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Zeitschrift

Microsystem Technologies

Microsystem Technologies 7/2010

Ausgabe 7/2010

Special Issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2009

Inhaltsverzeichnis ( 32 Artikel )

01.07.2010 | Editorial | Ausgabe 7/2010

Microsystem technologies: foreword to special issue on design, test, integration and packaging of MEMS/MOEMS, 2009

Bernard Courtois, Bernd Michel

01.07.2010 | Technical Paper | Ausgabe 7/2010

Design issues of BAW employment in 3D integrated sensor nodes

Josef Prainsack, Markus Dielacher, Martin Flatscher, Thomas Herndl, Rainer Matischek, Joern Stolle, Werner Weber

01.07.2010 | Technical Paper | Ausgabe 7/2010

Through-silicon via technologies for interconnects in RF MEMS

Jian Zhu, Yuanwei Yu, Fang Hou, Chen Chen

01.07.2010 | Technical Paper | Ausgabe 7/2010

3D System-on-Chip technologies for More than Moore systems

Peter Ramm, Armin Klumpp, Josef Weber, Maaike M. V. Taklo

01.07.2010 | Technical Paper | Ausgabe 7/2010

Mechanical modelling of capacitive RF MEMS shunt switches

Romolo Marcelli, Andrea Lucibello, Giorgio De Angelis, Emanuela Proietti, Daniele Comastri

01.07.2010 | Technical Paper | Ausgabe 7/2010

Optimal design analysis of electrothermally driven microactuators

Seyed Majid Karbasi, Mahnaz Shamshirsaz, Mahyar Naraghi, Mohammad Maroufi

01.07.2010 | Technical Paper | Ausgabe 7/2010

Modeling of an electrostatic torsional micromirror for laser projection system

Eleonora Marchetti, Emilio Volpi, Francesco Battini, Luca Bacciarelli, Luca Fanucci, Ulrich Hofmann

01.07.2010 | Technical Paper | Ausgabe 7/2010

Effect of dimensional and material property uncertainties on thermal flexure microactuator response using probabilistic methods

Babak Khayatzadeh Safaie, Mahnaz Shamshirsaz, Mohsen Bahrami

01.07.2010 | Technical Paper | Ausgabe 7/2010

Effects of channel surface finish on blood flow in microfluidic devices

S. Prentner, D. M. Allen, L. Larcombe, S. Marson, K. Jenkins, M. Saumer

01.07.2010 | Technical Paper | Ausgabe 7/2010

Hydrodynamic separation of cells utilizing insulator-based dielectrophoresis

Chun-Ping Jen, Ching-Te Huang, Hsin-Yuan Shih

01.07.2010 | Technical Paper | Ausgabe 7/2010

Fabrication of internally driven micro centrifugal force pumps based on synchronous micro motors

Andreas Waldschik, Stephanus Büttgenbach

01.07.2010 | Technical Paper | Ausgabe 7/2010

Reliability of RF MEMS switches due to charging effects and their circuital modelling

Romolo Marcelli, Giancarlo Bartolucci, George Papaioannu, Giorgio De Angelis, Andrea Lucibello, Emanuela Proietti, Benno Margesin, Flavio Giacomozzi, François Deborgies

01.07.2010 | Technical Paper | Ausgabe 7/2010

Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries

Krystan Marquardt, Robert Hahn, Martin Blechert, Marco Lehmann, Michael Töpper, Martin Wilke, Peter Semionyk, Maria von Suchodoletz, Herbert Reichl

01.07.2010 | Technical Paper | Ausgabe 7/2010

Optical micro-paddle beam deflection measurement for electrostatic mechanical testing of nano-scale thin film application to MEMS

Chi-Jia Tong, Ya-Chi Cheng, Ming-Tzer Lin, Kuan-Jung Chung, Jiong-Shiun Hsu, Chung-Lin Wu

01.07.2010 | Technical Paper | Ausgabe 7/2010

Design of CWDM multiplexers based on series coupled ring resonators: analysis, potential and prospects on MEMS fabrication technologies

Maurine Malak, Ahmed Hisham Morshed, Khaled Hassan, Tarik Bourouina, Hanan Anis, Diaa Khalil

