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Zeitschrift

Journal of Electronic Materials

Journal of Electronic Materials 8/2000

Ausgabe 8/2000

Inhaltsverzeichnis ( 11 Artikel )

01.08.2000 | Regular Issue Paper | Ausgabe 8/2000

Research on applying direct plating to additive process for printed circuit board

Yi-Ying Chiang, Yun-Yung Wang, Chi-Chao Wan

01.08.2000 | Regular Issue Paper | Ausgabe 8/2000

The reactions between electroless Ni-Cu-P Deposit and 63Sn-37Pb flip chip solder bumps during reflow

Chun-Jen Chen, Kwang-Lung Lin

01.08.2000 | Regular Issue Paper | Ausgabe 8/2000

Developing a lead-free solder alloy Sn-Bi-Ag-Cu by mechanical alloying

C. M. L. Wu, M. L. Huang, J. K. L. Lai, Y. C. Chan

01.08.2000 | Regular Issue Paper | Ausgabe 8/2000

Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging

M. L. Huang, C. M. L. Wu, J. K. L. Lai, Y. C. Chan

01.08.2000 | Regular Issue Paper | Ausgabe 8/2000

Effect of NO annealing conditions on electrical characteristics of n-type 4H-SiC MOS capacitors

H. -F. Li, S. Dimitrijev, D. Sweatman, H. B. Harrison

01.08.2000 | Regular Issue Paper | Ausgabe 8/2000

Luminescent chemically-etched porous poly-crystalline silicon on insulating substrates

T. J. Pease, S. N. Ekkanath-Madathil, S. C. Bayliss

01.08.2000 | Regular Issue Paper | Ausgabe 8/2000

The microstructure of ultrafine eutectic Au-Sn solder joints on Cu

H. G. Song, J. W. Morris Jr., M. T. McCormack

01.08.2000 | Regular Issue Paper | Ausgabe 8/2000

Interfacial reactions between liquid indium and silver substrates

Y. M. Liu, Y. L. Chen, T. H. Chuang

01.08.2000 | Regular Issue Paper | Ausgabe 8/2000

Sol-gel processed silica/titania/ÿ-Glycidoxypropyltrimethoxysilane composite materials for photonic applications

Wenxiu Que, Y. Zhou, Y. L. Lam, Y. C. Chan, H. T. Tan, T. H. Tan, C. H. Kam

01.08.2000 | Letter | Ausgabe 8/2000

Visible light-emitting diodes grown on optimized ∇x[InxGa1−x]P/GaP epitaxial transparent substrates with controlled dislocation density

Andrew Y. Kim, Michael E. Groenert, Eugene A. Fitzgerald

01.08.2000 | Letter | Ausgabe 8/2000

Segregation of phosphorus and germanium to grain boundaries in chemical vapor deposited silicon-germanium films determined by scanning transmission electron microscopy

W. Qin, D. G. Ast, T. I. Kamins

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