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Erschienen in: Journal of Materials Science: Materials in Electronics 12/2019

08.05.2019

Study of γ-ray radiation influence on SiO2/HfO2/Al2O3/HfO2/Al2O3 memory capacitor by C–V and DLTS

verfasst von: Shu-rui Cao, Xiao-yu Ke, Si-ting Ming, Duo-wei Wang, Tong Li, Bing-yan Liu, Yao Ma, Yun Li, Zhi-mei Yang, Min Gong, Ming-min Huang, Jin-shun Bi, Yan-nan Xu, Kai Xi, Gao-bo Xu, Sandip Majumdar

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 12/2019

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Abstract

Gamma-ray radiation effects on the SiO2/HfO2/Al2O3/HfO2/Al2O3 based charge trapping memory have been investigated. Capacitance–voltage (C–V) and deep level transient spectroscopy (DLTS) measurements were applied to study the change in electrical properties from total dose radiation. C–V results showed a negative shift of flat-band voltage while dc memory window degraded after gamma-ray radiation. For DLTS result, two original peaks were found degraded while two new peaks appeared after radiation. Both C–V and DLTS results show that Gamma ray leads to the degradation of trapping effect.

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Literatur
1.
Zurück zum Zitat M.H. White, D.A. Adams, J.R. Murray et al, Characterization of scaled SONOS EEPROM memory devices for space and military systems, non-volatile memory Technology Symposium IEEE, 51 (2004) M.H. White, D.A. Adams, J.R. Murray et al, Characterization of scaled SONOS EEPROM memory devices for space and military systems, non-volatile memory Technology Symposium IEEE, 51 (2004)
2.
Zurück zum Zitat S. Gerardin, A. Paccagnella, Present and future non-volatile memories for space. IEEE Trans. Nucl. Sci. 57, 3016 (2010) S. Gerardin, A. Paccagnella, Present and future non-volatile memories for space. IEEE Trans. Nucl. Sci. 57, 3016 (2010)
3.
Zurück zum Zitat K.-H. Wu, H.-C. Chien, C.-C. Chan et al., SONOS device with tapered bandgap nitride layer. IEEE Trans. Electron Devices 52, 987 (2005)CrossRef K.-H. Wu, H.-C. Chien, C.-C. Chan et al., SONOS device with tapered bandgap nitride layer. IEEE Trans. Electron Devices 52, 987 (2005)CrossRef
4.
Zurück zum Zitat Y.K. Lee, K.W. Song, J.W. Hyun et al., Twin SONOS memory with 30-nm storage nodes under a merged gate fabricated with inverted sidewall and damascene process. IEEE Electron Device Lett. 25, 317 (2004)CrossRef Y.K. Lee, K.W. Song, J.W. Hyun et al., Twin SONOS memory with 30-nm storage nodes under a merged gate fabricated with inverted sidewall and damascene process. IEEE Electron Device Lett. 25, 317 (2004)CrossRef
5.
Zurück zum Zitat K. Honda, S. Hashimoto, Y. Cho, Visualization using scanning nonlinear dielectric microscopy of electrons and holes localized in the thin gate film of a metal–SiO2–Si3N4–SiO2–semiconductor flash memory. Appl. Phys. Lett. 86, 543 (2005) K. Honda, S. Hashimoto, Y. Cho, Visualization using scanning nonlinear dielectric microscopy of electrons and holes localized in the thin gate film of a metal–SiO2–Si3N4–SiO2–semiconductor flash memory. Appl. Phys. Lett. 86, 543 (2005)
6.
Zurück zum Zitat J.G. Yun, Y. Young Kim, I.L. Han Park et al., Fabrication and characterization of fin SONOS flash memory with separated double-gate structure. Solid-State Electron. 52, 1498 (2008)CrossRef J.G. Yun, Y. Young Kim, I.L. Han Park et al., Fabrication and characterization of fin SONOS flash memory with separated double-gate structure. Solid-State Electron. 52, 1498 (2008)CrossRef
7.
Zurück zum Zitat C.H. Lee, S.H. Hur, Y.C. Shin et al., Charge-trapping device structure of SiO2∕SiN∕high-k dielectric Al2O3 for high-density flash memory. Appl. Phys. Lett. 86, 152908 (2005)CrossRef C.H. Lee, S.H. Hur, Y.C. Shin et al., Charge-trapping device structure of SiO2∕SiN∕high-k dielectric Al2O3 for high-density flash memory. Appl. Phys. Lett. 86, 152908 (2005)CrossRef
