Skip to main content
Erschienen in: Journal of Materials Science: Materials in Electronics 11/2020

23.04.2020

Simultaneous improvement of the electrical conductivity and mechanical properties via double-bond introduction in the electrically conductive adhesives

verfasst von: Yu Su, Lei Zhang, Bing Liao, Yu L. Mai, Yong Q. Dai, Wei Hu

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 11/2020

Einloggen

Aktivieren Sie unsere intelligente Suche um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

For electrically conductive adhesives (ECAs), high electrical conductivity generally conflicts with excellent mechanical properties because electrical conductivity increases while desirable mechanical properties decrease with the increase in loading of conductive fillers or removal of lubricants on the silver filler surface. In this work, a method was developed to improve both the electrical conductivity and mechanical properties of the ECAs by introducing double bonds. Itaconic acid (IA) was used to replace the lubricant on the silver flake (Ag-F) surface, and acrylic acid (AA) was used as part of the ECA resin matrix. IA can replace the lubricant on the Ag-F surface, similar to other short-chain dibasic acids, to improve the ECA electrical conductivity. Furthermore, IA can be polymerized with AA to form covalent bonds between the silver flakes and the resin matrix, enhancing the mechanical properties of ECA. Compared with ECA filled with commercial silver flakes, the electrical conductivity of ECA filled with IA-treated silver flakes increased by ~ 21%, and the lap shear strength increased by ~ 29%.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

