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Zeitschrift

Journal of Materials Science: Materials in Electronics

Journal of Materials Science: Materials in Electronics 11/2006

Ausgabe 11/2006

Inhaltsverzeichnis ( 14 Artikel )

01.11.2006 | Ausgabe 11/2006

The preparation and characterization of quadrate NiFe2O4/polyaniline nanocomposites

Hu Zhong-ai, Zhao Hong-xiao, Kong Chao, Yang Yu-ying, Shang Xiu-li, Ren Li-jun, Wang Yan-peng

01.11.2006 | Ausgabe 11/2006

Fabrication and characterization of Zr and Co co-doped LiMn2O4 nanowires using sol–gel–AAO template process

Xiaohong Liu, Jinqing Wang, Junyan Zhang, Shengrong Yang

01.11.2006 | Ausgabe 11/2006

Dielectric properties of doped polystyrene and polymethylmethacrylate

Tomasz Podgrabinski, Vaclav Švorčík, Anna Macková, Vladimir Hnatowicz, Petr Sajdl

01.11.2006 | Ausgabe 11/2006

Low-temperature-sintering and characterization of glass-ceramic composites

Guo-hua Chen, Xin-yu Liu

01.11.2006 | Ausgabe 11/2006

Effect of segregative additives on the positive temperature coefficient in resistance characteristics of n-BaTiO3 ceramics

S. Jayanthi, T. R. N. Kutty

01.11.2006 | Ausgabe 11/2006

Microstructural and dielectric properties of donor doped (La3+) CaCu3Ti4O12 ceramics

B. Shri Prakash, K. B. R. Varma

01.11.2006 | Ausgabe 11/2006

Electrical properties of BaTiO3-based NTC thermistors doped by BaBiO3 and La2O3

Ying Luo, Xinyu Liu, Xvqiong Li

01.11.2006 | Ausgabe 11/2006

Electrodeposition of Cu from acidic sulphate solutions in the presence of polyethylene glycol and chloride ions

B. Bozzini, L. D’Urzo, C. Mele, V. Romanello

01.11.2006 | Ausgabe 11/2006

Fatigue behavior of SrBi2(Ta, Nb)2O9 ferroelectric thin films fabricated by pulsed laser deposition

Pingxiong Yang

01.11.2006 | Ausgabe 11/2006

The influence of substrate bias in I-PVD process on the properties of Ti and Al alloy films

Wenjie Zhang, Leeward Yi, Kai Tao, Yue Ma, Pingyi Chang, Jin Wu

01.11.2006 | Ausgabe 11/2006

Characteristics of annealed ZnO:Cu nanoparticles prepared by spray pyrolysis

Mustafa Öztas

01.11.2006 | Ausgabe 11/2006

Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density

B. Y. Wu, H. W. Zhong, Y. C. Chan, M. O. Alam

01.11.2006 | Ausgabe 11/2006

Microstructure development and electrical properties of RuO2-based lead-free thick film resistors

M. G. Busana, M. Prudenziati, J. Hormadaly

01.11.2006 | Ausgabe 11/2006

Structural, microstructural and dielectric studies of tin-doped barium niobate perovskite

Girija Chitgopikar, Mallikarjun Chickpatil, Ravindra L. Raibagkar

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