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2018 | OriginalPaper | Buchkapitel

6. Thermal Transport in Micro- and Nanoscale Systems

verfasst von : Tanmoy Maitra, Shigang Zhang, Manish K. Tiwari

Erschienen in: Handbook of Thermal Science and Engineering

Verlag: Springer International Publishing

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Abstract

Small-scale (micro-/nanoscale) heat transfer has broad and exciting range of applications. Heat transfer at small scale quite naturally is influenced – sometimes dramatically – with high surface area-to-volume ratios. This in effect means that heat transfer in small-scale devices and systems is influenced by surface treatment and surface morphology. Importantly, interfacial dynamic effects are at least non-negligible, and there is a strong potential to engineer the performance of such devices using the progress in micro- and nanomanufacturing technologies. With this motivation, the emphasis here is on heat conduction and convection. The chapter starts with a broad introduction to Boltzmann transport equation which captures the physics of small-scale heat transport, while also outlining the differences between small-scale transport and classical macroscale heat transport. Among applications, examples are thermoelectric and thermal interface materials where micro- and nanofabrication have led to impressive figure of merits and thermal management performance. Basic of phonon transport and its manipulation through nanostructuring materials are discussed in detail.

Small-scale single-phase convection and the crucial role it has played in developing the thermal management solutions for the next generation of electronics and energy-harvesting devices are discussed as the next topic. Features of microcooling platforms and physics of optimized thermal transport using microchannel manifold heat sinks are discussed in detail along with a discussion of how such systems also facilitate use of low-grade, waste heat from data centers and photovoltaic modules.

Phase change process and their control using surface micro-/nanostructure are discussed next. Among the feature considered, the first are microscale heat pipes where capillary effects play an important role. Next the role of nanostructures in controlling nucleation and mobility of the discrete phase in two-phase processes, such as boiling, condensation, and icing is explained in great detail. Special emphasis is placed on the limitations of current surface and device manufacture technologies while also outlining the potential ways to overcome them. Lastly, the chapter is concluded with a summary and perspective on future trends and, more importantly, the opportunities for new research and applications in this exciting field.

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Vorheriges Kapitel Design of Thermal Systems

Nächstes Kapitel Constructal Theory in Heat Transfer

Alfieri F, Tiwari MK, Zinovik I et al (2010) 3D integrated water cooling of a composite multilayer stack of chips. J Heat Transf 132:121402. https://doi.org/10.1115/1.4002287CrossRef

Asheghi M, Kurabayashi K, Kasnavi R, Goodson KE (2002) Thermal conduction in doped single-crystal silicon films. J Appl Phys 91:5079–5088. https://doi.org/10.1063/1.1458057CrossRef

Attinger D, Frankiewicz C, Betz AR et al (2014) Surface engineering for phase change heat transfer: a review. MRS Energy Sustain 1:E4. https://doi.org/10.1557/mre.2014.9CrossRef

Balandin AA (2011) Thermal properties of graphene and nanostructured carbon materials. Nat Publ Gr. https://doi.org/10.1038/NMAT3064

Balandin AA, Nika DL (2012) Phononics in low-dimensional materials. Mater Today 15:266–275. https://doi.org/10.1016/S1369-7021(12)70117-7CrossRef

Balasubramanian G, Puri IK, Böhm MC, Leroy F (2011) Thermal conductivity reduction through isotope substitution in nanomaterials: predictions from an analytical classical model and nonequilibrium molecular dynamics simulations. Nanoscale 3:3714. https://doi.org/10.1039/c1nr10421gCrossRef

Beek WJ, Muttzall KMK, Heuven Van JW (1975) Transport phenomena, 2nd edn. John Wiley, London, New York, Sydney, Toronto, p 342

Beér JM (2007) High efficiency electric power generation: the environmental role. Prog Energy Combust Sci 33:107–134. https://doi.org/10.1016/j.pecs.2006.08.002MathSciNetCrossRef

Bergman TL, Lavine AS, Incropera FP, DeWitt DP (2006) Fundamentals of heat and mass transfer, 6th edn. Wiley, New York

Betz AR, Jenkins J, Kim CJ, Attinger D (2013) Boiling heat transfer on superhydrophilic, superhydrophobic, and superbiphilic surfaces. Int J Heat Mass Transf 57:733–741. https://doi.org/10.1016/j.ijheatmasstransfer.2012.10.080CrossRef

Birch F (1952) Elasticity and constitution of the earth’s interior. J Geophys Res 57:227–286CrossRef

