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Journal of Electronic Materials

Ausgabe 2/2013

Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

Inhalt (17 Artikel)

The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance

Tae-Kyu Lee, Bite Zhou, Thomas R. Bieler, Chien-Fu Tseng, Jeng-Gong Duh

An X-ray Radiography Study of the Effect of Thermal Cycling on Damage Evolution in Large-Area Sn-3.5Ag Solder Joints

Govindarajan Muralidharan, Kanth Kurumaddali, Andrew K. Kercher, Larry Walker, Scott G. Leslie

Influence of Composition on the Morphology of Primary Cu6Sn5 in Sn-4Cu Alloys

Stuart McDonald, Kazuhiro Nogita, Jonathan Read, Tina Ventura, Tetsuro Nishimura

Linkages Between Microstructure and Mechanical Properties of Ultrafine Interconnects

Zhiyong Wu, Zhiheng Huang, Hua Xiong, Paul P. Conway, Changqing Liu

Micro- and Nanostructure of Zn Whiskers and Their Coating

A. Etienne, E. Cadel, A. Lina, L. Cretinon, P. Pareige

Open Access

Physicochemical Properties of Sn-Zn and SAC + Bi Alloys

Tomasz Gancarz, Janusz Pstruś, Władysław Gąsior, Hani Henein

Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures

Dekui Mu, Han Huang, Stuart D. McDonald, Kazuhiro Nogita

Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates

Koushik Ramachandran, Fuhan Liu, P. Markondeya Raj, Venky Sundaram, Rao Tummala

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