomed. Eng. 31(7), 879–890 (2003)
270.
A. Radu et al., Diagnostic of functionality of polymer membrane – based ion selective electrodes by impedance spectroscopy. Anal. Methods 2(10), 1490–1498 (2010)CrossRef
271.
R.C. Mercado, F. Moussy, In vitro and in vivo mineralization of Nafion membrane used for implantable glucose sensors. Biosens. Bioelectron. 13(2), 133–145 (1998)CrossRef
272.
S.R. Shah, A.M. Tatara, R.N. D’Souza, A.G. Mikos, F.K. Kasper, Evolving strategies for preventing biofilm on implantable materials. Mater. Today 16(5), 177–182 (2013)CrossRef
273.
J.D. Patel, M. Ebert, R. Ward, J.M. Anderson, S. epidermidis biofilm formation: effects of biomaterial surface chemistry and serum proteins. J. Biomed. Mater. Res. A 80A(3), 742–751 (2007)CrossRef
274.
E.M. Hetrick, M.H. Schoenfisch, Reducing implant-related infections: active release strategies. Chem. Soc. Rev. 35(9), 780–789 (2006)CrossRef
275.
J.M. Anderson, Biological responses to materials. Annu. Rev. Mater. Res. 31(1), 81–110 (2001)CrossRef
276.
J.A. Jones et al., Proteomic analysis and quantification of cytokines and chemokines from biomaterial surface-adherent macrophages and foreign body giant cells. J. Biomed. Mater. Res. A 83A(3), 585–596 (2007)CrossRef
277.
E. Ostuni, R.G. Chapman, R.E. Holmlin, S. Takayama, G.M. Whitesides, A survey of structure—property relationships of surfaces that resist the adsorption of protein. Langmuir 17(18), 5605–5620 (2001)CrossRef
278.
N. Tirelli, M.P. Lutolf, A. Napoli, J.A. Hubbell, Poly(ethylene glycol) block copolymers. Rev. Mol. Biotechnol. 90(1), 3–15 (2002)CrossRef
279.
I.A. Silver, R.J. Murrills, D.J. Etherington, Microelectrode studies on the acid microenvironment beneath adherent macrophages and osteoclasts. Exp. Cell Res. 175(2), 266–276 (1988)CrossRef
280.
A. Koh, S.P. Nichols, M.H. Schoenfisch, Glucose sensor membranes for mitigating the foreign body response. J. Diabetes Sci. Technol. 5(5), 1052–1059 (2011)CrossRef
281.
R.D. Jayant, M.J. McShane, R. Srivastava, In vitro and in vivo evaluation of anti-inflammatory agents using nanoengineered alginate carriers: towards localized implant inflammation suppression. Int. J. Pharm. 403(1–2), 268–275 (2011)CrossRef
282.
Y. Wang, F. Papadimitrakopoulos, D.J. Burgess, Polymeric ‘smart’ coatings to prevent foreign body response to implantable biosensors. J. Controlled Release 169(3), 341–347 (2013)CrossRef
283.
J.H. Shin, S.M. Marxer, M.H. Schoenfisch, Nitric oxide-releasing sol–gel particle/polyurethane glucose biosensors. Anal. Chem. 76(15), 4543–4549 (2004)CrossRef
284.
G.S. Wilson, M.A. Johnson, In-vivo electrochemistry: what can we learn about living systems?. Chem. Rev. 108(7), 2462–2481 (2008)
285.
D.L. Hern, J.A. Hubbell, Incorporation of adhesion peptides into nonadhesive hydrogels useful for tissue resurfacing. J. Biomed. Mater. Res. 39(2), 266–276 (1998)CrossRef
286.
B.D. Ratner, S.J. Bryant, Biomaterials: where we have been and where we are going. Annu. Rev. Biomed. Eng. 6(1), 41–75 (2004)CrossRef
287.
Use of International Standard ISO 10993-1, ‘Biological evaluation of medical devices—Part 1: Evaluation and testing within a risk management process’: Guidance for Industry and Food and Drug Administration Staff. U.S. Department of Health and Human Services, Food and Drug Administration, Center for Devices and Radiological Health, 16 June 2016
Metadaten
Titel
Sensor Embodiment and Flexible Electronics
verfasst von
P. Kassanos
S. Anastasova
C. M. Chen
Guang-Zhong Yang
Copyright-Jahr
2018
Buch
Implantable Sensors and Systems

Print ISBN: 978-3-319-69747-5

Electronic ISBN: 978-3-319-69748-2

Copyright-Jahr: 2018

DOI
https://doi.org/10.1007/978-3-319-69748-2_4