Bird RB, Stewart WE, Lightfoot EN (1966) Transport phenomena. Wiley, New York

Bissessur R, Kanatzidis MG, Schindler JL et al (1993) Encapsulation of polymers into MoS2 and metal to insulator transition in metastable MoS2. J Chem Soc Chem Commun 4:1582. https://doi.org/10.1039/c39930001582CrossRef

Boreyko JB, Zhao Y, Chen C-H (2011) Planar jumping-drop thermal diodes. Appl Phys Lett 99:234105. https://doi.org/10.1063/1.3666818CrossRef

Cahill DG, Ford WK, Goodson KE et al (2003) Nanoscale thermal transport. J Appl Phys 93:793–818. https://doi.org/10.1063/1.1524305CrossRef

Carbajal G, Sobhan CB, Peterson GP et al (2006) Thermal response of a flat heat pipe sandwich structure to a localized heat flux. Int J Heat Mass Transf 49:4070–4081. https://doi.org/10.1016/j.ijheatmasstransfer.2006.03.035CrossRefMATH

Casimir HBG (1938) Note on the conduction of heat in crystals. Physica 5:495–500. https://doi.org/10.1016/S0031-8914(38)80162-2CrossRef

Chang FL, Hung YM (2017) Dielectric liquid pumping flow in optimally operated micro heat pipes. Int J Heat Mass Transf 108:257–270. https://doi.org/10.1016/j.ijheatmasstransfer.2016.12.018CrossRef

Chang H-C, Yeo LY (2010) Electrokinetically-driven microfluidics and nanofluidics. Cambridge University Press, New York

Chatterjee A, Derby MM, Peles Y, Jensen MK (2013) Condensation heat transfer on patterned surfaces. Int J Heat Mass Transf 66:889–897. https://doi.org/10.1016/j.ijheatmasstransfer.2013.07.077CrossRef

Chatterjee A, Derby MM, Peles Y, Jensen MK (2014) Enhancement of condensation heat transfer with patterned surfaces. Int J Heat Mass Transf 71:675–681. https://doi.org/10.1016/j.ijheatmasstransfer.2013.12.069CrossRef

Chen G (2005) Nanoscale energy transport and conversion. Oxford University Press, Boston

Chen C-H, Cai Q, Tsai C et al (2007) Dropwise condensation on superhydrophobic surfaces with two-tier roughness. Appl Phys Lett 90:173108. https://doi.org/10.1063/1.2731434CrossRef

Chen R, Lu M-C, Srinivasan V et al (2009) Nanowires for enhanced boiling heat transfer. Nano Lett 9:548–553. https://doi.org/10.1021/nl8026857CrossRef

Chen X, Ye H, Fan X et al (2016) A review of small heat pipes for electronics. Appl Therm Eng 96:1–17. https://doi.org/10.1016/j.applthermaleng.2015.11.048CrossRef

Chen D, Gelenter MD, Hong M et al (2017) Icephobic surfaces induced by interfacial nonfrozen water. ACS Appl Mater Interfaces 9:4202–4214. https://doi.org/10.1021/acsami.6b13773CrossRef

Cheng P, Wu H-Y, Hong F-J (2007) Phase-change heat transfer in microsystems. J Heat Transf 129:101. https://doi.org/10.1115/1.2410008CrossRef

Choi ES, Brooks JS, Eaton DL et al (2003) Enhancement of thermal and electrical properties of carbon nanotube polymer composites by magnetic field processing. J Appl Phys 94:6034–6039. https://doi.org/10.1063/1.1616638CrossRef

Collier J (1972) Convective boiling and condensation. McGraw-Hill, New York

Collier JG, Thome JR (1994) Convective boiling and condensation, 3rd edn. Oxford University Press, Oxford

Cotter TP (1984) Principles and prospects for micro heat pipes. In: 5th international heat pipe conference, Tsukuba

Dai X, Huang X, Yang F et al (2013) Enhanced nucleate boiling on horizontal hydrophobic-hydrophilic carbon nanotube coatings. Appl Phys Lett 102:161605. https://doi.org/10.1063/1.4802804CrossRef

Daniel S, Chaudhury M, Chen J (2001) Fast drop movements resulting from the phase change on a gradient surface. Sci 291:633–636CrossRef

Dhir VK, Abarajith HS, Warrier GR (2005) From nano to micro to macro scales in boiling. In: Microscale heat transfer fundamentals and applications. Springer, Berlin/Heidelberg, pp 197–216CrossRef

DiSalvo F (1999) Thermoelectric cooling and power generation. Sci 285:703–706CrossRef

Dismukes JP, Ekstrom L, Steigmeier EF et al (1964) Thermal and electrical properties of heavily doped Ge-Si alloys up to 1300°K. J Appl Phys 35:2899–2907. https://doi.org/10.1063/1.1713126CrossRef

