Special issue on design, test, integration and packaging of MEMS/MOEMS: DTIP, Cannes, 2014

Excerpt

The Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) was held in Cannes, France, 1–4 April 2014, as a follow up to previous issues held in 1999 and 2000 in Paris, France, in 2001, 2002, 2003 in Mandelieu-La Napoule, France, in 2004 and 2005 in Montreux, Switzerland, and in 2006, 2007 in Stresa, Italy, in 2008 in Nice, France, in 2009 in Rome, Italy, in 2010 in Seville, Spain in 2011 in Aix-en-Provence, France, and in Barcelona, Spain in 2013. This series of Symposia is a forum for scientists and engineers from academia, research institutes and industry to present and discuss the latest results in manufacturing microstructures and design tools to facilitate the conception of these microstructures. The Symposium is traditionally composed of 2 conferences running in parallel: one on CAD, Design and Test, and another one on Microfabrication, Integration and Packaging. In addition, participants of both conferences can attend invited talks, special sessions, and poster presentations for innovative ideas, scientific and technological advancement, new developments and emerging technologies. …