nach oben

Erschienen in:

2018 | OriginalPaper | Buchkapitel

9. Silicon Micro-/Nanomachining and Applications

verfasst von : Hoang-Phuong Phan, Dzung Viet Dao, Nam-Trung Nguyen

Erschienen in: Micro and Nanomanufacturing Volume II

Verlag: Springer International Publishing

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config

KI-gestützte Suche

Aus

Abstract

The invention of silicon (Si)-based diodes and especially the Si bipolar transistors by Shockley, Bardeen, and Brattain seven decades ago has triggered the era of fast-growing information and computer technologies. As a consequence, the development into microelectronic fabrication technologies has also been extensively investigated and progressed to reduce device size and to increase the integration, as well as to enhance their performance. The growing rate of the state-of-the-art microprocessors has reached above Moore’s law, which states that the number of transistors on a chip doubles roughly every 2 years. This achievement is largely attributed to the advanced micro- and nanofabrication processing [1].

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

über 102.000 Bücher
über 537 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Finance + Banking
Management + Führung
Marketing + Vertrieb
Maschinenbau + Werkstoffe
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 390 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Maschinenbau + Werkstoffe

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Vorheriges Kapitel Atomic Force Microscopy for Microbial Cell Surfaces

Nächstes Kapitel Solid-State Micropores for Living Cell Detection and Discrimination

Venema L (2011) Silicon electronics and beyond. Nature 479(7373):309–309CrossRef

Gad-el-Hak M (ed) (2001) The MEMS handbook. CRC Press, Boca RatonMATH

Mnyusiwalla A, Daar AS, Singer PA (2003) Mind the gap’: science and ethics in nanotechnology. Nanotechnology 14(3):R9CrossRef

Shimura F (ed) (2012) Semiconductor silicon crystal technology. Elsevier, Amsterdam

Sze SM, Ng KK (2006) Physics of semiconductor devices. Wiley, HobokenCrossRef

Ghibaudo G, Rafhay Q (2014) Electron and hole mobility in semiconductor devices. Wiley Encyclopedia of Electrical and Electronics Engineering

Klaassen DBM (1992) A unified mobility model for device simulation -II. Temperature dependence of carrier mobility and lifetime. Solid-State Electron 35(7):961–967CrossRef

Hopcroft MA, Nix WD, Kenny TW (2010) What is the Young’s modulus of silicon? J Microelectromech Syst 19(2):229–238CrossRef

Shanks HR et al (1963) Thermal conductivity of silicon from 300 to 1400 K. Phys Rev 130(5):1743CrossRef

10.

Plummer JD (2009) Silicon VLSI technology: fundamentals, practice, and modeling. Pearson Education India, London

11.

Maleville C et al (1997) Wafer bonding and H-implantation mechanisms involved in the Smart-cut technology. Mater Sci Eng B 46(1):14–19CrossRef

12.

Mark Noworolski J et al (1996) Fabrication of SOI wafers with buried cavities using silicon fusion bonding and electrochemical etch back. Sens Actuat A Phys 54(1):709–713CrossRef

13.

Sparks DR et al (1995) Method of micromachining an integrated sensor on the surface of a silicon wafer .US Patent No. 5, pp 427–975

14.

Mack C (2007) Fundamental principles of optical lithography: the science of microfabrication. Wiley, HobokenCrossRef

15.

Lorenz H, Despont M, Fahrni N, LaBianca N, Renaud P, Vet- tiger P (1997) SU-8: a low-cost negative resist for MEMS. J Micromech Microeng 7(3):121CrossRef

16.

Thong JTL, Choi WK, Chong CW (1997) TMAH etching of silicon and the interaction of etching parameters. Sens Actuat A Phys 63(3):243–249CrossRef

17.

Tanaka H et al (2004) Fast etching of silicon with a smooth surface in high temperature ranges near the boiling point of KOH solution. Sens Actuat A Phys 114(2):516–520CrossRef

18.

Dutta S, Md I, Kumar P, Pal R, Datta P, Chatterjee R (2011) Comparison of etch characteristics of KOH, TMAH and EDP for bulk micromachining of silicon (110). Microsyst Technol 17:1621–1628CrossRef

19.

Nicolas M, Perney B, Baumberg JJ, Zoorob ME, Charlton MDB, Mahnkopf S, Netti CM (2006) Tuning localized plasmons in nanostructured substrates for surface-enhanced Raman scattering. Opt Express 14(2):847857

20.

Klaassen EH et al (1996) Silicon fusion bonding and deep reactive ion etching: a new technology for microstructures. Sens Actuat A Phys 52(1):132–139CrossRef

21.

Manos DM, Flamm DL (eds) (1989) Plasma etching: an introduction. Elsevier, Amsterdam

22.

Jansen H et al (1996) A survey on the reactive ion etching of silicon in microtechnology. J Micromech Microeng 6(1):14CrossRef

23.

Ayazi F, Najafi K (2000) High aspect-ratio combined poly and single-crystal silicon (HARPSS) MEMS technology. J Microelectromech Syst 9(3):288–294CrossRef

24.

Usenko AY (2002) Process for lift-off of a layer from a substrate. US Patent No. 6352909

25.