Donadio D, Galli G (2009) Atomistic simulations of heat transport in silicon nanowires. Phys Rev Lett 102:195901. https://doi.org/10.1103/PhysRevLett.102.195901CrossRef

Dresselhaus MS, Chen G, Tang MY et al (2007) New directions for low-dimensional thermoelectric materials. Adv Mater 19:1043–1053. https://doi.org/10.1002/adma.200600527CrossRef

Eberle P, Tiwari MK, Maitra T, Poulikakos D (2014) Rational nanostructuring of surfaces for extraordinary icephobicity. Nanoscale 6:4874–4881. https://doi.org/10.1039/C3NR06644DCrossRef

Engemann S, Reichert H, Dosch H et al (2004) Interfacial melting of ice in contact with SiO 2. Phys Rev Lett 92:205701. https://doi.org/10.1103/PhysRevLett.92.205701CrossRef

Escher W, Brunschwiler T, Michel B, Poulikakos D (2010a) Experimental investigation of an ultrathin manifold microchannel heat sink for liquid-cooled chips. J Heat Transf 132:81402. https://doi.org/10.1115/1.4001306CrossRef

Escher W, Ghannam R, Khalil A et al (2010b) Advanced liquid cooling for concentrated photovoltaic electro-thermal co-generation. In: 2010 3rd international conference on thermal issues in emerging technologies theory and applications. IEEE, pp 9–17

Fan X, Zeng G, LaBounty C et al (2001) SiGeC/Si superlattice microcoolers. Appl Phys Lett 78:1580–1582. https://doi.org/10.1063/1.1356455CrossRef

Fevre EJL, Rose J (1966) A theory of heat transfer by dropwise condensation. In: International heat transfer conference 3, Vol 8. Condensation – international heat transfer conference digital library

Fletcher NH (1958) Size effect in heterogeneous nucleation. J Chem Phys 29:572–576. https://doi.org/10.1063/1.1744540CrossRef

Forrest E, Williamson E, Buongiorno J et al (2010) Augmentation of nucleate boiling heat transfer and critical heat flux using nanoparticle thin-film coatings. Int J Heat Mass Transf 53:58–67. https://doi.org/10.1016/j.ijheatmasstransfer.2009.10.008CrossRef

Gebhart B (2017) Effects of viscous dissipation in natural convection. https://doi.org/10.1017/S0022112062001196

Han C, Sun Q, Li Z, Dou SX (2016) Thermoelectric enhancement of different kinds of metal chalcogenides. Adv Energy Mater 6:1600498. https://doi.org/10.1002/aenm.201600498CrossRef

Hannan MA, Mutashar S, Samad SA, Hussain A (2014) Energy harvesting for the implantable biomedical devices: issues and challenges 13:1–23. https://doi.org/10.1186/1475-925X-13-79

Harman TC, Spears DL, Walsh MP (1999) PbTe/Te superlattice structures with enhanced thermoelectric figures of merit. J Electron Mater 28:L1–L5. https://doi.org/10.1007/s11664-999-0198-4CrossRef

Hassan I, Phutthavong P, Abdelgawad M (2004) Microchannel heat sinks: an overview of the state-of-the-art. Microscale Thermophys Eng 8:183–205. https://doi.org/10.1080/10893950490477338CrossRef

Hetsroni G, Mosyak A, Pogrebnyak E, Segal Z (2005) Explosive boiling of water in parallel micro-channels. Int J Multiphase Flow 31:371–392. https://doi.org/10.1016/j.ijmultiphaseflow.2005.01.003CrossRefMATH

Hicks LD, Dresselhaus MS (1993) Effect of quantum-well structures on the thermoelectric figure of merit. Phys Rev B 47:12727–12731. https://doi.org/10.1103/PhysRevB.47.12727CrossRef

Hicks LD, Harman TC, Dresselhaus MS (1993) Use of quantum-well superlattices to obtain a high figure of merit from nonconventional thermoelectric materials. Appl Phys Lett 63:3230–3232. https://doi.org/10.1063/1.110207CrossRef

Hochbaum AI, Chen R, Delgado RD et al (2008) Enhanced thermoelectric performance of rough silicon nanowires. Nature 451:163–167. https://doi.org/10.1038/nature06381CrossRef

Howells MR, Beetz T, Chapman HN et al (2005) An assessment of the resolution limitation due to radiation-damage in x-ray diffraction microscopy. https://doi.org/10.1016/j.elspec.2008.10.008

