Ausgabe 2/2013
Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies
Inhalt (17 Artikel)
Crystal Plasticity Finite-Element Analysis of Deformation Behavior in Multiple-Grained Lead-Free Solder Joints
P. Darbandi, T.R. Bieler, F. Pourboghrat, Tae-kyu Lee
The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance
Tae-Kyu Lee, Bite Zhou, Thomas R. Bieler, Chien-Fu Tseng, Jeng-Gong Duh
Mechanisms of Sn Hillock Growth in Vacuum by In Situ Nanoindentation in a Scanning Electron Microscope (SEM)
J.J. Williams, N.C. Chapman, N. Chawla
Study of Intermetallic Growth and Kinetics in Fine-Pitch Lead-Free Solder Bumps for Next-Generation Flip-Chip Assemblies
Ye Tian, Justin Chow, Xi Liu, Yi Ping Wu, Suresh K. Sitaraman
An X-ray Radiography Study of the Effect of Thermal Cycling on Damage Evolution in Large-Area Sn-3.5Ag Solder Joints
Govindarajan Muralidharan, Kanth Kurumaddali, Andrew K. Kercher, Larry Walker, Scott G. Leslie
Effect of Alloying Elements on the Electrification–Fusion Phenomenon in Sn-Based Eutectic Alloys
Gong-An Lan, Truan-Sheng Lui, Li-Hui Chen
Influence of Composition on the Morphology of Primary Cu6Sn5 in Sn-4Cu Alloys
Stuart McDonald, Kazuhiro Nogita, Jonathan Read, Tina Ventura, Tetsuro Nishimura
Linkages Between Microstructure and Mechanical Properties of Ultrafine Interconnects
Zhiyong Wu, Zhiheng Huang, Hua Xiong, Paul P. Conway, Changqing Liu
Micro- and Nanostructure of Zn Whiskers and Their Coating
A. Etienne, E. Cadel, A. Lina, L. Cretinon, P. Pareige
Retarding Electromigration in Lead-Free Solder Joints by Alloying and Composite Approaches
Ran Zhao, Limin Ma, Yong Zuo, Sihan Liu, Fu Guo
Physicochemical Properties of Sn-Zn and SAC + Bi Alloys
Tomasz Gancarz, Janusz Pstruś, Władysław Gąsior, Hani Henein
Characterization of Stress–Strain Response of Lead-Free Solder Joints Using a Digital Image Correlation Technique and Finite-Element Modeling
G. Khatibi, M. Lederer, E. Byrne, A. Betzwar Kotas, B. Weiss, H. Ipser
Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures
Dekui Mu, Han Huang, Stuart D. McDonald, Kazuhiro Nogita
Altering the Mechanical Properties of Sn Films by Alloying with Bi: Mimicking the Effect of Pb to Suppress Whiskers
Nitin Jadhav, Maureen Williams, Fei Pei, Gery Stafford, Eric Chason
Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD
Bite Zhou, Thomas R. Bieler, Tae-Kyu Lee, Wenjun Liu
Mitigation and Verification Methods for Sn Whisker Growth in Pb-Free Automotive Electronics
Won Sik Hong, Chul Min Oh, Do Seop Kim
Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates
Koushik Ramachandran, Fuhan Liu, P. Markondeya Raj, Venky Sundaram, Rao Tummala