01.07.2010 | Technical Paper | Ausgabe 7/2010

Experimental study of heat sink performance using copper foams fabricated by electroforming

Reiyu Chein, Hsiharng Yang, Tsung-Hsun Tsai, Chijay Lu

01.07.2010 | Technical Paper | Ausgabe 7/2010

Fabrication methods based on wet etching process for the realization of silicon MEMS structures with new shapes

Prem Pal, Kazuo Sato

01.07.2010 | Technical Paper | Ausgabe 7/2010

A novel CMOS process compatible high performance parallel-stacked RF spiral inductor

D. K. Jair, Ming Chun Hsieh, C. S. Lin

01.07.2010 | Technical Paper | Ausgabe 7/2010

Corona discharge assisted thermal bonding of polymer microfluidic devices

Sum Huan Ng, Yexian Wu, Zhenfeng Wang, Zhiping Wang

01.07.2010 | Technical Paper | Ausgabe 7/2010

Novel design of a RF-MEMS tuneable capacitor based on electrostatically induced torsion

Parisa Ture Savadkoohi, Sabrina Colpo, Benno Margesin

01.07.2010 | Technical Paper | Ausgabe 7/2010

Integration of stamper fabrication and design optimization of LCD Light guides using silicon-based microfeatures

Jyh-Cheng Yu, Pei-Kai Hsu

01.07.2010 | Technical Paper | Ausgabe 7/2010

Hot punching on an 8 inch substrate as an alternative technology to produce holes on a large scale

Bastian E. Rapp, Marc Schneider, Matthias Worgull

01.07.2010 | Technical Paper | Ausgabe 7/2010

Novel U-shape gold nanoparticles-modified optical fiber for localized plasmon resonance chemical sensing

Chien-Hsing Chen, Tzu-Chien Tsao, Wan-Yun Li, Wei-Chih Shen, Chung-Wei Cheng, Jaw-Luen Tang, Chun-Ping Jen, Lai-Kwan Chau, Wei-Te Wu

01.07.2010 | Technical Paper | Ausgabe 7/2010

New fabrication method for micro-pyramidal vertical probe array for probe cards

Tsung-Hung Lin, Hsiharng Yang, Ching-Kong Chao, Mau-Shiun Yeh

01.07.2010 | Technical Paper | Ausgabe 7/2010

Microthermoforming of nanostructured polymer films: a new bonding method for the integration of nanostructures in 3-dimensional cavities

Markus Heilig, Stefan Giselbrecht, Andreas Guber, Matthias Worgull

01.07.2010 | Technical Paper | Ausgabe 7/2010

Properties of M-AFM probe affected by nanostructural metal coatings

A. Hosoi, M. Hamada, A. Fujimoto, Y. Ju

01.07.2010 | Technical Paper | Ausgabe 7/2010

Use of a PDMS spring element for ink jet printing applications

S. Bargir, David M. Allen

01.07.2010 | Technical Paper | Ausgabe 7/2010

Temperature dependent fracture toughness of glass frit bonding layers

Kerstin Nötzold, Christian Dresbach, Jürgen Graf, Bianca Böttge

01.07.2010 | Technical Paper | Ausgabe 7/2010

Identification of mechanical defects in MEMS using dynamic measurements for application in production monitoring

Ronny Gerbach, Matthias Ebert, Geert Brokmann, Thomas Hein, Joerg Bagdahn

01.07.2010 | Technical Paper | Ausgabe 7/2010

MEMS cantilever sensor for non-destructive metrology within high-aspect-ratio micro holes

Erwin Peiner, Lutz Doering

01.07.2010 | Technical Paper | Ausgabe 7/2010

A microvalve for hybrid microfluidic systems

G. Simone, G. Perozziello, G. Sardella, I. Disegna, S. Tori, N. Manaresi, G. Medoro

01.07.2010 | Technical Paper | Ausgabe 7/2010

MEMS packaging process by film transfer using an anti-adhesive layer

Sebastien Brault, O. Garel, G. Schelcher, N. Isac, F. Parrain, A. Bosseboeuf, F. Verjus, M. Desgeorges, E. Dufour-Gergam

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