Hsu C-C, Chen P-H (2012) Surface wettability effects on critical heat flux of boiling heat transfer using nanoparticle coatings. Int J Heat Mass Transf 55:3713–3719. https://doi.org/10.1016/j.ijheatmasstransfer.2012.03.003CrossRef

Hu Y, Shi H, Song H et al (2013) Effects of a proton scavenger on the thermoelectric performance of free-standing polythiophene and its derivative films. Synth Met 181:23–26. https://doi.org/10.1016/j.synthmet.2013.08.006CrossRef

Huang Z, Fang H, Zhu J (2007) Fabrication of silicon nanowire arrays with controlled diameter, length, and density. Adv Mater 19:744–748. https://doi.org/10.1002/adma.200600892CrossRef

Izumi M, Kumagai S, Shimada R, Yamakawa N (2004) Heat transfer enhancement of dropwise condensation on a vertical surface with round shaped grooves. Exp Thermal Fluid Sci 28:243–248. https://doi.org/10.1016/S0894-1777(03)00046-3CrossRef

Jones TB (1973) Electrohydrodynamic heat pipes. Int J Heat Mass Transf 16:1045–1048. https://doi.org/10.1016/0017-9310(73)90043-4CrossRef

Jung S, Tiwari MK, Doan NV, Poulikakos D (2012a) Mechanism of supercooled droplet freezing on surfaces. Nat Commun 3:615. https://doi.org/10.1038/ncomms1630CrossRef

Jung S, Tiwari MK, Poulikakos D (2012b) Frost halos from supercooled water droplets. Proc Natl Acad Sci U S A 109:16073–16078. https://doi.org/10.1073/pnas.1206121109CrossRef

Kandlikar SG (2010) Scale effects on flow boiling heat transfer in microchannels: a fundamental perspective. Int J Therm Sci 49:1073–1085. https://doi.org/10.1016/j.ijthermalsci.2009.12.016CrossRef

Kandlikar SG, Bapat AV (2017) Evaluation of jet impingement. Spray Microchannel Chip Cooling Options High Heat Flux Removal. https://doi.org/10.1080/01457630701421703

Kaneko H, Ishiguro T, Takahashi A, Tsukamoto J (1993) Magnetoresistance and thermoelectric power studies of metal-nonmetal transition in iodine-doped polyacetylene. Synth Met 57:4900–4905. https://doi.org/10.1016/0379-6779(93)90836-LCrossRef

Kasten P, Zimmermann S, Tiwari MK et al (2010) Hot water cooled heat sinks for efficient data center cooling: towards electronic cooling with high exergetic utility. Front Heat Mass Transf. https://doi.org/10.5098/hmt.v1.2.3006

Kemp NT, Kaiser AB, Liu C-J et al (1999) Thermoelectric power and conductivity of different types of polypyrrole. J Polym Sci Part B Polym Phys 37:953–960. https://doi.org/10.1002/(SICI)1099-0488(19990501)37:9<953::AID-POLB7>3.0.CO;2-LCrossRef

Khonsue O (2012) Experimental on the liquid cooling system with thermoelectric for personal computer. Heat Mass Transf 48:1767–1771. https://doi.org/10.1007/s00231-012-1022-xCrossRef

Kim D, Kim Y, Choi K et al (2010a) Improved thermoelectric behavior of nanotube-filled polymer composites with poly(3,4-ethylenedioxythiophene) poly(styrenesulfonate). ACS Nano 4:513–523. https://doi.org/10.1021/nn9013577CrossRef

Kim H, Kim I, Choi H, Kim W (2010b) Thermal conductivities of Si1−xGex nanowires with different germanium concentrations and diameters. Appl Phys Lett 96:233106. https://doi.org/10.1063/1.3443707CrossRef

Kim G-H, Shao L, Zhang K, Pipe KP (2013) Engineered doping of organic semiconductors for enhanced thermoelectric efficiency. Nat Mater 12:719–723. https://doi.org/10.1038/nmat3635CrossRef

Koo J-M, Im S, Jiang L, Goodson KE (2005) Integrated microchannel cooling for three-dimensional electronic circuit architectures. J Heat Transf 127:49. https://doi.org/10.1115/1.1839582CrossRef

Kraus AD, Aziz A, Welty J (2001a) Linear transformations. Extended surface heat transfer. John Wiley, New York, pp 220–243

Kraus AD, Aziz A, Welty J (2001b) Convection with simplified constrains. Extended surface heat transfer. John Wiley, New York, pp 1–58

Kreder MJ, Alvarenga J, Kim P et al (2016) Design of anti-icing surfaces: smooth, textured or slippery? Nat Rev Mater 1:15003. https://doi.org/10.1038/natrevmats.2015.3CrossRef

