Ausgabe 6-7/2003
Inhalt (23 Artikel)
Micro-hinges changed flexural rigidity intermittently for micromechanism joints
M. Horie, S. Torii, D. Kamiya
Development of a freestanding copper antiscatter grid using deep X-ray lithography
O. V. Makarova, C.-M. Tang, D. C. Mancini, N. Moldovan, R. Divan, D. G. Ryding, R. H. Lee
Local heat transfer characteristics in a single rotating disk and co-rotating disks
H. H. Cho, C. H. Won, G. Y. Ryu, D. H. Rhee
Fast prototyping of high-aspect ratio, high-resolution X-ray masks by gas-assisted focused ion beam
C. Khan Malek, F. T. Hartley, J. Neogi
High speed sub-micron bit detection using tapered aperture mounted optical slider flying above a patterned metal medium
T. Ohkubo, K. Tanaka, T. Hirota, K. Itao, K. Kato, S. Ichihara, M. Ohmi, H. Maeda, T. Niwa, Y. Mitsuoka, K. Nakajima
Micro assembly injection moulding for the generation of hybrid microstructures
W. Michaeli, C. Ziegmann
Design and development of a piezoresistive pressure sensor on micromachined silicon for high-temperature applications and of a signal-conditioning electronic circuit
D. Crescini, V. Ferrari, Z. K. Vajna, D. Marioli, A. Taroni, A. Borgese, M. Marinelli, E. Milani, A. Paoletti, A. Tucciarone, G. Verona-Rinati
Ultra thin chips for miniaturized products
E. Jung, A. Ostmann, D. Wojakowski, C. Landesberger, R. Aschenbrenner, H. Reichl
Design of flexural pivot for use in hard disc drive actuator
Z. He, H. Qian, D. Wu, W. Wang, X. Liu, J. C. Liu
A surface micromachining process for suspended RF-MEMS applications using porous silicon
Y. Ding, Z. Liu, L. Liu, Z. Li
Micromachining of highly reproducible step substrates for high Tc step junction dc-SQUIDs
J. Wang, B. Han, G. Chen, Q. Yang, T. Cui
Vibro-acoustic interaction of components in hard disk drive under seek process
F. Gao, Y. Yan, F.F. Yap
Ultraviolet embossing for patterning high aspect ratio polymeric microstructures
M. B. Chan-Park, W. K. Neo
Injection molding of 316L stainless steel microstructures
Z. Y. Liu, N. H. Loh, S. B. Tor, Y. Murakoshi, R. Maeda, K. A. Khor, T. Shimidzu