8.
Zurück zum Zitat Y.J. Seo, K. Kim, H.D. Kim et al., Correlation between charge trap distribution and memory characteristics in metal/oxide/nitride/oxide/silicon devices with two different blocking oxides. Appl. Phys. Lett. 93, 155 (2008) Y.J. Seo, K. Kim, H.D. Kim et al., Correlation between charge trap distribution and memory characteristics in metal/oxide/nitride/oxide/silicon devices with two different blocking oxides. Appl. Phys. Lett. 93, 155 (2008)
9.
Zurück zum Zitat J.L. Gavartin, D. Munoz Ramo, A.L. Shluger et al., Negative oxygen vacancies in HfO2 as charge traps in high-k stacks. Appl. Phys. Lett. 89, 082908 (2006)CrossRef J.L. Gavartin, D. Munoz Ramo, A.L. Shluger et al., Negative oxygen vacancies in HfO2 as charge traps in high-k stacks. Appl. Phys. Lett. 89, 082908 (2006)CrossRef
10.
Zurück zum Zitat S. Bassi, M. Pattanaik, TID effects on retention of 0.13 μm SONOS memory cell: a device simulation approach, International Symposium on Vlsi Design and Test, 1 (2014) S. Bassi, M. Pattanaik, TID effects on retention of 0.13 μm SONOS memory cell: a device simulation approach, International Symposium on Vlsi Design and Test, 1 (2014)
11.
Zurück zum Zitat F. Qiao, X. Yu, L. Pan et al, TID characterization of 0.13 µm SONOS cell in 4 Mb NOR flash memory, Physical and Failure Analysis of Integrated Circuits IEEE 96, 1 (2012) F. Qiao, X. Yu, L. Pan et al, TID characterization of 0.13 µm SONOS cell in 4 Mb NOR flash memory, Physical and Failure Analysis of Integrated Circuits IEEE 96, 1 (2012)
12.
Zurück zum Zitat M. Li, J.-S. Bi, Y.-N. Xu et al., Total ionizing dose effects of 55-nm silicon-oxide-nitride-oxide-silicon charge trapping memory in pulse and DC modes. Chin. Phys. Lett. 7, 078502 (2018)CrossRef M. Li, J.-S. Bi, Y.-N. Xu et al., Total ionizing dose effects of 55-nm silicon-oxide-nitride-oxide-silicon charge trapping memory in pulse and DC modes. Chin. Phys. Lett. 7, 078502 (2018)CrossRef
13.
Zurück zum Zitat H. You, W. Cho, Charge trapping properties of the HfO2 layer with various thicknesses for charge trap flash memory, applications. Appl. Phys. Lett. 96, 093506 (2010)CrossRef H. You, W. Cho, Charge trapping properties of the HfO2 layer with various thicknesses for charge trap flash memory, applications. Appl. Phys. Lett. 96, 093506 (2010)CrossRef
14.
Zurück zum Zitat X.D. Huang, R.P. Shi, P.T. Lai, Charge-trapping characteristics of fluorinated thin ZrO2 film for nonvolatile memory applications. Appl. Phys. Lett. 104, 162905 (2014)CrossRef X.D. Huang, R.P. Shi, P.T. Lai, Charge-trapping characteristics of fluorinated thin ZrO2 film for nonvolatile memory applications. Appl. Phys. Lett. 104, 162905 (2014)CrossRef
15.
Zurück zum Zitat P.H. Tsai, K.S. Changliao, C.Y. Liu et al., Novel SONOS-type nonvolatile memory device with optimal Al Doping in HfAlO charge-trapping layer. IEEE Electron Device Lett. 29, 265 (2008)CrossRef P.H. Tsai, K.S. Changliao, C.Y. Liu et al., Novel SONOS-type nonvolatile memory device with optimal Al Doping in HfAlO charge-trapping layer. IEEE Electron Device Lett. 29, 265 (2008)CrossRef
16.
Zurück zum Zitat N. Elatab, A. Rizk, A.K. Okyay et al., Zinc-oxide charge trapping memory cell with ultra-thin chromium-oxide trapping layer. AIP Adv. 3, 112116 (2013)CrossRef N. Elatab, A. Rizk, A.K. Okyay et al., Zinc-oxide charge trapping memory cell with ultra-thin chromium-oxide trapping layer. AIP Adv. 3, 112116 (2013)CrossRef
19.
Zurück zum Zitat T.M. Pan, J.W. Chen, Metal-oxide-high-k-oxide-silicon memory structure using an Yb2O3 charge trapping layer. Appl. Phys. Lett. 93, 2048 (2008) T.M. Pan, J.W. Chen, Metal-oxide-high-k-oxide-silicon memory structure using an Yb2O3 charge trapping layer. Appl. Phys. Lett. 93, 2048 (2008)
20.