Kulinich SA, Farhadi S, Nose K, Du XW (2011) Superhydrophobic surfaces: are they really ice-repellent? Langmuir 27:25–29. https://doi.org/10.1021/la104277qCrossRef

Lan Y, Minnich AJ, Chen G, Ren Z (2010) Enhancement of thermoelectric figure-of-merit by a bulk nanostructuring approach. Adv Funct Mater 20:357–376. https://doi.org/10.1002/adfm.200901512CrossRef

Le Fevre EJ, Rose JW (1965) An experimental study of heat transfer by dropwise condensation. Int J Heat Mass Transf 8:1117–1133. https://doi.org/10.1016/0017-9310(65)90139-0CrossRef

Lee J, Mudawar I (2005) Two-phase flow in high-heat-flux micro-channel heat sink for refrigeration cooling applications: Part II—heat transfer characteristics. Int J Heat Mass Transf 48:941–955. https://doi.org/10.1016/j.ijheatmasstransfer.2004.09.019CrossRef

Lee EK, Yin L, Lee Y et al (2012) Large thermoelectric figure-of-merits from SiGe nanowires by simultaneously measuring electrical and thermal transport properties. Nano Lett 12:2918–2923. https://doi.org/10.1021/nl300587uCrossRef

Li C, Peterson GP (2007) Parametric study of pool boiling on horizontal highly conductive microporous coated surfaces. J Heat Transf 129:1465. https://doi.org/10.1115/1.2759969CrossRef

Li D, Wu Y, Kim P et al (2003) Thermal conductivity of individual silicon nanowires. Appl Phys Lett 83:2934–2936. https://doi.org/10.1063/1.1616981CrossRef

Lim J, Hippalgaonkar K, Andrews SC et al (2012) Quantifying surface roughness effects on phonon transport in silicon nanowires. Nano Lett 12:2475–2482. https://doi.org/10.1021/nl3005868CrossRef

Lin Y-M, Dresselhaus MS (2003) Thermoelectric properties of superlattice nanowires. Phys Rev B 68:75304. https://doi.org/10.1103/PhysRevB.68.075304CrossRef

Lin W, Xiu Y, Jiang H et al (2008) Self-assembled monolayer-assisted chemical transfer of in situ functionalized carbon nanotubes. J Am Chem Soc 130:9636–9637. https://doi.org/10.1021/ja802142gCrossRef

Lin W, Zhang R, Moon K-S, Wong CP (2010) Molecular phonon couplers at carbon nanotube/substrate interface to enhance interfacial thermal transport. Carbon N Y 48:107–113. https://doi.org/10.1016/j.carbon.2009.08.033CrossRef

Liu X, Chen Y (2013) Transient thermal performance analysis of micro heat pipes. Appl Therm Eng 58:585–593. https://doi.org/10.1016/j.applthermaleng.2013.04.025CrossRef

Lu M-C, Chen R, Srinivasan V et al (2011) Critical heat flux of pool boiling on Si nanowire array-coated surfaces. Int J Heat Mass Transf 54:5359–5367. https://doi.org/10.1016/j.ijheatmasstransfer.2011.08.007CrossRef

Luckyanova M, Garg J, Esfarjani K et al (2012) Coherent phonon heat conduction in superlattices. Sci 338:936–939CrossRef

Ma X, Rose JW, Xu D et al (2000) Advances in dropwise condensation heat transfer: Chinese research. Chem Eng J 78:87–93CrossRef

Macner AM, Daniel S, Steen PH (2014) Condensation on surface energy gradient shifts drop size distribution toward small drops. Langmuir 30:1788–1798. https://doi.org/10.1021/la404057gCrossRef

Maitra T, Antonini C, Tiwari MK et al (2014) Supercooled water drops impacting superhydrophobic textures. Langmuir 30:10855–10861. https://doi.org/10.1021/la502675aCrossRef

Maitra T, Jung S, Giger ME et al (2015) Superhydrophobicity vs. ice adhesion: the quandary of robust icephobic surface design. Adv Mater Interfaces 2:1500330. https://doi.org/10.1002/admi.201500330CrossRef

Marconnet AM, Yamamoto N, Panzer MA et al (2011) Thermal conduction in aligned carbon nanotube–polymer nanocomposites with high packing density. ACS Nano 5:4818–4825. https://doi.org/10.1021/nn200847uCrossRef

Marconnet AM, Panzer MA, Goodson KE (2013) Thermal conduction phenomena in carbon nanotubes and related nanostructured materials. Rev Mod Phys 85:1295–1326. https://doi.org/10.1103/RevModPhys.85.1295CrossRef

