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Erschienen in:
01.06.2011
The microstructure and properties of the Sn-xBi-0.9Zn-0.3Ag lead-free solders
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 6/2011
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Abstract
Low Ag content, Sn-Bi-Zn-Ag lead-free solders, have been studied. The microstructures of the Sn-xBi-0.9Zn-0.3Ag (x = 0, 1 and 3, in weight percent, hereafter) specimens are composed of β-Sn phase, AgZn3 intermetallic compounds (IMCs) and Zn-rich phase. Bi precipitates appear when the Bi content amounts to 3 wt%. The Sn-Bi-Zn-Ag alloys exhibit high performance on tensile properties, microhardness and melting temperature, owing to the existence of Bi precipitates. Moreover, the reactions upon heating and cooling of the investigated Sn-Bi-Zn-Ag lead-free solders are also systematically studied.