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2011 | OriginalPaper | Buchkapitel

18. Structure Impaired Mechanical Stability of Ultra-thin Chips

verfasst von : Tu Hoang, Stefan Endler, Christine Harendt

Erschienen in: Ultra-thin Chip Technology and Applications

Verlag: Springer New York

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Abstract

Flexibility of ultra-thin chips is an important condition for applications in flexible electronics. Especially, mechanical reliability of ultra-thin chips is a key factor generally determining the final performance and reliability of a flexible electronics product. Structures and designs implemented on the chips are the elements that weaken the mechanical stability of the final product. In this chapter the excellent mechanical strength of 20-μm thin silicon chips produced by the ChipfilmTM technology is discussed. The influences of different parameters, such as the number of anchors per chip edge, the backside porous silicon and the topography formed by CMOS integration, on their mechanical reliability are investigated by means of uniaxial bending tests. The experimental results are statistically evaluated by the Weibull theory, in which the resulting failure stress data are used to obtain the fracture strength and estimate failure origins of the tested ultra-thin chips.

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Literatur
1.
Zurück zum Zitat Zimmermann M, Burghartz JN, Appel W, Remmers N, Burwick C, Würz R, Tobail O, Schubert M, Palfinger G, Werner J (2006) A seamless ultra-thin chip fabrication and assembly process. IEDM Tech Dig 2006:1010–1012 Zimmermann M, Burghartz JN, Appel W, Remmers N, Burwick C, Würz R, Tobail O, Schubert M, Palfinger G, Werner J (2006) A seamless ultra-thin chip fabrication and assembly process. IEDM Tech Dig 2006:1010–1012
2.
Zurück zum Zitat Burghartz JN, Appel W, Rempp HD, Zimmermann M (2009) A new fabrication and assembly process for ultrathin chips. IEEE Trans Electron Devices 56(2):321–327CrossRef Burghartz JN, Appel W, Rempp HD, Zimmermann M (2009) A new fabrication and assembly process for ultrathin chips. IEEE Trans Electron Devices 56(2):321–327CrossRef
3.
Zurück zum Zitat Burghartz JN, Harendt C, Hoang T, Kiss A, Zimmermann M (2008) Ultra-thin chip fabrication for next-generation silicon processes. In: Proceedings of the IEEE BCTM, Capri, Italy, pp 131–137 Burghartz JN, Harendt C, Hoang T, Kiss A, Zimmermann M (2008) Ultra-thin chip fabrication for next-generation silicon processes. In: Proceedings of the IEEE BCTM, Capri, Italy, pp 131–137
4.
Zurück zum Zitat Landesberger C, Klink G, Schwinn G, Aschenbrenner R (2001) New dicing and thinning concept improves mechanical reliability of ultra-thin silicon. In: Proceedings of the International Symposium on Advanced Packaging Materials, Braselton, GA, pp 92–97 Landesberger C, Klink G, Schwinn G, Aschenbrenner R (2001) New dicing and thinning concept improves mechanical reliability of ultra-thin silicon. In: Proceedings of the International Symposium on Advanced Packaging Materials, Braselton, GA, pp 92–97
5.
Zurück zum Zitat Global Assembly and Packaging Committee (2003) Test method for measurement of chip (die) strength by mean of 3-point-bending. SEMI Standard G86-0303, Japan Global Assembly and Packaging Committee (2003) Test method for measurement of chip (die) strength by mean of 3-point-bending. SEMI Standard G86-0303, Japan
6.
Zurück zum Zitat ASTM International (2008) Standard test method for flexural strength of advanced ceramics at ambient temperature. ASTM Standard C1161–02c, West Conshohocken, PA ASTM International (2008) Standard test method for flexural strength of advanced ceramics at ambient temperature. ASTM Standard C1161–02c, West Conshohocken, PA
7.
Zurück zum Zitat ASTM International (2007) Standard practice for reporting uniaxial strength data and estimating Weibull distribution parameters for advanced ceramics. ASTM Standard C1239-07, West Conshohocken, PA ASTM International (2007) Standard practice for reporting uniaxial strength data and estimating Weibull distribution parameters for advanced ceramics. ASTM Standard C1239-07, West Conshohocken, PA
8.
Zurück zum Zitat Schoenfelder S, Ebert M, Landesberger C, Bock K, Bagdahn J (2007) Investigations of the influence of dicing techniques on the strength properties of thin silicon. Microelectron Reliab 47:168–178CrossRef Schoenfelder S, Ebert M, Landesberger C, Bock K, Bagdahn J (2007) Investigations of the influence of dicing techniques on the strength properties of thin silicon. Microelectron Reliab 47:168–178CrossRef
9.
Zurück zum Zitat Kiss AV (2009) Mechanische Eigenschaften von Duennschichtsilizium. Diploma thesis, University of Stuttgart, Germany Kiss AV (2009) Mechanische Eigenschaften von Duennschichtsilizium. Diploma thesis, University of Stuttgart, Germany
10.
Metadaten
Titel
Structure Impaired Mechanical Stability of Ultra-thin Chips
verfasst von
Tu Hoang
Stefan Endler
Christine Harendt
Copyright-Jahr
2011
Verlag
Springer New York
DOI
https://doi.org/10.1007/978-1-4419-7276-7_18

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