Mateeva N, Niculescu H, Schlenoff J, Testardi LR (1998) Correlation of Seebeck coefficient and electric conductivity in polyaniline and polypyrrole. http://oasc12039247realmedia.com/RealMedia/ads/click_lx.ads/www.aip.org/pt/adcenter/pdfcover_test/L-37/1952595056/x01/AIP-PT/JAP_ArticleDL_0117/AIP-2968_JAP_1640x440r2.jpg/434f71374e315a556e61414141774c75?x. https://doi.org/10.1063/1.367119

McGrail BT, Sehirlioglu A, Pentzer E (2015) Polymer composites for thermoelectric applications. Angew Chem Int Ed 54:1710–1723. https://doi.org/10.1002/anie.201408431CrossRef

McNamara AJ, Joshi Y, Zhang ZM (2012) Characterization of nanostructured thermal interface materials – a review. Int J Therm Sci 62:2–11. https://doi.org/10.1016/j.ijthermalsci.2011.10.014CrossRef

Miljkovic N, Enright R, Nam Y et al (2013a) Jumping-droplet-enhanced condensation on scalable superhydrophobic nanostructured surfaces. Nano Lett 13:179–187. https://doi.org/10.1021/nl303835dCrossRef

Miljkovic N, Preston DJ, Enright R, Wang EN (2013b) Electric-field-enhanced condensation on superhydrophobic nanostructured surfaces. ACS Nano 7:11043–11054. https://doi.org/10.1021/nn404707jCrossRef

Minnich AJ, Dresselhaus MS, Ren ZF, Chen G (2009) Bulk nanostructured thermoelectric materials: current research and future prospects. Energy Environ Sci 2:466. https://doi.org/10.1039/b822664bCrossRef

Moriarty GP, De S, King PJ et al (2013) Thermoelectric behavior of organic thin film nanocomposites. J Polym Sci Part B Polym Phys 51:119–123. https://doi.org/10.1002/polb.23186CrossRef

Murray BJ, O’Sullivan D, Atkinson JD, Webb ME (2012) Ice nucleation by particles immersed in supercooled cloud droplets. Chem Soc Rev 41:6519. https://doi.org/10.1039/c2cs35200aCrossRef

Narhe RD, Beysens DA (2004) Nucleation and growth on a superhydrophobic grooved surface. Phys Rev Lett 93:76103. https://doi.org/10.1103/PhysRevLett.93.076103CrossRef

Nath S, Ahmadi SF, Boreyko JB (2016) A review of condensation frosting. Nanoscale Microscale Thermophys Eng:1–21. https://doi.org/10.1080/15567265.2016.1256007

Oksman P, Yu S, Kytonen H et al (2014) The effective thermal conductivity method in continuous casting of steel. Acta Polytech Hung 11:5–22

Pan Y, Hong G, Raja SN et al (2015) Significant thermal conductivity reduction of silicon nanowire forests through discrete surface doping of germanium. Appl Phys Lett 106:93102. https://doi.org/10.1063/1.4913879CrossRef

Pan Y, Tao Y, Qin G et al (2016) Surface chemical tuning of phonon and electron transport in free-standing silicon nanowire arrays. Nano Lett 16:6364–6370. https://doi.org/10.1021/acs.nanolett.6b02754CrossRef

Panigrahi PK (2015) Microscale convection. In: Transport phenomena in microfluidic systems. Wiley, Singapore, pp 331–374CrossRef

Paulo J, Gaspar P (2010) Review and future trend of energy harvesting methods for portable medical devices. In: Proceedings of the world congress on engineering, London

Paxson AT, Yagüe JL, Gleason KK, Varanasi KK (2014) Stable dropwise condensation for enhancing heat transfer via the initiated chemical vapor deposition (iCVD) of grafted polymer films. Adv Mater 26:418–423. https://doi.org/10.1002/adma.201303065CrossRef

Pearson JR (1985) Mechanics of polymer processing. p. XVI, 712. Springer, Netherlands

Peng B, Ma X, Lan Z et al (2015) Experimental investigation on steam condensation heat transfer enhancement with vertically patterned hydrophobic–hydrophilic hybrid surfaces. Int J Heat Mass Transf 83:27–38. https://doi.org/10.1016/j.ijheatmasstransfer.2014.11.069CrossRef

Perez-Taborda JA, Rojo MM, Maiz J et al (2016) Ultra-low thermal conductivities in large-area Si-Ge nanomeshes for thermoelectric applications. https://doi.org/10.1038/srep32778

Pokatilov EP, Nika DL, Balandin AA (2005) Acoustic-phonon propagation in rectangular semiconductor nanowires with elastically dissimilar barriers. Phys Rev B 72:113311. https://doi.org/10.1103/PhysRevB.72.113311CrossRef

Poudel B, Hao Q, Ma Y et al (2008) High-thermoelectric performance of nanostructured bismuth antimony telluride bulk alloys.