Zurück zum Zitat X.D. Huang, J.K.O. Sin, P.T. Lai, Fluorinated SrTiO3 as charge-trapping layer for nonvolatile memory applications. IEEE Trans. Electron Devices 58, 4235 (2011)CrossRef X.D. Huang, J.K.O. Sin, P.T. Lai, Fluorinated SrTiO3 as charge-trapping layer for nonvolatile memory applications. IEEE Trans. Electron Devices 58, 4235 (2011)CrossRef
21.
Zurück zum Zitat J.A. Felix, D.M. Fleetwood, R.D. Schrimpf et al., Total-dose radiation response of hafnium-silicate capacitors. IEEE Trans. Nucl. Sci. 49, 3191 (2002)CrossRef J.A. Felix, D.M. Fleetwood, R.D. Schrimpf et al., Total-dose radiation response of hafnium-silicate capacitors. IEEE Trans. Nucl. Sci. 49, 3191 (2002)CrossRef
22.
Zurück zum Zitat C. Demic, E.P. Gusev, R.D. Schrimpf et al., Radiation-induced charge trapping in thin Al2O3/SiOxNy/Si(100) gate dielectric stacks. IEEE Trans. Nucl. Sci. 50, 1910 (2003)CrossRef C. Demic, E.P. Gusev, R.D. Schrimpf et al., Radiation-induced charge trapping in thin Al2O3/SiOxNy/Si(100) gate dielectric stacks. IEEE Trans. Nucl. Sci. 50, 1910 (2003)CrossRef
23.
Zurück zum Zitat J.S. Bi, Y.N. Xu, G.B. Xu et al., Total ionization dose effects on charge-trapping memory with Al2O3/HfO2/Al2O3 trilayer structure. IEEE Trans. Nucl. Sci. 65, 200 (2018)CrossRef J.S. Bi, Y.N. Xu, G.B. Xu et al., Total ionization dose effects on charge-trapping memory with Al2O3/HfO2/Al2O3 trilayer structure. IEEE Trans. Nucl. Sci. 65, 200 (2018)CrossRef
24.
Zurück zum Zitat D.V. Lang, Fast capacitance transient appartus: application to ZnO and O centers in GaP p-n junctions. J. Appl. Phys. 45, 3014 (1974)CrossRef D.V. Lang, Fast capacitance transient appartus: application to ZnO and O centers in GaP p-n junctions. J. Appl. Phys. 45, 3014 (1974)CrossRef
25.
Zurück zum Zitat A. Colder, M. Levalois, P. Marie, Study of electron, proton, and swift heavy ion irradiation of n-type germanium using deep level transient spectroscopy. J. Appl. Phys. 88, 3082 (2000)CrossRef A. Colder, M. Levalois, P. Marie, Study of electron, proton, and swift heavy ion irradiation of n-type germanium using deep level transient spectroscopy. J. Appl. Phys. 88, 3082 (2000)CrossRef
26.
Zurück zum Zitat Y. Li, Y. Ma, W. Lin et al., Study of γ-ray irradiation influence on TiN/HfO2/Si MOS capacitor by C-V and DLTS. Superlattices Microstruct. 120, 313 (2018)CrossRef Y. Li, Y. Ma, W. Lin et al., Study of γ-ray irradiation influence on TiN/HfO2/Si MOS capacitor by C-V and DLTS. Superlattices Microstruct. 120, 313 (2018)CrossRef
27.
Zurück zum Zitat C. Nyamhere, A.G.M. Das, F.D. Auret, Deep level transient spectroscopy characterization of defects introduced in p-Si by electron beam deposition and proton irradiation. J. Phys: Conf. Ser. 100, 042004 (2008) C. Nyamhere, A.G.M. Das, F.D. Auret, Deep level transient spectroscopy characterization of defects introduced in p-Si by electron beam deposition and proton irradiation. J. Phys: Conf. Ser. 100, 042004 (2008)
28.
Zurück zum Zitat P.N.K. Deenapanray, F.D. Auret, Deep level transient spectroscopy of defects introduced in Si and SiGe by low energy particles. J. Phys. Condens. Matter 15, S2859 (2003)CrossRef P.N.K. Deenapanray, F.D. Auret, Deep level transient spectroscopy of defects introduced in Si and SiGe by low energy particles. J. Phys. Condens. Matter 15, S2859 (2003)CrossRef
29.
Zurück zum Zitat M. González, C.L. Andre, R.J. Walters et al., Deep level defects in proton radiated GaAs grown on metamorphic Si Ge/Si. J. Appl. Phys. 100, 1055 (2006) M. González, C.L. Andre, R.J. Walters et al., Deep level defects in proton radiated GaAs grown on metamorphic Si Ge/Si. J. Appl. Phys. 100, 1055 (2006)
30.
Zurück zum Zitat C. Zhu, Z. Huo, Z. Xu et al., Performance enhancement of multilevel cell nonvolatile memory by using a bandgap engineered high-κ trapping layer. Appl. Phys. Lett. 97, 25 (2010) C. Zhu, Z. Huo, Z. Xu et al., Performance enhancement of multilevel cell nonvolatile memory by using a bandgap engineered high-κ trapping layer. Appl. Phys. Lett. 97, 25 (2010)