Yazdi N, Khalil N (2000) An all-silicon single-wafer micro-g accelerometer with a combined surface and bulk micromachining process. J Microelectromech Syst 9(4):544–550CrossRef

26.

Howe RT (1988) Surface micromachining for microsensors and microactuators. J Vac Sci Technol B 6(6):1809–1813CrossRef

27.

Smith HI, Flanders DC (1980) X-ray lithography—a review and assessment of future applications. J Vac Sci Technol 171:533–535CrossRef

28.

Phan H-P et al (2016) Piezoresistive effect in p-type 3C-SiC at high temperatures characterized using Joule heating. Sci Rep 6:28499CrossRef

29.

Neukermans AP et al (1986) Silicon carbide film for X-ray masks and vacuum windows. US Patent No. 4608326

30.

Hruby J (2001) LIGA technologies and applications. MRS Bull 26(4):337–340CrossRef

31.

Tseng AA et al (2003) Electron beam lithography in nanoscale fabrication: recent development. IEEE Trans Electron Packag Manufact 26(2):141–149CrossRef

32.

Tseng AA (2005) Recent developments in nanofabrication using focused ion beams. Small 1(10):924–939CrossRef

33.

Phan H-P et al (2015) Piezoresistive effect of p-type silicon nanowires fabricated by a top-down process using FIB implantation and wet etching. RSC Adv 5(100):82121–82126CrossRef

34.

Tseng AA, Notargiacomo A, Chen TP (2005) Nanofabrication by scanning probe microscope lithography: a review. J Vac Sci Technol B 23(3):877–894CrossRef

35.

McCord MA, Pease RFW (1986) Lithography with the scanning tunneling microscope. J Vac Sci Technol B41:86–88CrossRef

36.

Hu S et al (1998) Fabrication of silicon and metal nanowires and dots using mechanical atomic force lithography. J Vac Sci Technol B 16(5):2822–2824CrossRef

37.

Terris BD, Mamin HJ, Best ME, Logan JA, Rugar D, Rishton SA (1996) Nanoscale replication for scanning probe data storage. Appl Phys Lett 69:4262CrossRef

38.

Eleftheriou E, Antonakopoulos T, Binnig GK, Cherubini G, Despont M, Dholakia A, Durig U et al (2003) Millipede—a MEMS-based scanning-probe datastorage system. IEEE Trans Magn 39(2):938–945CrossRef

39.

Phan H-P et al (2015) The piezoresistive effect of SiC for MEMS sensors at high temperatures: a review. J Microelectromech Syst 24(6):1663–1677CrossRef

40.

Bell DJ et al (2005) MEMS actuators and sensors: observations on their performance and selection for purpose. J Micromech Microeng 15(7):S153CrossRef

41.

Minh-Dung N et al (2013) A sensitive liquid-cantilever diaphragm for pressure sensor. In: 2013 I.E. 26th International Conference on Micro Electro Mechanical Systems (MEMS). IEEE

42.

Minh-Dung N et al (2013) A hydrophone using liquid to bridge the gap of a piezo-resistive cantilever. In: 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers & Eurosensors XXVII). IEEE

43.

Eaton WP, Smith JH (1997) Micromachined pressure sensors: review and recent developments. Smart Mater Struct 6(5):530CrossRef

44.

Laghrouche M, Adane A, Boussey J, Ameur S, Meunier D, Tardu S (2005) A miniature silicon hot wire sensor for automatic wind speed measurements. Renew Energy 30(12):1881–1896CrossRef

45.

Kuo JT, Yu L, Meng E (2012) Micromachined thermal flow sensors—a review. Micromachines 3(3):550–573CrossRef

46.

Dinh T et al (2015) Graphite on paper as material for sensitive thermoresistive sensors. J Mater Chem C 3(34):8776–8779CrossRef

47.

Birner A et al (2001) Silicon-based photonic crystals. Adv Mater 13(6):377388CrossRef

48.

Bui TT, Dao DV et al (2011) Investigation of strain sensing effect in modified single-defect photonic crystal nanocavity. Opt Express 19(9):8821–8829CrossRef

49.

Dao DV et al (2010) Micro/nano-mechanical sensors and actuators based on SOI-MEMS technology. Adv Nat Sci Nanosci Nanotechnol 1(1):013001CrossRef

50.

Huang Q-A, Lee NKS (1999) Analysis and design of polysilicon thermal flexure actuator. J Micromech Microeng 9(1):64CrossRef

51.

Feng XL et al (2007) Very high frequency silicon nanowire electromechanical resonators. Nano Lett 7(7):1953–1959CrossRef

52.

Cleland AN, Roukes ML (1996) Fabrication of high frequency nanometer scale mechanical resonators from bulk Si crystals. Appl Phys Lett 6918:2653–2655CrossRef

Titel: Silicon Micro-/Nanomachining and Applications
verfasst von: Hoang-Phuong Phan
Dzung Viet Dao
Nam-Trung Nguyen
Verlag: Springer International Publishing
Buch: Micro and Nanomanufacturing Volume II
Print ISBN: 978-3-319-67130-7

Electronic ISBN: 978-3-319-67132-1

Copyright-Jahr: 2018
DOI: https://doi.org/10.1007/978-3-319-67132-1_9