Preston DJ, Mafra DL, Miljkovic N et al (2015) Scalable graphene coatings for enhanced condensation heat transfer. Nano Lett 15:2902–2909. https://doi.org/10.1021/nl504628sCrossRef

Qu W, Mudawar I (2003) Flow boiling heat transfer in two-phase micro-channel heat sinks––I. Experimental investigation and assessment of correlation methods. Int J Heat Mass Transf 46:2755–2771. https://doi.org/10.1016/S0017-9310(03)00041-3CrossRef

Renfer A, Tiwari MK, Brunschwiler T et al (2011) Experimental investigation into vortex structure and pressure drop across microcavities in 3D integrated electronics. Exp Fluids 51:731–741. https://doi.org/10.1007/s00348-011-1091-5CrossRef

Renfer A, Tiwari MK, Tiwari R et al (2013) Microvortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks. Int J Heat Mass Transf 65:33–43. https://doi.org/10.1016/j.ijheatmasstransfer.2013.05.066CrossRef

Rice JA, Faghri A (2007) Analysis of screen wick heat pipes, including capillary dry-out limitations. J Thermophys Heat Transf 21:475–486. https://doi.org/10.2514/1.24809CrossRef

Rose JW (1997) Dropwise condensation theory and experiment: a review. J Eng Thermophys 18:196–200

Rowe DM, Shukla VS, Savvides N (1981) Phonon scattering at grain boundaries in heavily doped fine-grained silicon–germanium alloys. Nature 290:765–766. https://doi.org/10.1038/290765a0CrossRef

Schutzius TM, Jung S, Maitra T et al (2014) Physics of icing and rational design of surfaces with extraordinary icephobicity. Langmuir 31:4807–4821. https://doi.org/10.1021/la502586aCrossRef

Semenic T, Lin YY, Catton I, Sarraf DB (2008) Use of biporous wicks to remove high heat fluxes. Appl Therm Eng 28:278–283. https://doi.org/10.1016/j.applthermaleng.2006.02.030CrossRef

Shahil KMF, Balandin AA (2011) Graphene-based thermal interface materials. 2011 11th IEEE International Conference Nanotechnol:1193–1196. https://doi.org/10.1109/NANO.2011.6144476

Shahil KMF, Balandin AA (2012a) Graphene-multilayer graphene nanocomposites as highly efficient thermal interface materials. Nano Lett 12:861–867. https://doi.org/10.1021/nl203906rCrossRef

Shahil KMF, Balandin AA (2012b) Thermal properties of graphene and multilayer graphene: applications in thermal interface materials. Solid State Commun 152:1331–1340. https://doi.org/10.1016/j.ssc.2012.04.034CrossRef

Sharma CS, Tiwari MK, Michel B, Poulikakos D (2013) Thermofluidics and energetics of a manifold microchannel heat sink for electronics with recovered hot water as working fluid. Int J Heat Mass Transf 58:135–151. https://doi.org/10.1016/j.ijheatmasstransfer.2012.11.012CrossRef

Sharma CS, Schlottig G, Brunschwiler T et al (2015a) A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: an experimental study. Int J Heat Mass Transf 88:684–694. https://doi.org/10.1016/j.ijheatmasstransfer.2015.04.047CrossRef

Sharma CS, Tiwari MK, Zimmermann S et al (2015b) Energy efficient hotspot-targeted embedded liquid cooling of electronics. Appl Energy 138:414–422. https://doi.org/10.1016/j.apenergy.2014.10.068CrossRef

Sootsman JR, Chung DY, Kanatzidis MG (2009) New and old concepts in thermoelectric materials. Angew Chem Int Ed 48:8616–8639. https://doi.org/10.1002/anie.200900598CrossRef

Sun Z, James DK, Tour JM (2011) Graphene chemistry: synthesis and manipulation. J Phys Chem Lett 2:2425–2432. https://doi.org/10.1021/jz201000aCrossRef

Takata Y, Hidaka S, Cao JM et al (2005) Effect of surface wettability on boiling and evaporation. Energy 30:209–220. https://doi.org/10.1016/j.energy.2004.05.004CrossRef