Literatur
1.
Zurück zum Zitat Y. Li, K.-S. Moon, C.P. Wong, Electronics without lead. Science 308, 1419 (2005)CrossRef Y. Li, K.-S. Moon, C.P. Wong, Electronics without lead. Science 308, 1419 (2005)CrossRef
2.
Zurück zum Zitat M.J. Yim, Y. Li, K.-S. Moon, K.W. Paik, C.P. Wong, Review of recent advances in electrically conductive adhesive materials and technologies in electronic packaging. J. Adhesion. Sci. Technol. 22, 1593 (2008)CrossRef M.J. Yim, Y. Li, K.-S. Moon, K.W. Paik, C.P. Wong, Review of recent advances in electrically conductive adhesive materials and technologies in electronic packaging. J. Adhesion. Sci. Technol. 22, 1593 (2008)CrossRef
3.
Zurück zum Zitat R. Zhang, J. C. Agar, C.P Wong, Recent Advances on Electrically Conductive Adhesives. in Proceedings of the 2010 12th Electronics Packaging Technology Conference, EPTC, 2010, pp. 696–704 R. Zhang, J. C. Agar, C.P Wong, Recent Advances on Electrically Conductive Adhesives. in Proceedings of the 2010 12th Electronics Packaging Technology Conference, EPTC, 2010, pp. 696–704
4.
Zurück zum Zitat I. Mir, D. Kumar, Recent advances in isotropic conductive adhesives for electronics packaging applications. Int. J. Adhes. Adhes. 28(7), 362 (2008)CrossRef I. Mir, D. Kumar, Recent advances in isotropic conductive adhesives for electronics packaging applications. Int. J. Adhes. Adhes. 28(7), 362 (2008)CrossRef
6.
Zurück zum Zitat T.H. Chiang, Y.C. Lin, Y.F. Chen, E.Y. Chen, Effect of anhydride curing agents, imidazoles, and silver particle sizes on the electrical resistivity and thermal conductivity in the silver adhesives of LED devices. J. Appl. Polym. Sci. (2016). https://doi.org/10.1002/app.43587 CrossRef T.H. Chiang, Y.C. Lin, Y.F. Chen, E.Y. Chen, Effect of anhydride curing agents, imidazoles, and silver particle sizes on the electrical resistivity and thermal conductivity in the silver adhesives of LED devices. J. Appl. Polym. Sci. (2016). https://​doi.​org/​10.​1002/​app.​43587 CrossRef
7.
Zurück zum Zitat T. Geipel, M. Meinert, A. Kraft, U. Eitner, Optimization of electrically conductive adhesive bonds in photovoltaic modules. IEEE J. Photovolt. 8(4), 1074 (2018)CrossRef T. Geipel, M. Meinert, A. Kraft, U. Eitner, Optimization of electrically conductive adhesive bonds in photovoltaic modules. IEEE J. Photovolt. 8(4), 1074 (2018)CrossRef
8.
Zurück zum Zitat Y. Guan, X. Chen, F. Li, H. Gao, Study on the curing process and shearing tests of die attachment by Ag–epoxy electrically conductive adhesive. Int. J. Adhes. Adhes. 30, 80 (2010)CrossRef Y. Guan, X. Chen, F. Li, H. Gao, Study on the curing process and shearing tests of die attachment by Ag–epoxy electrically conductive adhesive. Int. J. Adhes. Adhes. 30, 80 (2010)CrossRef
9.
Zurück zum Zitat H.-W. Cui, D.-S. Li, Q. Fan, H.-X. Lai, Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging. Int. J. Adhes. Adhes. 44, 232 (2013)CrossRef H.-W. Cui, D.-S. Li, Q. Fan, H.-X. Lai, Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging. Int. J. Adhes. Adhes. 44, 232 (2013)CrossRef
10.
Zurück zum Zitat R.R. Gomatam, E. Sancaktar, Dynamic fatigue and failure behavior of silver-filled electronically conductive adhesive joints at ambient environmental conditions. J. Adhesion. Sci. Technol. 18(7), 731 (2004)CrossRef R.R. Gomatam, E. Sancaktar, Dynamic fatigue and failure behavior of silver-filled electronically conductive adhesive joints at ambient environmental conditions. J. Adhesion. Sci. Technol. 18(7), 731 (2004)CrossRef
11.
Zurück zum Zitat H.-M. Ren, Y. Guo, S.-Y. Huang, K. Zhang, M.M.F. Yuen, X.-Z. Fu, S. Yu, R. Sun, C.-P. Wong, One-step preparation of silver hexagonal microsheets as electrically conductive adhesive fillers for printed electronics. ACS Appl. Mater. Interfaces 7(24), 13685 (2015)CrossRef H.-M. Ren, Y. Guo, S.-Y. Huang, K. Zhang, M.M.F. Yuen, X.-Z. Fu, S. Yu, R. Sun, C.-P. Wong, One-step preparation of silver hexagonal microsheets as electrically conductive adhesive fillers for printed electronics. ACS Appl. Mater. Interfaces 7(24), 13685 (2015)CrossRef
12.
Zurück zum Zitat Y.-H. Ji, Y. Liu, G.-W. Huang, X.-J. Shen, H.-M. Xiao, S.-Y. Fu, Ternary Ag/epoxy adhesive with excellent overall performance. ACS Appl. Mater. Interfaces 7(15), 8041 (2015)CrossRef Y.-H. Ji, Y. Liu, G.-W. Huang, X.-J. Shen, H.-M. Xiao, S.-Y. Fu, Ternary Ag/epoxy adhesive with excellent overall performance. ACS Appl. Mater. Interfaces 7(15), 8041 (2015)CrossRef
13.