31.
Zurück zum Zitat K. Yamasaki, M. Yoshida, T. Sugano, Deep level transient spectroscopy of bulk traps and interface states in Si MOS diodes. Jpn. J. Appl. Phys. 18, 113 (1979)CrossRef K. Yamasaki, M. Yoshida, T. Sugano, Deep level transient spectroscopy of bulk traps and interface states in Si MOS diodes. Jpn. J. Appl. Phys. 18, 113 (1979)CrossRef
32.
Zurück zum Zitat Y.J. Seo, K.C. Kim, T.G. Kim et al., Analysis of electronic memory traps in the oxide-nitride-oxide structure of a polysilicon-oxide-nitride-oxide-semiconductor flash memory. Appl. Phys. Lett. 92, 4 (2008) Y.J. Seo, K.C. Kim, T.G. Kim et al., Analysis of electronic memory traps in the oxide-nitride-oxide structure of a polysilicon-oxide-nitride-oxide-semiconductor flash memory. Appl. Phys. Lett. 92, 4 (2008)
33.
Zurück zum Zitat E. Yilmaz, I. Dogan, R. Turan, Use of Al2O3 layer as a dielectric in MOS based radiation sensors fabricated on a Si substrate. Nucl. Instrum. Methods Phys. Res. B 266, 4896 (2008)CrossRef E. Yilmaz, I. Dogan, R. Turan, Use of Al2O3 layer as a dielectric in MOS based radiation sensors fabricated on a Si substrate. Nucl. Instrum. Methods Phys. Res. B 266, 4896 (2008)CrossRef
34.
Zurück zum Zitat A.V.P. Coelho, M.C. Adam, H. Boudinov, Distinguishing bulk traps and interface states in deep-level transient spectroscopy. J. Phys. D 44, 305303 (2011)CrossRef A.V.P. Coelho, M.C. Adam, H. Boudinov, Distinguishing bulk traps and interface states in deep-level transient spectroscopy. J. Phys. D 44, 305303 (2011)CrossRef
35.
Zurück zum Zitat X. Li, C. Liu, J. Yang, Y. Zhao, G. Liu, Separation of ionization traps in NPN transistors irradiated by lower energy electrons. IEEE Trans. Nucl. Sci. 60, 3924 (2013)CrossRef X. Li, C. Liu, J. Yang, Y. Zhao, G. Liu, Separation of ionization traps in NPN transistors irradiated by lower energy electrons. IEEE Trans. Nucl. Sci. 60, 3924 (2013)CrossRef
36.
Zurück zum Zitat Y.-N. Xu, J.-S. Bi, G.-B. Xu et al., Total ionization dose effects on charge storage capability of Al2O3/HfO2/Al2O3-based charge trapping memory cell. Chin. Phys. Lett. 35, 118501 (2018)CrossRef Y.-N. Xu, J.-S. Bi, G.-B. Xu et al., Total ionization dose effects on charge storage capability of Al2O3/HfO2/Al2O3-based charge trapping memory cell. Chin. Phys. Lett. 35, 118501 (2018)CrossRef
37.
Zurück zum Zitat A.S. Grove, Physics and Technology of Semiconductor Devices (Wiley, New York, 1900) A.S. Grove, Physics and Technology of Semiconductor Devices (Wiley, New York, 1900)
38.
Zurück zum Zitat D. Spassov et al., A comparative study of charge trapping in HfO2/Al2O3 and ZrO2/Al2O3 based multilayered metal/high-k/oxide/Si structures. Thin Solid Films 614, 7 (2016)CrossRef D. Spassov et al., A comparative study of charge trapping in HfO2/Al2O3 and ZrO2/Al2O3 based multilayered metal/high-k/oxide/Si structures. Thin Solid Films 614, 7 (2016)CrossRef
39.
Zurück zum Zitat L. Yang, Electrical characterization of deep trap properties in high-k thin-film HfO2. Chin. Phys. Lett. 27, 218 (2010) L. Yang, Electrical characterization of deep trap properties in high-k thin-film HfO2. Chin. Phys. Lett. 27, 218 (2010)
Metadaten
Titel
Study of γ-ray radiation influence on SiO2/HfO2/Al2O3/HfO2/Al2O3 memory capacitor by C–V and DLTS
verfasst von
Shu-rui Cao
Xiao-yu Ke
Si-ting Ming
Duo-wei Wang
Tong Li
Bing-yan Liu
Yao Ma
Yun Li
Zhi-mei Yang
Min Gong
Ming-min Huang
Jin-shun Bi
Yan-nan Xu
Kai Xi
Gao-bo Xu
Sandip Majumdar
Publikationsdatum
08.05.2019
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 12/2019
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-019-01450-6

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