Theofanous TG, Dinh TN, Tu JP, Dinh AT (2002) The boiling crisis phenomenon: Part II: dryout dynamics and burnout. Exp Thermal Fluid Sci 26:793–810. https://doi.org/10.1016/S0894-1777(02)00193-0CrossRef

Tiwari MK, Zimmermann S, Sharma CS et al (2012) Waste heat recovery in supercomputers and 3D integrated liquid cooled electronics. In: 13th intersociety conference on thermal and thermomechanical phenomena in electronic systems. IEEE, pp 545–551

Torresin D, Tiwari MK, Del Col D, Poulikakos D (2013) Flow condensation on copper-based nanotextured superhydrophobic surfaces. Langmuir 29:840–848. https://doi.org/10.1021/la304389sCrossRef

Tourkine P, Le Merrer M, Quéré D (2009) Delayed freezing on water repellent materials. Langmuir 25:7214–7216. https://doi.org/10.1021/la900929uCrossRef

Tuckerman DB, Pease RFW (1981) High-performance heat sinking for VLSI. IEEE Electron Device Lett 2:126–129. https://doi.org/10.1109/EDL.1981.25367CrossRef

Vashaee D, Shakouri A (2007) Thermionic power generation at high temperatures using SiGe∕Si superlattices. J Appl Phys 101:53719. https://doi.org/10.1063/1.2645607CrossRef

Venkatasubramanian R, Siivola E, Colpitts T, O’Quinn B (2001) Thin-film thermoelectric devices with high room-temperature figures of merit. Nature 413:597–602. https://doi.org/10.1038/35098012CrossRef

Vineis CJ, Shakouri A, Majumdar A, Kanatzidis MG (2010) Nanostructured thermoelectrics: big efficiency gains from small features. Adv Mater 22:3970–3980. https://doi.org/10.1002/adma.201000839CrossRef

Wang C-C, Chi-Chuan (2017) A quick overview of compact air-cooled heat sinks applicable for electronic cooling—recent progress. Inventions 2:5. https://doi.org/10.3390/inventions2010005CrossRef

Wang G, Cheng P, Wu H (2007) Unstable and stable flow boiling in parallel microchannels and in a single microchannel. Int J Heat Mass Transf 50:4297–4310. https://doi.org/10.1016/j.ijheatmasstransfer.2007.01.033CrossRefMATH

Weibel JA, Garimella S V, North MT et al (2010) Purdue e-pubs characterization of evaporation and boiling from sintered powder wicks fed by capillary action characterization of evaporation and boiling from sintered powder wicks fed by capillary action. https://doi.org/10.1016/j.ijheatmasstransfer.2010.05.043

Yao Z, Lu Y-W, Kandlikar SG (2011) Effects of nanowire height on pool boiling performance of water on silicon chips. Int J Therm Sci 50:2084–2090. https://doi.org/10.1016/j.ijthermalsci.2011.06.009CrossRef

Yazicioglu AG, Kakaç S (2010) Convective heat transfer in microscale slip flow. In: Microfluidics based microsystems. Springer, Dordrecht, pp 15–38CrossRef

Yoon CO, Reghu M, Moses D et al (1995) Transports in blends of conducting polymers. Synth Met 69:255–258. https://doi.org/10.1016/0379-6779(94)02439-6CrossRef

Ziman JM (2001) Electrons and phonons: the theory of transport phenomena in solids. Oxford University Press, New YorkCrossRef

Zimmermann S, Meijer I, Tiwari MK et al (2012a) Aquasar: a hot water cooled data center with direct energy reuse. Energy 43:237–245. https://doi.org/10.1016/j.energy.2012.04.037CrossRef

Zimmermann S, Tiwari MK, Meijer I et al (2012b) Hot water cooled electronics: exergy analysis and waste heat reuse feasibility. Int J Heat Mass Transf 55:6391–6399. https://doi.org/10.1016/j.ijheatmasstransfer.2012.06.027CrossRef

Zimmermann S, Helmers H, Tiwari MK et al (2015) A high-efficiency hybrid high-concentration photovoltaic system. Int J Heat Mass Transf 89:514–521. https://doi.org/10.1016/j.ijheatmasstransfer.2015.04.068CrossRef

Titel: Thermal Transport in Micro- and Nanoscale Systems
verfasst von: Tanmoy Maitra
Shigang Zhang
Manish K. Tiwari
Verlag: Springer International Publishing
Buch: Handbook of Thermal Science and Engineering
Print ISBN: 978-3-319-26694-7

Electronic ISBN: 978-3-319-26695-4

Copyright-Jahr: 2018
DOI: https://doi.org/10.1007/978-3-319-26695-4_1

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