Study and Performance Analysis of Carbon Nanotubes (CNTs) as a Global VLSI Interconnects

This research works are primarily focused on the modeling approach of Carbon Nanotubes (CNTs). Based on the number of conducting channels and different number of shells and their arrangements in bundles an Equivalent Single Conductor (ESC) transmission line model proposed to analyze the effect of power dissipation and propagation delay. Driver Interconnect Load (DIL) system is used to analyze the power dissipation and propagation delay performances. A SPICE simulation is used to compare the performance of bundle Multiwall Carbon Nanotubes (MWCNTs) as compare to conventional bundle Single Wall Carbon Nanotubes (SWCNTs) interconnect. After the performance analysis it is observed that power dissipation and propagation delay increase with the length of interconnects, but the power dissipation and propagation delay decreases for bundle of MWCNT as compare to the conventional bundle SWCNT.