Zurück zum Zitat B.M. Amoli, A. Hu, N.Y. Zhou, B. Zhao, Recent progresses on hybrid micro–nano filler systems for electrically conductive adhesives (ECAs) applications. J. Mater. Sci. 26(7), 4730 (2015) B.M. Amoli, A. Hu, N.Y. Zhou, B. Zhao, Recent progresses on hybrid micro–nano filler systems for electrically conductive adhesives (ECAs) applications. J. Mater. Sci. 26(7), 4730 (2015)
14.
Zurück zum Zitat D. Chen, X. Qiao, X. Qiu, F. Tan, J. Chen, R. Jiang, Effect of silver nanostructures on the resistivity of electrically conductive adhesives composed of silver flakes. J. Mater. Sci. 21, 486 (2010) D. Chen, X. Qiao, X. Qiu, F. Tan, J. Chen, R. Jiang, Effect of silver nanostructures on the resistivity of electrically conductive adhesives composed of silver flakes. J. Mater. Sci. 21, 486 (2010)
15.
Zurück zum Zitat Y.H. Wang, A. Huang, H. Xie, J.Z. Liu, Y.Z. Zhao, J.Z. Li, Isotropical conductive adhesives with very-long silver nanowires as conductive fillers. J. Mater. Sci. 28, 10 (2017) Y.H. Wang, A. Huang, H. Xie, J.Z. Liu, Y.Z. Zhao, J.Z. Li, Isotropical conductive adhesives with very-long silver nanowires as conductive fillers. J. Mater. Sci. 28, 10 (2017)
16.
Zurück zum Zitat D. Lu, Q.K. Tong, C.P. Wong, A study of lubricants on silver flakes for microelectronics conductive adhesives. IEEE Trans. Compon. Pack. Technol. 22(3), 365 (1999)CrossRef D. Lu, Q.K. Tong, C.P. Wong, A study of lubricants on silver flakes for microelectronics conductive adhesives. IEEE Trans. Compon. Pack. Technol. 22(3), 365 (1999)CrossRef
17.
Zurück zum Zitat Y. Li, K.-S. Moon, A. Whitman, C.P. Wong, Enhancement of electrical properties of electrically conductive adhesives (ECAS) by using novel aldehydes. IEEE Trans. Compon. Pack. Technol. 29(4), 758 (2006)CrossRef Y. Li, K.-S. Moon, A. Whitman, C.P. Wong, Enhancement of electrical properties of electrically conductive adhesives (ECAS) by using novel aldehydes. IEEE Trans. Compon. Pack. Technol. 29(4), 758 (2006)CrossRef
18.
Zurück zum Zitat Y. Li, K.-S. Moon, C.P. Wong, Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids. IEEE Trans. Compon. Pack. Technol. 29(1), 173 (2006)CrossRef Y. Li, K.-S. Moon, C.P. Wong, Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids. IEEE Trans. Compon. Pack. Technol. 29(1), 173 (2006)CrossRef
19.
Zurück zum Zitat H.-W. Cui, Q. Fan, D.-S. Li, Surface functionalization of micro silver flakes and their application in electrically conductive adhesives for electronic package. Int. J. Adhes. Adhes. 48, 177 (2014)CrossRef H.-W. Cui, Q. Fan, D.-S. Li, Surface functionalization of micro silver flakes and their application in electrically conductive adhesives for electronic package. Int. J. Adhes. Adhes. 48, 177 (2014)CrossRef
20.
Zurück zum Zitat Y. Li, K.-S. Moon, H. Li, C.P. Wong, Conductivity improvement of isotropic conductive adhesives with short-chain dicarboxylic acids. in Proceedings of the Electronic Components & Technology Conference. IEEE, 2004, pp. 1959–1964. Y. Li, K.-S. Moon, H. Li, C.P. Wong, Conductivity improvement of isotropic conductive adhesives with short-chain dicarboxylic acids. in Proceedings of the Electronic Components & Technology Conference. IEEE, 2004, pp. 1959–1964.
21.
Zurück zum Zitat C. Li, Q. Li, L. Cheng, T. Li, H. Lu, L. Tang, K. Zhang, J. Zhang, Z. Li, Y. Yao, Conductivity enhancement of polymer composites using high-temperature short-time treated silver fillers. Compos. A 100, 64 (2017)CrossRef C. Li, Q. Li, L. Cheng, T. Li, H. Lu, L. Tang, K. Zhang, J. Zhang, Z. Li, Y. Yao, Conductivity enhancement of polymer composites using high-temperature short-time treated silver fillers. Compos. A 100, 64 (2017)CrossRef
22.
Zurück zum Zitat D. Lu, C.P. Wong, Thermal decomposition of silver flake lubricants. J. Therm. Anal. Calorim. 61(1), 3 (2000)CrossRef D. Lu, C.P. Wong, Thermal decomposition of silver flake lubricants. J. Therm. Anal. Calorim. 61(1), 3 (2000)CrossRef
23.
Zurück zum Zitat R. Zhang, W. Lin, K.-S. Moon, C.P. Wong, Fast preparation of printable highly conductive polymer nanocomposites by thermal decomposition of silver carboxylate and sintering of silver nanoparticles. ACS Appl. Mater. Interfaces. 2(9), 2637 (2010)CrossRef R. Zhang, W. Lin, K.-S. Moon, C.P. Wong, Fast preparation of printable highly conductive polymer nanocomposites by thermal decomposition of silver carboxylate and sintering of silver nanoparticles. ACS Appl. Mater. Interfaces. 2(9), 2637 (2010)CrossRef
24.
Zurück zum Zitat C. Yang, Y.-T. Xie, M.-F. Yuen, B. Xu, B. Gao, X. Xiong, C.P. Wong, Silver surface iodination for enhancing the conductivity of conductive composites. Adv. Funct. Mater. 20(16), 2580 (2010)CrossRef C. Yang, Y.-T. Xie, M.-F. Yuen, B. Xu, B. Gao, X. Xiong, C.P. Wong, Silver surface iodination for enhancing the conductivity of conductive composites. Adv. Funct. Mater. 20(16), 2580 (2010)CrossRef
