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Microsystem Technologies

Ausgabe 3/2016

Special issue on design, test, integration and packaging of MEMS/MOEMS: DTIP, Cannes, 2014

Inhalt (27 Artikel)

Technical Paper

A dual-axis MEMS capacitive inertial sensor with high-density proof mass

Daisuke Yamane, Takaaki Matsushima, Toshifumi Konishi, Hiroshi Toshiyoshi, Kazuya Masu, Katsuyuki Machida

Technical Paper

Capacitive flexible pressure sensor: microfabrication process and experimental characterization

T. H. N. Dinh, E. Martincic, E. Dufour-Gergam, P.-Y. Joubert

Technical Paper

Reliability characterization of a soot particle sensor in terms of stress- and electromigration in thin-film platinum

Radoslav Rusanov, Holger Rank, Tino Fuchs, Roland Mueller-Fiedler, Oliver Kraft

Technical Paper

Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress

A. Lucibello, G. Capoccia, E. Proietti, R. Marcelli, B. Margesin, V. Mulloni, F. Giacomozzi, F. Vitulli, M. Scipioni, G. Bartolucci

Technical Paper

Simulation and characterization of dynamic contact in a MEMS passive vibration threshold sensor

Zhuoqing Yang, Wenguo Chen, Guifu Ding, Yan Wang, Hong Wang, Xiaolin Zhao

Technical Paper

Simulation of a high-power LED lamp for the evaluation and design of heat dissipation mechanisms

De-Shau Huang, Yi-Sheng Liao, Heng-Jen Kuo, Fang-Jui Kuo, Ming-Tzer Lin

Technical Paper

Design, optimization and simulation of a low-voltage shunt capacitive RF-MEMS switch

Li-Ya Ma, Anis Nurashikin Nordin, Norhayati Soin

Technical Paper

Robust design optimization of electro-thermal microactuator using probabilistic methods

B. Khayatzadeh Safaie, M. Shamshirsaz, M. Bahrami

Technical Paper

Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation

John Brueckner, Alfons Dehé, Ellen Auerswald, Rainer Dudek, Dietmar Vogel, Bernd Michel, Sven Rzepka

Technical Paper

Development of thin film based flexible current clamp sensor using screen-printed coil

Takahiro Yamashita, Yi Zhang, Toshihiro Itoh, Ryutaro Maeda

Technical Paper

Fabrication, simulations, and measurements of self-assembled millimeter-wave antennas for system-on-chip applications

Sae-Won Lee, Ying Chen, Diane Titz, Fabien Ferrero, Cyril Luxey, Rodney G. Vaughan, Meenakshinathan Parameswaran

Technical Paper

Characterization of capacitive micromachined ultrasonic transducers

Fayçal Bellared, Joseph Lardiès, Gilles Bourbon, Patrice Le Moal, Vincent Walter, Marc Berthillier

Technical Paper

Microwave atomic force microscope: MG63 osteoblast-like cells analysis on nanometer scale

Lan Zhang, Yuanhui Song, Atsushi Hosoi, Yasuyuki Morita, Yang Ju

Technical Paper

Fabrication and micromechanical characterization of polycrystalline diamond microcantilevers

Maira Possas, Lionel Rousseau, Farbod Ghassemi, Gaelle Lissorgues, Emmanuel Scorsone, Philippe Bergonzo

Technical Paper

Bulk metallic glass mold for high volume fabrication of micro optics

Peng He, Likai Li, Fei Wang, Olaf Dambon, Fritz Klocke, Katharine M. Flores, Allen Y. Yi

Technical Paper

Screen-pad printing for electrode patterning on curvy surfaces

Ken-ichi Nomura, Yasuyuki Kusaka, Hirobumi Ushijima, Kazuro Nagase, Hiroaki Ikedo

Technical Paper

Human breast cancer cell enrichment by Dean flow driven microfluidic channels

M. Zuvin, N. Mansur, S. Z. Birol, L. Trabzon, A. Sayı Yazgan

Technical Paper

Modeling and test result of closed-loop MEMS accelerometer with wide dynamic range

Feng Zhang, Xiangliang Jin, Longsheng Wang

Technical Paper

Capacitive solvent sensing with interdigitated microelectrodes

Ismail Bilican, Mustafa Tahsin Guler, Neset Gulener, Mustafa Yuksel, Sedat Agan

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