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Zeitschrift

Journal of Electronic Materials

Journal of Electronic Materials 2/2013

Ausgabe 2/2013

Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

Inhaltsverzeichnis ( 17 Artikel )

01.02.2013 | Ausgabe 2/2013

Crystal Plasticity Finite-Element Analysis of Deformation Behavior in Multiple-Grained Lead-Free Solder Joints

P. Darbandi, T.R. Bieler, F. Pourboghrat, Tae-kyu Lee

01.02.2013 | Ausgabe 2/2013

The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance

Tae-Kyu Lee, Bite Zhou, Thomas R. Bieler, Chien-Fu Tseng, Jeng-Gong Duh

01.02.2013 | Ausgabe 2/2013

Mechanisms of Sn Hillock Growth in Vacuum by In Situ Nanoindentation in a Scanning Electron Microscope (SEM)

J.J. Williams, N.C. Chapman, N. Chawla

01.02.2013 | Ausgabe 2/2013

Study of Intermetallic Growth and Kinetics in Fine-Pitch Lead-Free Solder Bumps for Next-Generation Flip-Chip Assemblies

Ye Tian, Justin Chow, Xi Liu, Yi Ping Wu, Suresh K. Sitaraman

01.02.2013 | Ausgabe 2/2013

An X-ray Radiography Study of the Effect of Thermal Cycling on Damage Evolution in Large-Area Sn-3.5Ag Solder Joints

Govindarajan Muralidharan, Kanth Kurumaddali, Andrew K. Kercher, Larry Walker, Scott G. Leslie

01.02.2013 | Ausgabe 2/2013

Effect of Alloying Elements on the Electrification–Fusion Phenomenon in Sn-Based Eutectic Alloys

Gong-An Lan, Truan-Sheng Lui, Li-Hui Chen

01.02.2013 | Ausgabe 2/2013

Influence of Composition on the Morphology of Primary Cu6Sn5 in Sn-4Cu Alloys

Stuart McDonald, Kazuhiro Nogita, Jonathan Read, Tina Ventura, Tetsuro Nishimura

01.02.2013 | Ausgabe 2/2013

Linkages Between Microstructure and Mechanical Properties of Ultrafine Interconnects

Zhiyong Wu, Zhiheng Huang, Hua Xiong, Paul P. Conway, Changqing Liu

01.02.2013 | Ausgabe 2/2013

Micro- and Nanostructure of Zn Whiskers and Their Coating

A. Etienne, E. Cadel, A. Lina, L. Cretinon, P. Pareige

01.02.2013 | Ausgabe 2/2013

Retarding Electromigration in Lead-Free Solder Joints by Alloying and Composite Approaches

Ran Zhao, Limin Ma, Yong Zuo, Sihan Liu, Fu Guo

01.02.2013 | Ausgabe 2/2013 Open Access

Physicochemical Properties of Sn-Zn and SAC + Bi Alloys

Tomasz Gancarz, Janusz Pstruś, Władysław Gąsior, Hani Henein

01.02.2013 | Ausgabe 2/2013

Characterization of Stress–Strain Response of Lead-Free Solder Joints Using a Digital Image Correlation Technique and Finite-Element Modeling

G. Khatibi, M. Lederer, E. Byrne, A. Betzwar Kotas, B. Weiss, H. Ipser

01.02.2013 | Ausgabe 2/2013

Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures

Dekui Mu, Han Huang, Stuart D. McDonald, Kazuhiro Nogita

01.02.2013 | Ausgabe 2/2013

Altering the Mechanical Properties of Sn Films by Alloying with Bi: Mimicking the Effect of Pb to Suppress Whiskers

Nitin Jadhav, Maureen Williams, Fei Pei, Gery Stafford, Eric Chason

01.02.2013 | Ausgabe 2/2013

Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD

Bite Zhou, Thomas R. Bieler, Tae-Kyu Lee, Wenjun Liu

01.02.2013 | Ausgabe 2/2013

Mitigation and Verification Methods for Sn Whisker Growth in Pb-Free Automotive Electronics

Won Sik Hong, Chul Min Oh, Do Seop Kim

01.02.2013 | Ausgabe 2/2013

Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates

Koushik Ramachandran, Fuhan Liu, P. Markondeya Raj, Venky Sundaram, Rao Tummala

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