25.
Zurück zum Zitat C. Li, Q. Li, X. Long, T. Li, J. Zhao, K. Zhang, J. Zhang, Z. Li, Y. Yao, In-situ generation of photosensitive silver halide for improving the conductivity of electrically conductive adhesives. ACS Appl. Mater. Interfaces. 9, 29047 (2017)CrossRef C. Li, Q. Li, X. Long, T. Li, J. Zhao, K. Zhang, J. Zhang, Z. Li, Y. Yao, In-situ generation of photosensitive silver halide for improving the conductivity of electrically conductive adhesives. ACS Appl. Mater. Interfaces. 9, 29047 (2017)CrossRef
26.
Zurück zum Zitat C. Wan, H. Wang, B. Du, W. Ling, Y. Fu, H. Liu, Effect of Ag morphology and surface treatment on electrically conductive adhesive. Electron. Process Technol. 32(2), 72 (2011) C. Wan, H. Wang, B. Du, W. Ling, Y. Fu, H. Liu, Effect of Ag morphology and surface treatment on electrically conductive adhesive. Electron. Process Technol. 32(2), 72 (2011)
27.
Zurück zum Zitat G. Xiao, E. Liu, T. Jin, X. Shu, Z. Wang, G. Yuan, X. Yang, Mechanical properties of cured isotropic conductive adhesive (ICA) under hygrothermal aging investigated by micro-indentation. Int. J. Solids. Struct. 122–123, 81 (2017)CrossRef G. Xiao, E. Liu, T. Jin, X. Shu, Z. Wang, G. Yuan, X. Yang, Mechanical properties of cured isotropic conductive adhesive (ICA) under hygrothermal aging investigated by micro-indentation. Int. J. Solids. Struct. 122–123, 81 (2017)CrossRef
28.
Zurück zum Zitat M. Moskovits, J.S. Suh, Conformation of mono- and dicarboxylic acids adsorbed on silver surfaces. J. Am. Chem. Soc. 107, 6826 (1985)CrossRef M. Moskovits, J.S. Suh, Conformation of mono- and dicarboxylic acids adsorbed on silver surfaces. J. Am. Chem. Soc. 107, 6826 (1985)CrossRef
30.
Zurück zum Zitat X. Chen, Z. Zhang, F. Xiao, The interaction mechanism of dicarboxylic acids and electrically conductive adhesives. J. Funct. Mater. 42(5), 947 (2011) X. Chen, Z. Zhang, F. Xiao, The interaction mechanism of dicarboxylic acids and electrically conductive adhesives. J. Funct. Mater. 42(5), 947 (2011)
31.
Zurück zum Zitat L.H. Dubois, B.R. Zegarski, R.G. Nuzzo, Spontaneous Organization of carboxylic acid monolayer films in ultrahigh vacuum. Kinetic constraints to assembly via gas-phase adsorption. Langmuir 2, 412 (1986)CrossRef L.H. Dubois, B.R. Zegarski, R.G. Nuzzo, Spontaneous Organization of carboxylic acid monolayer films in ultrahigh vacuum. Kinetic constraints to assembly via gas-phase adsorption. Langmuir 2, 412 (1986)CrossRef
32.
Zurück zum Zitat M. Wühn, J. Weckesser, Ch Wöll, Bonding and orientational ordering of long-chain carboxylic acids on Cu(111): investigations using X-ray absorption spectroscopy. Langmuir 17, 7605 (2001)CrossRef M. Wühn, J. Weckesser, Ch Wöll, Bonding and orientational ordering of long-chain carboxylic acids on Cu(111): investigations using X-ray absorption spectroscopy. Langmuir 17, 7605 (2001)CrossRef
33.
Zurück zum Zitat C.P. Wong, D. Lu, Q.K. Tong, Lubricants of silver fillers for conductive adhesive applications. Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. in Proceedings of 3rd International Conference on IEEE, 1998. C.P. Wong, D. Lu, Q.K. Tong, Lubricants of silver fillers for conductive adhesive applications. Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. in Proceedings of 3rd International Conference on IEEE, 1998.
34.
Zurück zum Zitat D. Lu, C.P. Wong, Characterization of silver flake lubricants. J. Therm. Anal. Calor. 59(3), 729 (2000)CrossRef D. Lu, C.P. Wong, Characterization of silver flake lubricants. J. Therm. Anal. Calor. 59(3), 729 (2000)CrossRef
35.
Zurück zum Zitat F. Tan, X. Qiao, J. Chen, H. Wang, Effects of coupling agents on the properties of epoxy-based electrically conductive adhesives. Int. J. Adhes. Adhes. 26(6), 406 (2006)CrossRef F. Tan, X. Qiao, J. Chen, H. Wang, Effects of coupling agents on the properties of epoxy-based electrically conductive adhesives. Int. J. Adhes. Adhes. 26(6), 406 (2006)CrossRef
Metadaten
Titel
Simultaneous improvement of the electrical conductivity and mechanical properties via double-bond introduction in the electrically conductive adhesives
verfasst von
Yu Su
Lei Zhang
Bing Liao
Yu L. Mai
Yong Q. Dai
Wei Hu
Publikationsdatum
23.04.2020
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 11/2020
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-020-03427-2

Weitere Artikel der Ausgabe 11/2020

Journal of Materials Science: Materials in Electronics 11/2020 Zur Ausgabe

Neuer Inhalt